Lithographic projection assembly, substrate handling apparatus and substrate handling method

• US 7,123,349 B2
• Filed: 03/11/2004
• Issued: 10/17/2006
• Est. Priority Date: 03/11/2003
• Status: Expired due to Fees

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Hoogkamp, Jan Frederik, Klomp, Albert Jan Hendrik, Van Groos, Pieter Johannes Marius, Onvlee, Johannes, Visser, Raimond, Hennus, Pieter Renaat Maria
• Primary Examiner(s): Kim, Peter B.
• Application Number:
  US10/797,657
• Publication Number:
  US 20040218168A1
• Time in Patent Office: 950 Days
• Field of Search: 355/53, 355/72
• US Class Current: 355/72
• CPC Class Codes: G03F 7/70733 Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
• CPC Class Codes: G03F 7/7075 Handling workpieces outside exposure position, e.g. SMIF box
• CPC Class Codes: G03F 7/70808 Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
• CPC Class Codes: G03F 7/70841 Constructional issues related to vacuum environment, e.g. load-lock chamber
• CPC Class Codes: G03F 7/70858 Environment aspects, e.g. pressure of beam-path gas, temperature pollution aspects G03F7/70916
• CPC Class Codes: G03F 7/70875 Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
• CPC Class Codes: G03F 7/70991 Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
• CPC Class Codes: H01L 21/67201 characterized by the construction of the load-lock chamber
• CPC Class Codes: H01L 21/67225 comprising at least one lithography chamber lithographic apparatuses G03F7/00

Abstract

The invention relates to a lithographic projection assembly, having at least two load locks for transferring substrates between a first environment and a lower pressure second environment, a substrate handler with a handler chamber within the second environment and a lithographic projection apparatus including a projection chamber. The handler chamber and the projection chamber communicate via a load position for entering a substrate from the handler chanter into the projection chamber and an unload position for removing the substrate from the projection chamber into the handler chamber. The handler chamber also includes pre-processing means for pre-processing of the substrates and transport means for transferring substrates between the load locks and pre-processing means.

Claims

1. A lithographic projection assembly, comprising:

a radiation system configured to provide a beam of radiation;

a support structure configured to support a patterning device that imparts a desired pattern onto said beam of radiation;

a substrate holder configured to hold a substrate;

a first load lock and a second load lock for transferring said substrate between a first environment and a second environment, said second environment configured to have a lower pressure than said first environment;

a third load lock for transferring objects from a third environment to the second environment, said third load lock being accessible from a side facing the third environment;

a lithographic projection apparatus comprising a projection chamber in which said substrate is processed by projecting said patterned beam onto a target portion of the substrate; and

a substrate handler comprising a handler chamber within said second environment, said handler chamber and said projection chamber communicate via a load position for inputting said substrate from said handler chamber into said projection chamber and an unload position for removing said substrate from said projection chamber into said handler chamber, said handler chamber comprising;

a pre-processing system configured to perform pre-processing tasks on said substrate prior to being processed in said projection chamber, and

a transport system configured to transfer said substrate from said load locks to said pre-processing system, transfer said substrate from said pre-processing system to said load position, and transfer said substrate from said unload position to said load locks.

2. The lithographic projection assembly according to claim 1, wherein said projection chamber is a vacuum chamber and said lithographic projection apparatus comprises vacuum means for establishing or maintaining a vacuum in the vacuum chamber.

3. The lithographic projection assembly according to claim 1, wherein said pre-processing system comprises a pre-alignment mechanism configured to pre-align said substrate.

4. The lithographic projection assembly according claim 1, wherein said transport system comprises a single manipulator provided with a first gripper and wherein said lithographic projection assembly comprises a control mechanism adapted to control said gripper to (a) pick up said substrate from one of said load locks and transfer to said pre-processing system, (b) to pick up said substrate from said pre-processing system and transfer to said load position, and (c) pick up said substrate from said unload position and transfer to one of said load locks.

5. The lithographic projection assembly claim 4, wherein said control mechanism is adapted to control said load locks independently of each other.

