Non-lot based method for assembling integrated circuit devices
First Claim
1. An assembly method for a plurality of integrated circuit devices and a plurality of mounting substrates comprising:
- providing a plurality of integrated circuit devices in multiple lots for assembling in a manufacturing process, each lot of the multiple lots having a plurality of integrated circuit devices therein;
mounting each integrated circuit device of the plurality of integrated circuit devices to a mounting substrate of the plurality of mounting substrates;
placing a substantially unique identification code on each mounting substrate of the plurality of mounting substrates in a readable position thereon;
placing an identification code on each integrated circuit device of the plurality of integrated circuit devices;
correlating the identification code of each integrated circuit device mounted on the mounting substrate with the substantially unique identification code of the mounting substrate;
reading the substantially unique identification code of the mounting substrate of each integrated circuit device of the plurality of integrated circuit devices in each lot of the multiple lots;
performing a series of assembly steps in the manufacturing process on the plurality of integrated circuit devices in the multiple lots, the series of assembly steps including;
generating data related to the series of assembly steps of each integrated circuit device of the plurality of integrated circuit devices through the series of assembly steps;
associating the data generated for each integrated circuit device of the plurality of integrated circuit devices with the substantially unique identification code of an associated mounting substrate of the plurality of mounting substrates for tracking the multiple lots of the plurality of integrated circuit devices; and
at least one assembly step including one of die attach, die cure, wire bond, molding, deflash, lead finish, trim and form, and opens/shorts testing.
5 Assignments
0 Petitions
Accused Products
Abstract
An inventive method tracks IC devices through the assembly steps in a manufacturing process. Prior to die attach, a laser scribe marks the lead frame of each of the devices with a coded hole matrix that gives each device a unique ID code. During die attach, an optical hole reader retrieves the ID code of each of the IC devices, and a computer system stores the retrieved ID codes in association with the lot numbers of the ICs attached to the lead frames. The ID codes of the devices are then read at each step in assembly so the devices can be tracked through assembly individually, rather than by lots. As a result, the devices can proceed through assembly in a more efficient, continuous manner (i.e., without breaks between lots).
-
Citations
26 Claims
-
1. An assembly method for a plurality of integrated circuit devices and a plurality of mounting substrates comprising:
-
providing a plurality of integrated circuit devices in multiple lots for assembling in a manufacturing process, each lot of the multiple lots having a plurality of integrated circuit devices therein; mounting each integrated circuit device of the plurality of integrated circuit devices to a mounting substrate of the plurality of mounting substrates; placing a substantially unique identification code on each mounting substrate of the plurality of mounting substrates in a readable position thereon; placing an identification code on each integrated circuit device of the plurality of integrated circuit devices; correlating the identification code of each integrated circuit device mounted on the mounting substrate with the substantially unique identification code of the mounting substrate; reading the substantially unique identification code of the mounting substrate of each integrated circuit device of the plurality of integrated circuit devices in each lot of the multiple lots; performing a series of assembly steps in the manufacturing process on the plurality of integrated circuit devices in the multiple lots, the series of assembly steps including; generating data related to the series of assembly steps of each integrated circuit device of the plurality of integrated circuit devices through the series of assembly steps; associating the data generated for each integrated circuit device of the plurality of integrated circuit devices with the substantially unique identification code of an associated mounting substrate of the plurality of mounting substrates for tracking the multiple lots of the plurality of integrated circuit devices; and at least one assembly step including one of die attach, die cure, wire bond, molding, deflash, lead finish, trim and form, and opens/shorts testing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. An assembly method for attaching a plurality of integrated circuit dice to a plurality of first substrates in multiple lots in a manufacturing method comprising:
-
attaching at least two integrated circuit dice of the plurality of integrated circuit dice on each first substrate of the plurality of first substrates; separating each integrated circuit die of the at least two integrated circuit dice on each first substrate of the plurality of first substrates, forming one integrated circuit die of a plurality of integrated circuit dice; providing a plurality of mounting substrates, each mounting substrate of the plurality of mounting substrates marked with a substantially unique identification code; providing a front-end identification code associated with each integrated circuit die of the plurality of integrated circuit dice; reading the front-end identification code associated with each integrated circuit die of the plurality of integrated circuit dice; reading the substantially unique identification code marked on each mounting substrate of the plurality of mounting substrates; attaching each integrated circuit die of the at least two integrated circuit dice attached to a first substrate to one mounting substrate of the plurality of mounting substrates for forming an integrated circuit device of a plurality of integrated circuit devices; storing the front-end identification code associated with each integrated circuit die of the plurality of integrated circuit dice in each integrated circuit device of the plurality of integrated circuit devices in association with the substantially unique identification code of an associated mounting substrate of the plurality of mounting substrates; performing an assembly step on each integrated circuit device of the plurality of integrated circuit devices including; advancing the plurality of integrated circuit devices through at least one assembly step in a substantially continuous manner; generating data related to the advancement of the plurality of integrated circuit devices through the at least one assembly step; and associating the data generated for each integrated circuit device of the plurality of integrated circuit devices with the substantially unique identification code of an associated mounting substrate of the plurality of mounting substrates so the plurality of integrated circuit devices may be tracked through the at least one assembly step; and back-end testing each integrated circuit device of the plurality of integrated circuit devices. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
-
Specification