Method of producing of circuit board; for semiconductor device
First Claim
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1. A method of production of a circuit board, including:
- forming a plurality of holes in a first surface of a substrate;
forming a plating power supply layer on the first surface, a second surface and sides of the substrate, and inner surfaces of the holes by electroless plating;
forming a metal layer formed on the first surface, the second surface and sides of the substrate and burying the holes, by electroplating through the plating power supply layer; and
polishing the metal layer to form interconnect patterns comprised of the metal layer buried in the holes.
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Abstract
A method of production of a circuit board able to prevent peeling of a conductive layer during polishing of the conductive layer including the steps of forming at least holes in one surface of a substrate; forming a plating power supply layer on the one surface of the substrate, the other surface, the sides, and inner surfaces of the holes; forming a metal layer formed on the one surface of the substrate, the other surface, and the sides and burying the holes by electroplating through the plating power supply layer; and polishing the metal layer to form interconnect patterns comprised of the metal layer buried in the holes.
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Citations
7 Claims
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1. A method of production of a circuit board, including:
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forming a plurality of holes in a first surface of a substrate; forming a plating power supply layer on the first surface, a second surface and sides of the substrate, and inner surfaces of the holes by electroless plating; forming a metal layer formed on the first surface, the second surface and sides of the substrate and burying the holes, by electroplating through the plating power supply layer; and polishing the metal layer to form interconnect patterns comprised of the metal layer buried in the holes. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification