Mounting arrangement for light emitting diodes

• US 7,114,831 B2
• Filed: 02/27/2004
• Issued: 10/03/2006
• Est. Priority Date: 10/19/1999
• Status: Expired due to Fees

• Current Assignee: Permlight Products Inc
• Original Assignee: Permlight Products Inc
• Inventors: Honegger, Gregory W., Popovich, John
• Primary Examiner(s): Tso, Laura K.
• Application Number:
  US10/789,357
• Publication Number:
  US 20040257815A1
• Time in Patent Office: 949 Days
• Field of Search: 362/294, 362/373, 362/800, 362/547
• US Class Current: 362/294
• CPC Class Codes: A47C 7/725 for illumination, e.g. lamps
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21K 9/60 Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21V 19/001 the light sources being semiconductors devices, e.g. LEDs
• CPC Class Codes: F21V 29/507 of means for protecting lighting devices from damage, e.g. housings
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21V 7/0025 Combination of two or more reflectors for a single light source array of reflectors for a cluster of light sources F21V7/0083
• CPC Class Codes: F21V 7/005 with an elongated shape to cooperate with linear light sources
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G09F 13/22 electroluminescent electroluminescent light sources per se H05B33/00
• CPC Class Codes: G09F 9/33 being semiconductor devices, e.g. diodes
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10446 Mounted on an edge
• CPC Class Codes: H05K 2201/10598 Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/32 : electrically connecting electric components or wires to printed circuits
• CPC Class Codes: Y10S 362/80 : Light emitting diode
• CPC Class Codes: Y10T 29/49133 : with component orienting
• CPC Class Codes: Y10T 29/49826 : Assembling or joining

Abstract

A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. The LED modules can be used in a variety of illumination applications employing one or more modules.

Claims

1. An illumination module, comprising:

a dielectric layer having first and second sides;

a light emitting diode (LED);

a plurality of electrically-conductive contacts on the first side of the dielectric layer, the plurality of contacts being configured to mount the LED such that the LED is electrically connected to the contacts;

a heat conductive body on the second side of the dielectric layer;

a heat conductive tab comprising a heat conductive surface in communication with the heat conductive body, the heat conductive surface having a surface area substantially greater than a surface area of the heat conductive body;

wherein heat from the LED is communicated through the contacts, dielectric layer, and heat conductive body to the heat conductive surface.

2. The illumination module of claim 1, wherein the heat conductive tab behaves as a heat sink.

3. The illumination module of claim 2, wherein the heat conductive body has a first side and a second side, the first side communicating with the second side of the dielectric layer, and the heat conductive surface is substantially complementary to the second side of the heat conductive body.

4. The illumination module of claim 3, wherein the dielectric member is substantially planar.

5. The illumination module of claim 3, wherein the heat conductive surface is significantly larger than the second side of the heat conductive body.

6. The illumination module of claim 5, wherein substantially the entire second side of the body communicates with the heat conductive surface.

7. The illumination module of claim 6, wherein the tab is angled relative to an adjacent portion of the heat conductive body.

8. The illumination module of claim 3, wherein the heat conductive surface has a thermal conductivity greater than about 100 W/mK.

9. The illumination module of claim 8, wherein the heat conductive surface comprises a metal.

10. The illumination module of claim 9, wherein the heat conductive surface comprises aluminum.

11. The illumination module of claim 8, wherein the body has a thermal conductivity greater than about 100 W/mK.

12. The illumination module of claim 8, wherein the heat conductive surface is substantially rigid.

13. The illumination module of claim 3, wherein the body is connected to the heat conductive surface so that heat flows from substantially the entire second side of the body to the heat conductive surface.

14. The illumination module of claim 13, wherein the second side of the body is attached substantially flush to the heat conductive surface by an adhesive.

15. The illumination module of claim 1, wherein heat is dissipated from the heat conductive surface to the surrounding environment.

