×

Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device

  • US 7,122,457 B2
  • Filed: 05/07/2004
  • Issued: 10/17/2006
  • Est. Priority Date: 05/13/2003
  • Status: Active Grant
First Claim
Patent Images

1. A semiconductor chip production method, comprising the steps of:

  • forming a front side recess in a semiconductor substrate having a front surface and a rear surface and including a functional device provided in the front surface thereof, the front side recess extending from the front surface of the semiconductor substrate along a thickness of the semiconductor substrate;

    depositing a metal material in the front side recess to form a front side electrode electrically connected to the functional device;

    removing a rear surface portion of the semiconductor substrate to reduce the thickness of the semiconductor substrate to a predetermined thickness which is greater than a depth of the front side recess;

    forming a rear side recess communicating with the front side recess in the rear surface of the semiconductor substrate after the thickness reducing step to form a continuous through-hole; and

    depositing a metal material in the rear side recess to form a rear side electrode electrically connected to the front side electrode for formation of a through-electrode extending through the semiconductor substrate.

View all claims
  • 5 Assignments
Timeline View
Assignment View
    ×
    ×