Semiconductor device
First Claim
1. A semiconductor device, characterized by comprising:
- a semiconductor substrate having a first main surface and a second main surface which are opposed to each other;
first and second insulating gate type field effect transistor portions respectively having source regions and drain regions, which are opposed to each other sandwiching channel formation regions, and gate electrodes which are opposed to said channel formation regions sandwiching gate insulating films;
a first stabilizing plate, made of a conductor or of a semiconductor, which is opposed to said drain region of said first insulating gate type field effect transistor portion sandwiching a first insulating film for a plate and that forms, together with said drain region of said first insulating gate type field effect transistor portion, a capacitor; and
a second stabilizing plate, made of a conductor or of a semiconductor, which is opposed to said drain region of said second insulating gate type field effect transistor portion sandwiching a second insulating film for a plate and that forms, together with said drain region of said second insulating gate type field effect transistor portion, a capacitor,wherein said first insulating gate type field effect transistor portion is formed on said first main surface while said second insulating gate type field effect transistor portion is formed in said second main surface and a current is allowed to flow between said first and second insulating gate type field effect transistor portions.
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Abstract
A semiconductor device of the present invention has an insulating gate type field effect transistor portion having an n-type emitter region (3) and an n− silicon substrate (1), which are opposed to each other sandwiching a p-type body region (2), as well as a gate electrode (5a) which is opposed to p-type body region (2) sandwiching a gate insulating film (4a), and also has a stabilizing plate (5b). This stabilizing plate (5b) is made of a conductor or a semiconductor, is opposed to n− silicon substrate (1) sandwiching an insulating film (4, 4b) for a plate, and forms together with n− silicon substrate (1), a capacitor. This stabilizing plate capacitor formed between stabilizing plate (5b) and n− silicon substrate (1) has a capacitance greater than that of the gate-drain capacitor formed between gate electrode (5a) and n− silicon substrate (1).
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Citations
6 Claims
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1. A semiconductor device, characterized by comprising:
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a semiconductor substrate having a first main surface and a second main surface which are opposed to each other; first and second insulating gate type field effect transistor portions respectively having source regions and drain regions, which are opposed to each other sandwiching channel formation regions, and gate electrodes which are opposed to said channel formation regions sandwiching gate insulating films; a first stabilizing plate, made of a conductor or of a semiconductor, which is opposed to said drain region of said first insulating gate type field effect transistor portion sandwiching a first insulating film for a plate and that forms, together with said drain region of said first insulating gate type field effect transistor portion, a capacitor; and a second stabilizing plate, made of a conductor or of a semiconductor, which is opposed to said drain region of said second insulating gate type field effect transistor portion sandwiching a second insulating film for a plate and that forms, together with said drain region of said second insulating gate type field effect transistor portion, a capacitor, wherein said first insulating gate type field effect transistor portion is formed on said first main surface while said second insulating gate type field effect transistor portion is formed in said second main surface and a current is allowed to flow between said first and second insulating gate type field effect transistor portions. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification