Integrated pressure sensor and method of manufacture

• US 7,117,747 B2
• Filed: 01/03/2005
• Issued: 10/10/2006
• Est. Priority Date: 01/03/2005
• Status: Active Grant

• Current Assignee: Delphi Technologies Ip Limited (BorgWarner Incorporated)
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: Borzabadi, Hamid R., Vas, Timothy A., Long, Stephen P., Koglin, Dennis M.
• Primary Examiner(s): Lefkowitz, Edward
• Assistant Examiner(s): Bonanto, George P
• Application Number:
  US11/028,343
• Publication Number:
  US 20060144156A1
• Time in Patent Office: 645 Days
• Field of Search: 737/54, 737/53
• US Class Current: 73/754
• CPC Class Codes: G01L 19/069 Protection against electromagnetic or electrostatic interferences
• CPC Class Codes: G01L 9/0051 using variations in ohmic resistance
• CPC Class Codes: G01L 9/045 with electric temperature compensating means non electric temperature compensating means G01L19/04

Abstract

A technique for manufacturing an integrated pressure sensor includes a number of steps. Initially, a substrate with conductive electrical traces located on first and second sides of the substrate is provided. A plurality of compensation circuits are positioned in an array on the first side of the substrate in electrical contact with one or more of the conductive electrical traces on the first side of the substrate. A plurality of pressure sensors are positioned on the second side of the substrate in electrical contact with one or more of the conductive electrical traces on the second side of the substrate. Each one of the sensors is associated with one of the compensation circuits to form a plurality of pressure sensor-compensation circuit pairs. The substrate includes conductive vias to electrically connect each of the sensor-compensation circuit pairs. Each of the compensation circuits provides temperature compensation for an associated one of the sensors. The sensor-compensation circuit pairs are calibrated and singulated for final packaging.

Claims

1. A method for manufacturing an integrated pressure sensor, comprising the steps of:

providing a substrate with a first side and a second side, wherein the substrate includes conductive electrical traces located on the first and second sides;

positioning a plurality of compensation circuits on the first side of the substrate in electrical contact with one or more of the conductive electrical traces on the first side of the substrate, wherein the compensation circuits are positioned in an array;

positioning a plurality of pressure sensors on the second side of the substrate in electrical contact with one or more of the conductive electrical traces on the second side of the substrate, wherein each one of the sensors is associated with one of the compensation circuits to form a plurality of pressure sensor-compensation circuit pairs, and wherein the substrate includes conductive vias to electrically connect each of the sensor-compensation circuit pairs, where each of the compensation circuits provides temperature compensation for an associated one of the sensors;

calibrating each of the sensor-compensation circuit pairs; and

singulating each of the sensor-compensation circuit pairs for final packaging.

2. The method of claim 1, wherein the substrate is a low-temperature co-fired ceramic (LTCC).

3. The method of claim 1, wherein the compensation circuits each include an application specific integrated circuit (ASIC).

4. The method of claim 3, wherein the ASIC is configured to provide temperature and long-term drift compensation for an associated one of the sensors.

5. The method of claim 1, wherein the array is a 9 by 10 array.

6. The method of claim 1, wherein the sensor-compensation circuit pairs are calibrated in parallel.

7. A method for manufacturing an integrated pressure sensor, comprising the steps of:

providing a substrate with a first side and a second side, wherein the substrate includes conductive electrical traces located on the first and second sides;

positioning a plurality of compensation circuits on the first side of the substrate in electrical contact with one or more of the conductive electrical traces on the first side of the substrate, wherein the compensation circuits are positioned in an array;

positioning a plurality of pressure sensors on the second side of the substrate in electrical contact with or more of the conductive electrical traces on the second side of the substrate, wherein each one of the sensors is associated with one of the compensation circuits to form a plurality of pressure sensor-compensation circuit pairs, and wherein the substrate includes conductive vias to electrically connect each of the sensor-compensation circuit pairs, where each of the compensation circuits provides temperature compensation for an associated one of the sensors;

calibrating each of the sensor-compensation circuit pairs, wherein the sensor-compensation circuit pairs are calibrated in parallel; and

singulating each of the sensor-compensation circuit pairs for final packaging.

8. The method of claim 7, wherein the substrate is a low-temperature co-fired ceramic (LTCC).

9. he method of claim 7, wherein the substrate is a printed circuit board (PCB).

10. The method of claim 7, wherein the compensation circuits each include an application specific integrated circuit (ASIC).

11. The method of claim 10, wherein the ASIC is configured to provide temperature and long-term drift compensation for an associated one of the sensors.

12. The method of claim 7, wherein the array is a 9 by 10 array.

13. An integrated pressure sensor assembly, comprising:

a substrate with a first side and a second side, wherein the substrate includes conductive electrical traces located on the first and second sides;

a plurality of compensation circuits positioned on the first side of the substrate in electrical contact with one or more of the conductive electrical traces on the first side of the substrate, wherein the compensation circuits are positioned in an array; and

a plurality of pressure sensors positioned on the second side of the substrate in electrical contact with one or more of the conductive electrical traces on the second side of the substrate, wherein each one of the sensors is associated with one of the compensation circuits to form a plurality of pressure sensor-compensation circuit pairs, and wherein the substrate includes conductive vias to electrically connect the sensor-compensation circuit pairs, where each of the compensation circuits provides temperature compensation for an associated one of the sensors, and where each of the sensor-compensation circuit pairs are calibrated in parallel before being singulated for final packaging.

14. The integrated pressure sensor assembly of claim 13, wherein the substrate is a low-temperature co-fired ceramic (LTCC).

15. The integrated pressure sensor assembly of claim 13, wherein the substrate is a printed circuit board (PCB).

16. The integrated pressure sensor assembly of claim 13, wherein the compensation circuits each include an application specific integrated circuit (ASIC).

17. The integrated pressure sensor assembly of claim 16, wherein the ASIC is configured to provide temperature and long-term drift compensation for an associated one of the sensors.

18. The integrated pressure sensor assembly of claim 13, wherein the array is a 9 by 10 array.