Probe apparatus

• US 7,119,560 B2
• Filed: 08/18/2004
• Issued: 10/10/2006
• Est. Priority Date: 08/21/2003
• Status: Expired due to Fees

• Current Assignee: Tokyo Seimitsu Company Limited
• Original Assignee: Tokyo Seimitsu Company Limited
• Inventors: Nihei, Makoto, Ueda, Yutaka
• Primary Examiner(s): Nguyen, Vinh
• Assistant Examiner(s): Vazquez, Arleen M.
• Application Number:
  US10/921,674
• Publication Number:
  US 20050083073A1
• Time in Patent Office: 783 Days
• Field of Search: 324750-764
• US Class Current: 324/750.19
• CPC Class Codes: G01R 31/2887 involving moving the probe head or the IC under test; docking stations moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392
• CPC Class Codes: G01R 31/2891 related to sensing or controlling of force, position, temperature G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05

Abstract

A probe apparatus 1 includes displacement detection means 6 disposed on a surface 4a of a probe card 4 from which probing needles 41 of the probe card 4 protrude, and control means 5 for receiving a signal of a positional change of the probe card 4 from the displacement detection means or a positional change on the stage side, or signals of positional changes of both of them and moving a stage 2 in a Z axis direction. The displacement detection means detects on the real time basis the positional change of the probe card due to influences of heat, etc, moves the stage to correct the positional change and keeps the contact condition between probing needles of the probe card and electrode pads of a wafer 10 always constant.

Claims

1. A probe apparatus for positioning a wafer having semiconductor devices formed thereon and then bringing probing needles of a probe card into contact with electrode pads of said semiconductor devices to inspect their electric characteristics, said probe apparatus comprising:

displacement detection means for detecting displacement of the position of said probe card, disposed on a surface of said probe card from which said probing needles of said probe card protrude, said displacement detection means having a plurality of displacement sensors which are disposed at mutually different distances in a radial direction from a center of said probe card; and

control means for moving a stage supporting thereon said wafer in a Z axis direction in accordance with a signal from said displacement detection means;

wherein said displacement detection means detects displacement of said probe card, put on said stage, from said wafer, corrects and moves said stage in the Z axis direction in accordance with displacement of the detected position so that a contact condition between said probing needles and said electrode pad can be always kept inside a constant or allowable range.

2. A probe apparatus as defined in claim 1, wherein said displacement sensors are contact type displacement sensors.

3. A probe apparatus as defined in claim 1, wherein said displacement sensors are non-contact type sensors.

4. A probe apparatus as defined in claim 1, wherein said control means is a tester.