16. The illumination module of claim 1, wherein the heat conductive body is generally flat.

17. The illumination module of claim 16, wherein the contacts are substantially flat and coplanar relative to each other.

18. The illumination module of claim 17, wherein the body is substantially parallel to the contacts.

19. The illumination module of claim 1, wherein each of the LEDs comprises a lead, and the leads are configured to be mounted to respective contacts.

20. A method of making an illuminated display, comprising:

providing a housing having at least one wall surface;

providing a plurality of the illumination modules of claim 1; and

mounting the plurality of illumination modules onto the at least one wall surface.

21. The method of claim 20 additionally comprising mounting an illumination module so that at least a portion of the heat conductive tab is not in contact with the housing wall surface.

22. An illumination apparatus, comprising:

a housing;

a heat conductive tab comprising a heat conductive surface arranged in an interior of the housing; and

an illumination module mounted on the heat conductive surface, the illumination module comprising;

a dielectric having a first side and a second side;

a light emitting diode (LED);

a plurality of electrically conductive contacts on the first side of the dielectric, the plurality of contacts being configured to mount a lead of the LED such that the LED is electrically connected to the contacts; and

a heat conductive body on the second side of the dielectric;

wherein heat from the LED flows through the contacts and dielectric to the heat conductive body, and from the body to the heat conductive surface.

23. The apparatus of claim 22, wherein the contacts communicate heat to the heat conductive body through a first thermal engagement area, and an engagement surface of the body communicates heat to the heat conductive surface through a second thermal engagement area that is larger than the first thermal engagement area, and the heat conductive surface is significantly larger than the engagement surface of the heat conductive body.

24. The apparatus of claim 23, wherein the heat conductive body contacts the heat conductive surface.

25. The apparatus of claim 23, wherein the engagement surface of the heat conductive body is connected to the heat conductive surface via an adhesive.

26. The apparatus of claim 25, wherein substantially the entire engagement surface engages the heat conductive surface so that the second thermal engagement area is substantially the same as the engagement surface area.

27. The apparatus of claim 22, wherein the heat conductive body is substantially flat.

28. The apparatus of claim 22, wherein the heat conductive tab is larger than the heat conductive body.

29. The apparatus of claim 28, wherein the housing comprises a wall surface, and the heat conductive surface is attached to the wall surface.

30. The apparatus of claim 29, wherein the heat conductive tab is disposed at an angle relative to the housing wall surface.

31. The apparatus of claim 28, wherein the heat conductive surface is substantially flat.

32. The apparatus of claim 28, wherein the heat conductive tab comprises a material having a thermal conductivity greater than about 100 W/mK.

33. The apparatus of claim 22, wherein the housing comprises a wall surface, and at least a portion of the heat conductive surface is spaced from the wall surface.

34. The apparatus of claim 33, wherein the heat conductive surface is configured to draw LED-generated heat from the module for dissipation in the housing.

35. An illumination apparatus, comprising:

a housing comprising a plurality of wall surfaces that define a channel;

a heat conductive surface arranged in an interior of the housing; and

an illumination module mounted on the heat conductive surface, the illumination module comprising;

a dielectric having a first side and a second side;

a light emitting diode (LED);

a plurality of electrically conductive contacts on the first side of the dielectric, each of the plurality of contacts being configured to mount a lead of the LED such that the LED is electrically connected to the contacts; and

a heat conductive body on the second side of the dielectric;

wherein heat from the LED flows through the contacts and dielectric to the heat conductive body, and from the body to the heat conductive surface.

36. The apparatus of claim 35, wherein a translucent cover extends over the channel.

37. The apparatus of claim 36, wherein heat from the LED is drawn to the heat conductive surface and dissipated from the surface into the channel.

38. The apparatus of claim 35 additionally comprising a heat sink within the housing, and the heat conductive surface is integrally formed with the heat sink.

39. The apparatus of claim 38, wherein the heat conductive surface is generally flat, and at least a portion of the heat sink extends at an angle relative to the heat conductive surface.

