Lithographic apparatus and device manufacturing method

• US 7,116,398 B2
• Filed: 10/26/2004
• Issued: 10/03/2006
• Est. Priority Date: 11/07/2003
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Spit, Peter, Hoefnagels, Johan Christiaan Gerard
• Primary Examiner(s): MATHEWS, ALAN A
• Application Number:
  US10/972,784
• Publication Number:
  US 20050145805A1
• Time in Patent Office: 707 Days
• Field of Search: 355/20, 355/52, 355/53, 355/77, 355/237.2, 355/237.3, 355/237.4, 355/237.5, 430/22, 430/30, 250/492.22, 349/2, 349/4, 349/106
• US Class Current: 355/52
• CPC Class Codes: G02F 1/1309 Repairing; Testing
• CPC Class Codes: G02F 1/1333 Constructional arrangements; Manufacturing methodsG02F1/135, G02F1/136 take precedence
• CPC Class Codes: G02F 1/133354 Arrangements for aligning or assembling substrates
• CPC Class Codes: G03F 7/70425 Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
• CPC Class Codes: G03F 7/70675 Latent image, i.e. measuring the image of the exposed resist prior to development
• CPC Class Codes: G03F 7/70791 Large workpieces, e.g. glass substrates for flat panel displays or solar panels

Abstract

A method of manufacturing first and second substrates that are coupled together, e.g., an active and passive plate of a flat panel display. The active plate is formed according to a standard pattern and inspected. The passive plate is then formed by modifying the pattern data for the passive plate according to the actual pattern formed on the active plate to ensure that the patterns formed on the active and passive plates correspond closely.

Claims

1. A device manufacturing method, comprising:

(a) inspecting for a fault found in a pattern formed on a first substrate, which was patterned according to a first pattern;

(b) creating or modifying a second pattern that compensates for the fault in the pattern formed on the first substrate in response to the inspected pattern;

(c) patterning a second substrate using the second pattern; and

(d) coupling the second substrate to the first substrate.

2. The method of claim 1, wherein the patterning in at least one of steps (a) and comprises:

patterning a beam of radiation with the respective first or second pattern; and

projecting the patterned beam onto a target portion of the respective first or second substrate.

3. The method of claim 2, further comprising using an array of individually controllable elements to perform the patterning.

4. The method of claim 3, wherein pattern data used to control the array of individually controllable elements for patterning the beam according to the respective first or second pattern is modified in response to data generated by the inspection step (a), the modified pattern data being used when beams, patterned according to the respective first or second patterns, are subsequently projected onto the respective first or second substrates.

5. The method of claim 1, wherein:

the first substrate is used to form a color filter plate of a flat panel display; and

the second substrate is used to form an active plate of the flat panel display.

6. The method of claim 1, wherein step (b) comprises modifying a design pattern of features to be exposed on the second substrate through performing at least one of:

adjusting a size of features to be exposed on the second substrate; and

adjusting a separation of features to be exposed on the substrate.

7. The method of claim 1, wherein the first and second patterns correspond to features of the device at least partially formed when the second substrate is attached to the first substrate.

8. The method of claim 1, further comprising:

providing an active plate as the first substrate, wherein the fault comprises a faulty pixel on the active plate; and

providing a passive plate as the second substrate, wherein the second pattern is used to form a feature on the passive plate that compensates for the faulty pixel on the active plate.

9. The method of claim 1, further comprising:

providing a passive plate as the first substrate, wherein the fault comprises a faulty area on the passive plate; and

providing an active plate as the second substrate, wherein the second pattern is used to form a feature on the active plate that compensates for the faulty area on the passive plate.

10. A device manufacturing method, comprising:

(a) inspecting respective patterns formed on a plurality of first substrates that are patterned according to a first pattern to determine an average pattern;

(b) generating or modifying a second pattern in response to the average pattern generated by the inspection;

(c) patterning respective beams of radiation based on the second pattern;

(d) projecting the respective patterned beams of radiation onto corresponding ones of a plurality of second substrates; and

(e) coupling each of the plurality of first substrates to a respective one of the plurality of second substrates.

11. The method of claim 10, wherein the step (a) further comprises:

comparing respective ones of the inspected patterns of each respective one of the plurality of first substrates against an acceptable tolerance; and

rejecting respective ones of the plurality of first substrates whose respective inspected patterns are above the acceptable tolerance.

12. The method of claim 11, wherein step (b) further comprises eliminating data corresponding to the rejected ones of the plurality of first substrates from the average pattern.

13. A lithographic apparatus, comprising:

an inspection system that inspects for a fault in a pattern formed on a first substrate patterned according to a first pattern;

a controller that creates or modifies a second pattern to compensate for the fault, in response to data generated by the inspection system;

an array of individually controllable elements that pattern a beam according to the second pattern;

a projection system that projects the patterned beam onto a target portion of a second substrate; and

an assembly system that couples together the first and second substrates.

14. The lithographic apparatus of claim 13, wherein

a plurality of the first and second substrates are used;

and

the assembly system forms a plurality of respective pairs of coupled together ones of the first and second substrates.

15. The lithographic apparatus of claim 13, wherein:

the first substrate comprises an active plate, wherein the fault comprises a faulty pixel on the active plate; and

the second substrate comprises a passive plate, wherein the second pattern is used to form a feature on the passive plate that compensates for the faulty pixel on the active plate.

16. The lithographic apparatus of claim 13, wherein:

the first substrate comprises a passive plate, wherein the fault comprises a faulty area on the passive plate; and

the second substrate comprises an active plate, wherein the second pattern is used to form a feature on the active plate that compensates for the faulty area on the passive plate.

17. The lithographic apparatus of claim 14, wherein the inspection system is configured to:

compare respective ones of the inspected patterns of each respective one of the plurality of first substrates against an acceptable tolerance; and

reject respective ones of the plurality of first substrates whose respective inspected patterns are above the acceptable tolerance.