Printed-circuit board with fuse

• US 7,116,208 B2
• Filed: 02/17/2005
• Issued: 10/03/2006
• Est. Priority Date: 03/14/2000
• Status: Expired due to Fees

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Suzuki, Saizou, Nishimura, Kohshi, Nakamura, Satoshi
• Primary Examiner(s): Vortman, Anatoly
• Application Number:
  US11/062,297
• Publication Number:
  US 20050140490A1
• Time in Patent Office: 593 Days
• Field of Search: 337/297, 337/296, 337/159, 337/227, 337/290
• US Class Current: 337/296
• CPC Class Codes: H01H 2069/027 using ultrasonic techniques
• CPC Class Codes: H01H 2085/0275 Structural association with a printed circuit board
• CPC Class Codes: H01H 85/0047 Heating means
• CPC Class Codes: H01H 85/0411 Miniature fuses
• CPC Class Codes: H01H 85/046 Fuses formed as printed circuits
• CPC Class Codes: H01H 85/463 with printed circuit fuse
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 1/0293 Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
• CPC Class Codes: H05K 2201/0305 Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
• CPC Class Codes: H05K 2201/0394 Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• CPC Class Codes: H05K 2201/062 Means for thermal insulation, e.g. for protection of parts
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/09727 Varying width along a single conductor; Conductors or pads having different widths
• CPC Class Codes: H05K 2201/0989 Coating free areas, e.g. areas other than pads or lands free of solder resist
• CPC Class Codes: H05K 2201/10037 Printed or non-printed battery
• CPC Class Codes: H05K 2201/10181 Fuse
• CPC Class Codes: H05K 2203/049 Wire bonding
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence
• CPC Class Codes: H05K 3/4697 having cavities, e.g. for mounting components H05K3/4691 takes precedence

Abstract

A printed wiring board includes a substrate (20) on which a wiring pattern (12) has been formed, and a fuse (6) provided on the substrate (20). One end of the fuse (6) is directly connected to a first pad (12a) of the wiring pattern (12), and the other end of the fuse (6) is directly connected to a second pad (12b) of the wiring pattern (12). The fuse (6) is covered by a protective material (7).

Claims

1. A printed wiring board comprising:

a first insulating substrate with a wiring pattern formed thereon;

a fuse including circuit breaking means formed integral with the wiring pattern; and

a second insulating substrate,

wherein the first insulating substrate is provided with two heat insulator groups arranged to sandwich the circuit breaking means, each of said heat insulator groups including a plurality of through holes formed in the first insulating substrate,

wherein the second insulating substrate is formed with a recess facing the circuit breaking means.

2. The board according to claim 1, wherein the circuit breaking means is a relatively narrow portion of the wiring pattern.

3. The board according to claim 2, wherein the wiring pattern is made of copper.

4. The board according to claim 1, wherein the plurality of through holes is arranged in a row extending in parallel to the circuit breaking means.