40. An illumination apparatus, comprising:

a heat conductive body having a first side and a second side;

a thin dielectric portion on a first side of the heat conductive body;

a plurality of light emitting diodes (LEDs); and

a plurality of electrically-conductive contacts on a first side of the dielectric portion, the LEDs being mounted to the contacts such that the LEDs are electrically connected to one another, the contacts thermally communicating with the dielectric portion through a first thermal communication area between the contacts and the first side of the dielectric portion;

wherein a second side of the dielectric portion is arranged on the first side of the heat conductive body so that the first side of the body is in thermal communication with the contacts through the dielectric portion;

wherein the first side of the body has a surface area larger than the thermal communication area;

a heat conducting surface;

wherein the second side of the body has a surface generally complementary to the heat conducting surface, and the second side of the body thermally communicates with the heat conducting surface through a second thermal communication area between the body and the heat conducting surface; and

wherein the second thermal communication area has a greater area than the first thermal communication area;

whereby heat is thermally conducted from the LEDs to the heat conducting surface.

41. The illumination apparatus of claim 40, wherein the second side of the body has a generally flat surface.

42. The illumination apparatus of claim 41, wherein the contacts are substantially flat and coplanar relative to each other.

43. The illumination apparatus of claim 42, wherein a first side of the body is substantially flat and parallel to the contacts.

44. The illumination apparatus of claim 43, wherein the dielectric portion is substantially flat.

45. The illumination apparatus of claim 40, wherein the heat conductive body has a thermal conductivity greater than about 100 W/mK.

46. The illumination apparatus of claim 40, wherein the heat conductive surface has a thermal conductivity greater than about 100 W/mK.

47. An illumination module for mounting on a heat conducting surface that is larger than the module, the module comprising:

a heat conductive body having a first side and a second side;

a thin dielectric portion on a first side of the heat conductive body;

a plurality of light emitting diodes (LEDs); and

a plurality of electrically-conductive contacts on a first side of the dielectric portion, the LEDs being mounted to the contacts such that the LEDs are electrically connected to one another, the contacts thermally communicating with the dielectric portion through a thermal communication area between the contacts and the first side of the dielectric portion; and

wherein a second side of the dielectric portion is arranged on the first side of the heat conductive body so that the first side of the body is in thermal communication with the contacts through the dielectric portion; and

wherein the first side of the body has a surface area larger than the thermal communication area, and the second side of the body has a surface generally complementary to the heat conducting surface to provide thermally conductive contact with the heat conducting surface;

whereby heat is thermally conducted from the LEDs to the heat conducting surface; and

additionally comprising a heat conductive tab that comprises the heat conductive surface.

48. The illumination module of claim 47, wherein the heat conductive tab is larger than the heat conductive body.

49. An illumination device, comprising:

a light emitting diode (LED) module in combination with a heat sink member, the LED module attached to the heat sink member, the LED module comprising;

at least one LED;

a dielectric layer having first and second sides;

plural electrically-conductive contacts on the first side of the dielectric layer, the contacts being configured to mount the at least one LED such that the at least one LED is electrically connected to the contacts; and

a heat conductive body having a first and second face, the first face being on the second side of the dielectric layer, the body being in thermal communication with the plural contacts through the dielectric layer, the first face having a surface area at least the same as an aggregate surface area of one side of the contacts;

wherein the second face of the heat conductive body is attached to the heat sink member so that heat flows from the body to the heat sink member, at least an engagement portion of the second face from the body to the heat sink member, the engagement portion having a surface area at least the same as the aggregate surface area of one side of the contact;

wherein the heat sink member has a surface area greater than a surface area of the heat conductive body.

50. An illumination device as in claim 49, wherein the heat sink member has a mount portion configured to accept the LED module, and the LED module is attached to the mount portion.

51. An illumination device as in claim 50, wherein the mount portion is integrally formed with the heat sink member.

52. An illumination device as in claim 51, wherein the mount portion is disposed at an angle relative to an adjacent portion of the heat sink member.

