Proble for testing integrated circuits

• US 7,112,974 B1
• Filed: 05/23/2002
• Issued: 09/26/2006
• Est. Priority Date: 05/23/2002
• Status: Expired due to Fees

• Current Assignee: Monterey Research, LLC (Vector Capital Corporation)
• Original Assignee: Cypress Semiconductor Corporation (Infineon Technologies AG)
• Inventors: Jin, Bo, Gu, Qi
• Primary Examiner(s): Hollington, Jermele
• Assistant Examiner(s): Nguyen, Tung X.
• Application Number:
  US10/154,089
• Time in Patent Office: 1,587 Days
• Field of Search: 324/754, 324760-762, 324/765, 324/158.1, 324/764, 438/14
• US Class Current: 324/754.14
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/06716 Elastic
• CPC Class Codes: G01R 1/06738 related to tip portion

Abstract

In one embodiment, a probe for testing integrated circuits includes a body having a tip and a hardening material on the tip. The hardening material helps improve the hardness of the tip. The hardening material thus allows the probe to reliably penetrate a layer to make a good electrical connection with a contact point under the layer, for example. In one embodiment, an electrically conductive coating is deposited over the hardening material.

Claims

1. A probe for testing an integrated circuit, the probe comprising:

a body having a tip, the body being mounted in a hole of a probe card;

a spring attached to the body, the spring being configured to allow the body to move into the hole of the probe card such that the tip travels in a substantially vertical direction with respect to a layer of an integrated circuit;

a hardening material formed on the tip, the hardening material being configured to allow the tip to penetrate all the way through the layer of the integrated circuit to make an electrical connection to a point under the layer, the hardening material being harder than the body;

an electrically conductive coating formed over and past the hardening material.

2. The probe of claim 1 wherein the hardening material comprises diamond dust.

3. The probe of claim 1 wherein the body is part of a pogo-type probe.

4. The probe of claim 1 wherein the body is of a material that comprises copper.

5. A method of testing an integrated circuit, the method comprising:

touching a layer with a hardened component of a probe;

pushing the probe such that a tip of the probe penetrates all the way through the layer at an angle substantially perpendicular to a contact point under the layer; and

making an electrical connection between the probe and the contact point;

wherein the hardened component comprises;

(a) a hardening material formed on a tip of the probe, the hardening material being harder than the tip; and

(b) an electrically conductive material formed over and past the hardening material.

6. The method of claim 5 wherein the hardening material comprises diamond dust.

7. The method of claim 5 wherein the electrically conductive coating comprises nickel.

8. The method of claim 5 wherein the probe is a pogo-type probe.

9. The method of claim 5 wherein the layer comprises an oxide layer.

10. The method of claim 5 wherein the contact point comprises a metal pad.

11. A probe for testing integrated circuits, the probe comprising:

means for retracting a body of a probe in a substantially vertical direction with respect to a layer of an integrated circuit;

means for penetrating through the layer of the integrated circuit; and

means for contacting a metal pad under the layer, the means for contacting the metal pad comprising a hardening material on the body of the probe and a conductive coating formed over and past the hardening material, the hardening material being harder than the body of the probe.

12. The probe of claim 11 wherein the means for retracting comprises a spring.

13. The probe of claim 11 wherein the hardening material comprises diamond dust.

14. The probe of claim 11 wherein the body of the probe is of a material that comprises copper.