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Inspection system, inspection method, and method for manufacturing semiconductor device

  • US 7,112,952 B2
  • Filed: 01/27/2005
  • Issued: 09/26/2006
  • Est. Priority Date: 01/30/2004
  • Status: Expired due to Fees
First Claim
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1. A method for manufacturing a semiconductor device comprising:

  • forming a plurality of TFTs over a substrate;

    forming an antenna in an upper portion of the TFT;

    forming an interlayer insulating film over the antenna;

    forming a plurality of chips by forming a protective layer over the interlayer insulating film to cover the antenna;

    supplying a signal or power supply voltage to each of the plurality of chips without contact with each antenna of the plurality of chips;

    moving an inspection electrode with an arbitrary portion of the antenna or the whole antenna of each of the plurality of chips overlapped with the inspection electrode with a space therebetween;

    conducting an inspection for grasping an operating state of each of the plurality of chips from a voltage of the inspection electrode and a position of the inspection electrode to the plurality of chips;

    separating the substrate of the chips that have been inspected from the TFT and an antenna; and

    attaching the TFT and the antenna that have been separated to a support medium.

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