53. An illumination device as in claim 51, wherein the LED module is fastened to the mount portion using rivets.

54. An illumination device as in claim 51, wherein the LED module is fastened to the mount portion by an adhesive.

55. An illumination device as in claim 54, wherein the adhesive comprises a heat conductive adhesive.

56. An illumination device as in claim 54, wherein the heat conductive body comprises a flat aluminum plate.

57. An illumination device as in claim 56, wherein substantially the entire second face of the body portion is connected to the mount portion.

58. An illuminated display apparatus, comprising:

a plurality of the illumination devices recited in claim 49 electrically connected to one another in an electrically parallel arrangement; and

a display member having a wall surface;

wherein at least one of the plurality of illumination devices is arranged on the wall surface.

59. An illumination display apparatus as in claim 58, comprising a pair of electrical supply wires, wherein each of the plurality of illumination devices is electrically connected to the pair of electrical supply wires.

60. An illumination display apparatus as claim 59, wherein the illumination devices employ insulation displacement connectors to electrically connect to the pair of electrical supply wires.

61. An illuminated display apparatus as in claim 58, wherein the display member comprises a channel defined by a plurality of walls, and the illumination devices are disposed within the channel.

62. An illuminated display apparatus as in claim 58, wherein the wall surface is configured to function as a heat sink.

63. An illumination apparatus, comprising:

an illumination device as recited in claim 49; and

a housing, the housing having a light outlet aperture and being attached to the heat sink member so as to generally enclose the LED module;

wherein the apparatus is adapted so that light from the LED module is directed out of the housing aperture.

64. An illumination apparatus as in claim 63 additionally comprising an optical element for directing light from the LED module in a desired direction.

65. An illumination apparatus as in claim 64, comprising a lens.

66. An illumination apparatus as in claim 64, comprising at least one reflector.

67. An illumination apparatus, comprising:

a substantially enclosed housing comprising a housing wall and a light-transmissive portion;

a heat sink having a mount portion, the mount portion disposed within the enclosed housing;

a lighting module comprising;

a light emitting diode (LED);

a dielectric having first and second sides;

plural electrically-conductive contacts on the first side of the dielectric, the contacts being configured to mount the LED so that the LED is electrically connected to the contacts; and

a heat conductive body on the second side of the dielectric, the heat conductive body having opposing first and second faces, the first face being connected to the dielectric;

wherein the heat conductive body second face is attached to the heat sink mount portion so that heat from the LED flows through the dielectric to the heat conductive body, and from the body to the heat sink via the mount portion.

68. The apparatus of claim 67, wherein substantially the entire second face is connected to the mount portion.

69. The apparatus of claim 67, wherein the body is connected to the mount portion using a mechanical fastener.

70. The apparatus of claim 67, wherein the body is connected to the mount portion by an adhesive.

71. The apparatus of claim 67, wherein the mount portion is integrally formed with the heat sink.

72. The apparatus of claim 71, wherein the mount portion is disposed at an obtuse angle relative to an adjacent portion of the heat sink.

73. The apparatus of claim 67, wherein the apparatus comprises a plurality of heat sinks, each heat sink having a mount portion, and at least one lighting module is attached to each mount portion so that the second face of the respective module heat conductive body is connected to the respective heat sink mount portion.

74. The apparatus of claim 73, wherein each body is connected to the respective mount portion by an adhesive.

75. The apparatus of claim 74 additionally comprising a pair of electrical supply wires, an elongate portion of the pair of electrical supply wires arranged within the housing, wherein each of the lighting modules is electrically connected to the elongate portion of the pair of electrical supply wires.

