Secure digital memory card using land grid array structure

• US 7,112,875 B1
• Filed: 02/17/2005
• Issued: 09/26/2006
• Est. Priority Date: 02/17/2005
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Bancod, Ludovico E., Miks, Jeffrey Alan
• Primary Examiner(s): Tran, Minhloan
• Assistant Examiner(s): Cruz, Leslie Pilar
• Application Number:
  US11/060,264
• Time in Patent Office: 586 Days
• Field of Search: 257/679
• US Class Current: 257/679
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A memory card comprising a substrate which has a plurality of contacts, at least one die pad, and a plurality of traces. The contacts, the die pad and the traces are disposed in spaced relation to each other and each define opposed first and second surfaces. Mounted to the first surface of the die pad is at least one electronic component which is electrically connected to at least one of the contacts either directly or via one or more of the traces. A first encapsulation part covers the second surfaces of the die pad and the traces, with the second surfaces of the contacts being exposed in the first encapsulation part. A second encapsulation part covers the electronic component and the first surfaces of the die pad, the contacts, and the traces. The first and second encapsulation parts collectively define a body of the memory card which includes a bottom surface having the second surfaces of the contacts exposed therein.

Claims

1. A memory card, comprising:

a substrate having a plurality of contacts, at least one die pad, and a plurality of traces, the contacts, the die pad and the traces being disposed in spaced relation to each other and each defining opposed first and second surfaces, the first surfaces of the contacts, the die pad, and the traces extending in generally coplanar relation to each other, with the second surfaces of the die pad and the traces extending along a first plane, and the second surfaces of the contacts extending along a second plane which is spaced from and generally parallel to the first plane;

at least one electronic component mounted to the first surface of the die pad and electrically connected to at least one of the contacts;

a first encapsulation part covering the second surfaces of the die pad and the traces, the second surfaces of the contacts being exposed in the first encapsulation part; and

a second encapsulation part covering the electronic component and the first surfaces of the die pad, the contacts, and the traces;

the first and second encapsulation parts collectively defining a body of the memory card which includes a bottom surface having the second surfaces of the contacts exposed therein.

2. The memory card of claim 1 wherein:

the substrate has at least two die pads which each include at least one electronic component mounted to the first surface thereof; and

each of the electronic components is electrically connected to at least one of the contacts either directly or via at least one of the traces.

3. The memory card of claim 2 wherein the electronic components are selected from the group consisting of:

a semiconductor package;

a semiconductor die;

a passive component; and

combinations thereof.

4. The memory card of claim 1 wherein the electronic component is electrically connected to at least one of the contacts by a conductive wire which is covered by the second encapsulation part.

5. The memory card of claim 1 wherein:

the first encapsulation part defines multiple side surfaces; and

the second encapsulation part defines multiple side surfaces which are substantially continuous with respective ones of the side surfaces of the first encapsulation part.

6. The memory card of claim 1 wherein the first encapsulation part and the second encapsulation part are each fabricated from an epoxy mold compound.

7. The memory card of claim 1 wherein the memory card is a secure digital card.

8. A memory card, comprising:

a substrate having a plurality of contacts, at least one die pad, and a plurality of traces, the contacts, the die pad and the traces being disposed in spaced relation to each other and each defining opposed first and second surfaces;

at least one electronic component mounted to the first surface of the die pad and electrically connected to at least one of the contacts;

a first encapsulation part covering the second surfaces of the die pad and the traces, the second surfaces of the contacts being exposed in the first encapsulation part; and

a second encapsulation part covering the electronic component and the first surfaces of the die pad, the contacts, and the traces;

the first and second encapsulation parts collectively defining a body of the memory card which includes a bottom surface having the second surfaces of the contacts exposed therein;

wherein the first and second surfaces of the contacts, the die pad and the traces each include a plating layer disposed thereon, the plating layer disposed on the second surface of each of the contacts being exposed in the bottom surface of the body.

9. A memory card, comprising:

a substrate having a plurality of contacts, at least one die pad, and a plurality of traces, the contacts, the die pad and the traces being disposed in spaced relation to each other and each defining opposed first and second surfaces;

at least one electronic component mounted to the first surface of the die pad and electrically connected to at least one of the contacts;

a first encapsulation part covering the electronic component and the first surfaces of the die pad, the contacts, and the traces; and

a second encapsulation part covering the second surfaces of the die pad and the traces, the second surfaces of the contacts being exposed in the first encapsulation part and not covered by the second encapsulation part;

the first and second encapsulation parts collectively defining a body of the memory card.

10. The memory card of claim 9 wherein the first and second surfaces of the contacts, the die pad and the traces each include a plating layer disposed thereon, the plating layer disposed on the second surface of each of the contacts being exposed in the body.

11. The memory card of claim 9 wherein:

the substrate has at least two die pads which each include at least one electronic component mounted to the first surface thereof; and

each of the electronic components is electrically connected to at least one of the contacts either directly or via at least one of the traces.

12. The memory card of claim 11 wherein the electronic components are selected from the group consisting of:

a semiconductor package;

a semiconductor die;

a passive component; and

combinations thereof.

13. The memory card of claim 9 wherein the electronic component is electrically connected to at least one of the contacts by a conductive wire which is covered by the first encapsulation part.

14. The memory card of claim 9 wherein:

the first encapsulation part defines multiple side surfaces; and

the second encapsulation part defines multiple side surfaces, at least some of the side surfaces of the second encapsulation part being substantially continuous with respective ones of the side surfaces of the first encapsulation part.

15. The memory card of claim 9 wherein the first encapsulation part and the second encapsulation part are each fabricated from an epoxy mold compound.

16. The memory card of claim 9 wherein the first surfaces of the contacts, the die pad, and the traces extend in generally coplanar relation to each other.

17. The memory card of claim 16 wherein the second surfaces of the contacts, the die pad, and the traces extend in generally coplanar relation to each other.

18. The memory card of claim 9 wherein the memory card is a secure digital card.

19. A memory card, comprising:

a substrate having a plurality of contacts, at least one die pad, and a plurality of traces, the contacts, the die pad and the traces being disposed in spaced relation to each other and each defining opposed first and second surfaces, the second surfaces of the die pad and the traces extending along a first plane, and the second surfaces of the contacts extending along a second plane which is spaced from and generally parallel to the first plane;

at least one electronic component mounted to the first surface of the die pad and electrically connected to at least one of the contacts;

a first encapsulation part covering the second surfaces of the die pad and the traces, the second surfaces of the contacts being exposed in the first encapsulation part; and

a second encapsulation part covering the electronic component and the first surfaces of the die pad, the contacts, and the traces;

the first and second encapsulation parts collectively defining a body of the memory card which includes a bottom surface having the second surfaces of the contacts exposed therein.

20. The memory card of claim 19 wherein:

the first encapsulation part defines multiple side surfaces; and

the second encapsulation part defines multiple side surfaces which are substantially continuous with respective ones of the side surface of the first encapsulation part.