Methods for making large dimension, flexible piezoelectric ceramic tapes

• US 7,118,990 B1
• Filed: 12/20/2004
• Issued: 10/10/2006
• Est. Priority Date: 02/25/2003
• Status: Expired due to Fees

• Current Assignee: Palo Alto Research Center, Inc. (Xerox Holdings Corp.)
• Original Assignee: Palo Alto Research Center, Inc. (Xerox Holdings Corp.)
• Inventors: Weisberg, Michael C., Buhler, Steven A., Wong, William S., Solberg, Scott E., Xu, Baomin, Littau, Karl A., Elrod, Scott A.
• Primary Examiner(s): Dang, Phuc T.
• Application Number:
  US11/017,470
• Publication Number:
  US 20060211217A1
• Time in Patent Office: 659 Days
• Field of Search: 438/405, 438/406, 438/455, 438/456, 438/458, 438/459
• US Class Current: 438/455
• CPC Class Codes: B06B 1/0622 on one surface
• CPC Class Codes: G01L 1/16 using properties of piezoelectric devices
• CPC Class Codes: G01N 2291/02827 Elastic parameters, strength or force
• CPC Class Codes: G01N 2291/2694 Wings or other aircraft parts
• CPC Class Codes: G01N 29/245 Ceramic probes, e.g. lead zirconate titanate [PZT] probes
• CPC Class Codes: G01N 29/2475 Embedded probes, i.e. probes incorporated in objects to be inspected
• CPC Class Codes: H10N 30/073 by fusion of metals or by adhesives
• CPC Class Codes: H10N 30/074 by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
• CPC Class Codes: H10N 39/00 Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00

Abstract

A method for producing a detection/test tape includes depositing a material onto a surface of at least one first substrate to form a plurality of element structures. Electrodes are deposited on a surface of each of the plurality of element structures, and the element structures are bonded to a second substrate, where the second substrate is conductive or has a conductive layer, and the second substrate is carried on a carrier plate. The at least one first substrate is removed from the element structures and second side electrodes are deposited on a second surface of each of the plurality of element structures. An insulative material is inserted around the element structures to electrically isolate the two substrates used to bond the element structures. A second side of the element structures is then bonded to another substrate, where the other substrate is conductive or has a conductive layer. Thereafter, the carrier plate carrying the second substrate is removed.

Claims

1. A method of producing a detection/test tape comprising:

depositing a material onto a surface of at least one first substrate to form a plurality of element structures, wherein the depositing step used to form the plurality of element structures includes direct marking methods;

depositing electrodes on a surface of each of the plurality of element structures;

bonding the element structures to a second substrate, the second substrate being conductive or having a conductive layer and the second substrate being carried on a carrier plate;

removing the at least one first substrate from the element structures;

depositing second side electrodes on a second surface of each of the plurality of element structures;

bonding a second side of the element structures to a third substrate, the third substrate being conductive or having a conductive layer; and

removing the carrier plate.

2. The method according to claim 1, wherein an insulative material is inserted in the gaps between the element structures to electrically isolate the two substrates or surface conductive layers of the two substrates used to bond the element structures.

3. The method according to claim 1, wherein the direct marking methods include at least one of screen printing, jet printing or acoustic printing.

5. The method according to claim 1, wherein the bonding step includes the use of at least one of nonconductive epoxy bonding containing conductive particles, a nonconductive epoxy alone, wherein electrical contact between the electrodes of the element structures and at least one of the second substrate or third substrate is maintained.

6. The method according to claim 1, wherein the bonding step includes a thin film metal bonding.

8. The method according to claim 1, wherein the step of bonding the element structures to at least one second substrate, includes the second substrate being a transfer substrate, wherein the bond is a temporary bond.

9. The method according to claim 8, further including,

bonding element structures to a final target substrate, wherein the bond is intended to be permanent;

and

removing the at least one transfer substrate from the element structures.

10. The method according to claim 9, further including performing a property test on the element structures before bonding the element structures to a final target substrate.

12. The method according to claim 1, wherein if more than one first substrate is used, the materials, shapes and thicknesses of the elements on these substrates are either the same or different.

