Array substrate used for a display device and a method of making the same

• US 7,115,913 B2
• Filed: 03/25/2003
• Issued: 10/03/2006
• Est. Priority Date: 03/27/2002
• Status: Active Grant

• Current Assignee: Japan Display Central Incorporated (Japan Display Incorporated)
• Original Assignee: TFPD Corporation
• Inventors: Shigeno, Hirotaka
• Primary Examiner(s): Fahmy, Wael
• Assistant Examiner(s): Harrison, Monica D.
• Application Number:
  US10/395,100
• Publication Number:
  US 20030209726A1
• Time in Patent Office: 1,288 Days
• Field of Search: 438/22, 438/39, 257/99, 257/98, 257/91, 257/88, 257/79, 257/59
• US Class Current: 257/91
• CPC Class Codes: G02F 1/133555 Transflectors
• CPC Class Codes: H01L 27/12 the substrate being other than a semiconductor body, e.g. an insulating body
• CPC Class Codes: H01L 27/1244 for preventing breakage, peeling or short circuiting
• CPC Class Codes: H01L 27/1248 with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement

Abstract

A TFT array substrate used for a display device and a method of making the same are disclosed. A optically transparent thick resin insulation film 5 is formed on a base substrate and an upper contact hole 51 is perforated through the optically transparent thick resin insulation film 5. A lower contact hole 41 perforated through a gate insulation film 15 and patterning of an ITO film to make a transparent pixel electrode are then collectively carried out under a photoresist pattern 8. Where the photoresist pattern 8 is provided after making the ITO film, an aperture 81 is perforated closer to the center of the upper contact hole 51 at an end portion of a connecting line 14a for a pad and is smaller in diameter by a side etching size plus a margin than the upper contact hole. Subsequently, following three-etching steps are carried out: (1) patterning of the ITO film along the photoresist pattern 8, (2) the lower contact hole 41 is made by using buffered hydrofluoric acid solution, and (3) an “eaves” portion 6a of the ITO films is removed.

Claims

1. An array substrate for a display device comprising:

a substrate;

a first electrically conductive film formed over said substrate;

a first insulation film formed on said first electrically conductive film, said first insulation film having a first contact hole on a place corresponding to said first electrically conductive film;

a second electrically conductive film;

a second insulation film having a second contact hole, said second contact hole being covered with said second electrically conductive film to define an aperture; and

a third electrically conductive film formed on said first insulation film and connected to said first electrically conductive film,

wherein an upper end portion of said first contact hole of said first insulation film is substantially the same in diameter as said aperture defined in said second contact hole covered with said second electrically conductive film.

2. The array substrate for a display device according to claim 1, wherein said second insulation film is made of equal to or more than 1 μ

m in thickness resin.

3. The array substrate for a display device according to claim 1, further comprising pixel electrodes in matrix made of at least the same one of either said second and third electrically conductive films.

4. The array substrate for a display device according to claim 3, wherein said pixel electrodes are made of said second and third electrically conductive films, one of said second and third electrically conductive films being optically transparent and the other being optically reflective.

5. The array substrate for a display device according to claim 4, wherein said array substrate is used for a half transparent type liquid crystal display device.

6. The array substrate for a display device according to claim 4, wherein said second insulation film is provided at a place corresponding to said pixel electrode made of said optically reflective and electrically conductive film.

7. The array substrate for a display device according to claim 4, wherein said second insulation film includes an aperture at a place corresponding to said pixel electrode made of said optically transparent and electrically conductive film.

8. The array substrate for a display device according to claim 1, wherein said array substrate is used for an organic electro-luminescence display device.

9. The array substrate for a display device according to claim 8, wherein said second and third electrically conductive films are made of the same materials as anode and cathode electrodes of said organic electro-luminescence display device.

10. A method of making an array substrate for a display device, comprising the steps of:

making a first electrically conductive film on an insulation substrate;

forming a first insulation film to cover said first electrically conductive pattern;

forming a second insulation film on said first insulation film with a contact hole at a place corresponding to said first electrically conductive film;

making second electrically conductive film on said second insulation film;

first patterning of said second electrically conductive film by using a pattern photomask with an aperture made smaller in diameter than said contact hole;

second patterning to expose said first electrically conductive film wherein etching of said first insulation film is carried out by using said photomask and through said aperture of said second electrically conductive film to make a contact hole larger in diameter than said aperture of said second electrically conductive film;

third patterning of said second electrically conductive film by using said contact hole of said first insulation film; and

removing said pattern photomask and forming third electrically conductive film connected to said first electrically conductive film through said contact holes of said first and second insulation films.

11. The method of making an array substrate for a display device according to claim 10, further comprising the steps of:

making a third insulation film between said first and second insulation films, wherein said third insulation film is subjected to said etching step of said first insulation film.

12. The method of making an array substrate for a display device according to claim 11, wherein said second patterning step carries out side etching of said third insulation film at a speed faster that that of said first insulation film.

13. The method of making an array substrate for a display device according to claim 11, wherein said first insulation film is made of upper and lower insulation films and second patterning step carries out side etching of said upper insulation film at a speed faster that that of said lower insulation film.

14. The method of making an array substrate for a display device according to claim 13, wherein said second etching step carries out wet etching.

15. The method of making an array substrate for a display device according to claim 14, wherein said wet etching uses etching solution of buffered hydrofluoric acid.

16. The method of making an array substrate for a display device according to claim 13, wherein said second etching carries out dry etching.