76. An illumination apparatus, comprising:

a substantially enclosed housing comprising a housing wall and a light-transmissive portion;

at least one heat sink having a mount portion, the mount portion disposed within the enclosed housing;

a plurality of lighting modules, each lighting module comprising;

a light emitting diode (LED);

a dielectric having first and second sides;

plural electrically-conductive contacts on the first side of the dielectric, the contacts being configured to mount the LED so that the LED is electrically connected to the contacts; and

a heat conductive body on the second side of the dielectric; and

a pair of electrical supply wires, an elongate portion of the pair of electrical supply wires arranged within the housing, wherein each of the lighting modules is electrically connected to the elongate portion of the pair of electrical supply wires; and

wherein the heat conductive body of each of the plurality of lighting modules is attached to a corresponding mount portion so that heat from the LED flows through the dielectric to the heat conductive body, and from the body to the heat sink via the mount portion.

77. The apparatus of claim 76, wherein the lighting modules employ insulation displacement connectors to electrically connect to the pair of electrical supply wires.

78. An illumination apparatus, comprising:

a substantially enclosed housing comprising a housing wall and a light-transmissive portion;

a heat sink having a mount portion, the mount portion disposed within the enclosed housing;

a lighting module comprising;

a light emitting diode (LED);

a dielectric having first and second sides;

plural electrically-conductive contacts on the first side of the dielectric, the contacts being configured to mount the LED so that the LED is electrically connected to the contacts, the contacts thermally communicating with the dielectric through a thermal communication area between the contacts and the first side of the dielectric; and

a heat conductive body on the second side of the dielectric, the body comprising first and second sides, the first side being connected to the second side of the dielectric;

wherein the second side of the heat conductive body is connected to the mount portion, a thermal communication area between the second side of the body and the mount portion being greater then the thermal communication area between the contacts and the first side of the dielectric; and

wherein heat from the LED flows through the dielectric to the heat conductive body, and from the body to the heat sink via the mount portion.

79. The apparatus of claim 78, wherein substantially the entire second face is connected to the mount portion.

80. The apparatus of claim 78, wherein the housing wall comprises at least part of the heat sink.

81. The apparatus of claim 78, wherein a current modifying device is disposed adjacent the heat sink, the apparatus additionally comprising electrical wires adapted to deliver an AC electrical power to the current modifying device, the current modifying device adapted to deliver a modified electrical power to the lighting module.

82. The apparatus of claim 81, wherein the current modifying device comprises a rectifier.

83. The apparatus of claim 82, wherein the current modifying device is enclosed within the housing.

84. An illumination device, comprising:

a light emitting diode (LED) module in combination with a heat sink member, the LED module attached to the heat sink member, the LED module comprising;

at least one LED;

a dielectric layer having first and second sides;

plural electrically-conductive contacts on the first side of the dielectric layer, the contacts being configured to mount the at least one LED such that the at least one LED is electrically connected to the contacts; and

a heat conductive body on the second side of the dielectric layer, the body being in thermal communication with the plural contacts through the dielectric layer;

wherein the heat conductive body is attached to the heat sink member so that heat flows from the body to the heat sink member; and

wherein the heat sink member comprises;

a surface area greater than a surface area of the heat conductive body; and

a mount portion integrally formed with the heat sink member and configured to accept the LED module, the mount portion being disposed at an angle relative to an adjacent portion of the heat sink member;

wherein the LED module is attached to the mount portion.

85. An illumination device as in claim 84, wherein the LED module is fastened to the mount portion by an adhesive.

86. An illuminated display apparatus, comprising:

a plurality of the illumination devices recited in claim 84 electrically connected to one another in an electrically parallel arrangement; and

a display member having a wall surface;

wherein at least one of the plurality of illumination devices is arranged on the wall surface.

87. An illumination display apparatus as in claim 86, wherein the wall surface is configured to function as a heat sink.

88. An illumination apparatus, comprising:

an illumination device as recited in claim 84; and

a housing, the housing having a light outlet aperture and being attached to the heat sink member so as to generally enclose the LED module;

wherein the apparatus is adapted so that light from the LED module is directed out of the housing aperture.

89. An illumination apparatus as in claim 88 additionally comprising an optical element for directing light from the LED module in a desired direction.

90. An illumination apparatus as in claim 88, comprising a lens.