Method and system for scheduling maintenance procedures based upon workload distribution
First Claim
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1. A method, comprising:
- providing a tool;
identifying a planned processing schedule for processing a plurality of wafer lots in said tool;
providing a controller that schedules a time for a maintenance procedure to be performed on said tool based upon said planned processing schedule of said plurality of wafer lots by identifying a number of potential conflicts between the maintenance procedure and the processing of said wafer lots at a plurality of times and selecting one of the times for scheduling the maintenance procedure based on the number of potential conflicts at the associated times.
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Abstract
The present invention is generally directed to various methods and systems for scheduling maintenance procedures based upon workload distribution. In one illustrative embodiment, the method includes providing a tool, identifying a planned processing schedule for processing a plurality of wafer lots in the tool, and providing a controller that schedules a time for a maintenance procedure to be performed on the tool based upon the planned processing schedule of the plurality of wafer lots.
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Citations
19 Claims
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1. A method, comprising:
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providing a tool; identifying a planned processing schedule for processing a plurality of wafer lots in said tool; providing a controller that schedules a time for a maintenance procedure to be performed on said tool based upon said planned processing schedule of said plurality of wafer lots by identifying a number of potential conflicts between the maintenance procedure and the processing of said wafer lots at a plurality of times and selecting one of the times for scheduling the maintenance procedure based on the number of potential conflicts at the associated times. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method, comprising:
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providing a tool; identifying a planned processing schedule for processing a plurality of wafer lots in said tool; providing a controller that changes a previously scheduled time for a maintenance procedure to be performed on said tool based upon said planned processing schedule of said plurality of wafer lots, wherein the controller identifies a number of potential conflicts between the maintenance procedure and the processing of said wafer lots at the previously scheduled time and at a plurality of other times and selects one of the other times having fewer potential conflicts than the previously scheduled time; and performing said maintenance procedure on said tool at said changed time. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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Specification