6. The lithographic projection assembly according to claim 1, wherein said transport system comprises a first manipulator provided with a first gripper, and a second manipulator provided with a second gripper, and wherein said lithographic projection assembly comprises a control mechanism adapted to control said first and second manipulators to (a) pick up said substrate with the first gripper from one of said load locks and transfer to said pre-processing system, (b) pick up said substrate with the second gripper from said pre-processing system and transfer to said load position, and (c) pick up said substrate with the first gripper, from said unload position and transfer to one of said load locks.

7. The lithographic projection assembly according to claim 6, wherein at least one of said first and second grippers is provided with a thermal treatment mechanism configured to perform at least one of bringing said substrate to a predetermined temperature, equalizing the temperature across said substrates, and conditioning the temperature of said substrate.

8. The lithographic projection assembly according to claim 6, wherein said first and second load locks and said first or second manipulator is positioned in order to cooperate with said first and second load locks.

9. The lithographic projection assembly according to claim 1, wherein each of said first and second load locks are formed as a two-way load lock.

10. The lithographic projection assembly according to claim 1, wherein each of said first and second load locks are provided with first and second substrate support positions.

11. The lithographic projection assembly according to claim 1, wherein said first and second load locks are connected to a substrate track for supply and removal of substrate to and from said first and second load locks.

12. The lithographic projection assembly according to claim 1, wherein said control mechanism is configured to (a) place said substrate into said third load lock, (b) keep an external door of said third load lock closed while said placed substrate is in said third load lock, and (c) pick up and transfer said placed substrate after having transferred other substrates with said transport mechanism.

13. The lithographic projection assembly claim 1, wherein at least one of first and second load locks comprises a side door for transferring objects from a fourth environment to said second environment, said side door facing the fourth environment and being accessible.

14. The lithographic projection assembly claim 1, wherein said pre-processing system is provided with a thermal treatment mechanism configured to perform at least one of bringing said substrates to a predetermined temperature, equalizing the temperature across said substrates, and conditioning the temperature of said substrates.

15. The lithographic projection assembly claim 1, wherein said substrate comprises a semiconductor wafer.

16. A lithographic substrate handler assembly, comprising:

a first load lock and a second load lock for transferring said substrate between a first environment and a second environment, said second environment configured to have a lower pressure than said first environment;

a third load lock for transferring objects from a third environment to the second environment, said third load lock being accessible from a side facing the third environment; and

a substrate handler comprising a handler chamber within said second environment, said handler chamber and a next station communicate via a load position for inputting said substrate from said handler chamber into said next station and an unload position for removing said substrate from said next station into said handler chamber, said handler chamber comprising;

a pre-processing system configured to perform pre-processing tasks to treat said substrate prior to being processed; and

a transport system configured to transfer said substrate from said load locks to said pre-processing system, transfer said substrate from said pre-processing system to said load position, and transfer said substrate from said unload position to said load looks.

17. The lithographic substrate handler assembly of claim 16, comprising a track and said first load lock and said second load lock being arranged between said track and said substrate handler.

18. A lithographic projection assembly, comprising:

a first and a second load lock for transferring substrates between a first environment and a second environment, said second environment having a lower pressure than said first environment, wherein at least one of said first and second load locks is provided with a first and a second substrate support position;

a third load lock for transferring objects from a third environment to the second environment, said third load lock being accessible from a side facing the third environment;

a substrate handler comprising a handler chamber within said second environment;

a lithographic projection apparatus comprising a projection chamber to process said substrates;

wherein said handler chamber and said projection chamber communicate through a load position for inputting said substrates from said handler chamber into said projection chamber and an unload position for removing said substrates from said projection chamber into said handler chamber; and

wherein said handler chamber is provided with pre-processing system for treating said substrates prior to being processed in said projection chamber and a transport system configured to transfer said substrates from said load locks to said pre-processing system, from said pre-processing system to said load position, and to transfer said substrates from said unload position to said load locks.