Power amplifier module for wireless communication devices
First Claim
1. A power amplifier module for amplifying radio frequency signals, comprising:
- a) a radio frequency power amplifier including one or more semiconductor transistors, adapted to receive an input radio frequency signal and a processed power-sensing control signal, and to output an amplified radio frequency signal; and
b) a power-sensing circuit adapted to receive the amplified radio frequency signal and to output the power-sensing control signal and a multi-layer three dimensional substrate having a conductive layer adapted to bond with an electrically conductive base;
c) a radio frequency transceiver coupled to the radio frequency power amplifier; and
d) a processor coupled to the radio frequency transceiver and to the vower sensing control signal.
1 Assignment
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Accused Products
Abstract
A power amplifier module for amplifying radio frequency signals includes a radio frequency power amplifier including one or more semiconductor transistors, adapted to receive an input radio frequency signal and power control signals, and to output an amplified radio frequency signal. The power amplifier module is integrated with input and output impedance matching networks and a power sensor that is adapted to receive the amplified radio frequency signal and to output a signal indicating the power output level of the power amplifier module. The power amplifier module also includes control logic in accordance to at least one of the qualities and the power level of the amplified radio frequency signal.
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Citations
20 Claims
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1. A power amplifier module for amplifying radio frequency signals, comprising:
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a) a radio frequency power amplifier including one or more semiconductor transistors, adapted to receive an input radio frequency signal and a processed power-sensing control signal, and to output an amplified radio frequency signal; and b) a power-sensing circuit adapted to receive the amplified radio frequency signal and to output the power-sensing control signal and a multi-layer three dimensional substrate having a conductive layer adapted to bond with an electrically conductive base; c) a radio frequency transceiver coupled to the radio frequency power amplifier; and d) a processor coupled to the radio frequency transceiver and to the vower sensing control signal. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A wireless communication device for transmitting and receiving radio frequency signals, comprising
a) a power amplifier module for amplifying radio frequency signals, comprising: -
i) a radio frequency power amplifier including one or more semiconductor transistors, adapted to receive an input radio frequency signal and a processed power-sensing control signal, and to output an amplified radio frequency signal having a quality; and ii) a power-sensing circuit to receive the amplified radio frequency signal and to output the processed power-sensing control signal in response to a quality or a magnitude of the amplified radio frequency signal and a multi-layer three dimensional substrate having a conductive layer adapted to bond with an electrically conductive base, and b) an antenna adapted to provide the input radio frequency signal to the power amplifier module and to receive the output radio frequency signal from the power amplifier module c) a radio frequency transceiver coupled to the radio frequency power amplifier; and
d) a processor coupled to the radio frequency transceiver and to the power sensing control signal. - View Dependent Claims (13, 14, 15, 16, 17)
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18. A power amplifier module for amplifying radio frequency signals, comprising:
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a) an electronic circuit including i) a radio frequency power amplifier including one or more semiconductor transistors, adapted to receive an input radio frequency signal and a power-sensing control signal, and to output an amplified radio frequency signal; ii) a power-sensing circuit adapted to receive the amplified radio frequency signal and to output the power-sensing control signal; iii) an electrically conductive base; and b) a multi-layer three dimensional substrate having a conductive layer adapted to bond with the electrically conductive base c) a radio frequency transceiver coupled to the radio frequency power amplifier; and
d) a processor coupled to the radio frequency transceiver and to the power sensing control signal. - View Dependent Claims (19, 20)
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Specification