4. A method of producing a detection/test tape comprising:

depositing a material onto a surface of at least one first substrate to form a plurality of element structures;

depositing electrodes on a surface of each of the plurality of element structures;

bonding the element structures to a second substrate, the second substrate being conductive or having a conductive layer and the second substrate being carried on a carrier plate;

removing the at least one first substrate from the element structures;

depositing second side electrodes on a second surface of each of the plurality of element structures;

bonding a second side of the element structures to a third substrate, the third substrate being conductive or having a conductive layer, wherein at least one of the second substrate or the third substrate is at least one of flexible or partially flexible; and

removing the carrier plate.

17. The method according to claim 4, wherein an insulative material is inserted in the gaps between the element structures to electrically isolate the two substrates or surface conductive layers of the two substrates used to bond the element structures.

18. The method according to claim 4, wherein the bonding step includes the use of at least one of nonconductive epoxy bonding containing conductive particles, a nonconductive epoxy alone, wherein electrical contact between the electrodes of the element structures and at least one of the second substrate or third substrate is maintained.

19. The method according to claim 4, wherein the bonding step includes a thin film metal bonding.

7. A method of producing a detection/test tape comprising:

depositing a material onto a surface of at least one first substrate to form a plurality of element structures;

depositing electrodes on a surface of each of the plurality of element structures;

bonding the element structures to a second substrate, the second substrate being conductive or having a conductive layer and the second substrate being carried on carrier plate, wherein the step of bonding the element structures to the second substrate, includes the second substrate being a final target substrate, wherein the bond is intended to be permanent;

removing the at least one first substrate from the element structures;

depositing second side electrodes on a second surface of each of the plurality of element structures;

bonding a second side of the element structures to a third substrate, the third substrate being conductive or having a conductive layer; and

removing the carrier plate.

11. A method of producing a detection/test tape comprising:

depositing a material onto a surface of at least one first substrate to form a plurality of element structures, wherein the element structures are made from one of piezoelectric or other functional ceramic, including at least one of antiferroelectric material, electrostrictive material, and magnetostrictive materials;

depositing electrodes on a surface of each of plurality of element structures;

bonding the element structures to a second substrate, the second substrate being conductive or having a conductive layer and the second substrate being carried on a carrier plate;

removing the at least one first substrate from the element structures;

depositing second side electrodes on a second surface of each of the plurality of element structures;

bonding a second side of the element structures to a third substrate, the third substrate being conductive or having conductive layer; and

removing the carrier plate.

13. A method of producing a detection/test tape comprising:

depositing a material onto a surface of at least one first substrate to form a plurality of element structures;

depositing electrodes on a surface of each of the plurality of element structures;

bonding the element structures to a second substrate, the second substrate being conductive or having a conductive layer and the second substrate being carried on a carrier plate;

removing the at least one first substrate from the element structures, further including, removing the at least one first substrate via a liftoff procedure using a radiation source;

depositing second side electrodes on a second surface of each of the plurality of element structures;

bonding a second side of the element structures to a third substrate, the third substrate being conductive or having a conductive layer; and

removing the carrier plate.

15. The method according to claims 13, wherein the at least one first substrate is transparent.

16. The method according to claim 13, wherein the radiation source is a laser.

14. A method of producing a detection/test tape comprising:

depositing a material onto a surface of at least one first substrate to form a plurality of element structures;

depositing electrodes on a surface of each of the plurality of element structures;

bonding the element structures to a second substrate, the second substrate being conductive or having a conductive layer and the second substrate being carried on a carrier plate;

removing the at least one first substrate from the element structures;

depositing second side electrodes on a second surface of each of the plurality of element structures;

bonding a second side of the element structures to a third substrate, the third substrate being conductive or having a conductive layer;

bonding a second plurality of element structures to another surface of the third substrate, the other surface of the third substrate being conductive or having a conductive layer;

removing the at least one first substrate from the second plurality of elements structures;

depositing electrodes on a second surface of each of the second plurality of element structures;

bonding a second side of the second plurality of element structures to a fourth substrate, the fourth substrate being conductive or having a conductive layer; and

removing the carrier plate.