Method and apparatus for the monitoring and control of a semiconductor manufacturing process

• US 7,123,980 B2
• Filed: 03/23/2005
• Issued: 10/17/2006
• Est. Priority Date: 09/30/2002
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Funk, Merritt, Peterson, Raymond
• Primary Examiner(s): Gandhi, Jayprakash N.
• Application Number:
  US11/087,071
• Publication Number:
  US 20050187649A1
• Time in Patent Office: 573 Days
• Field of Search: 700/121, 700/96, 700/32, 700/95, 700/117
• US Class Current: 700/121
• CPC Class Codes: G05B 19/4184 characterised by fault tolerance, reliability of production system
• CPC Class Codes: G05B 19/41865 characterised by job scheduling, process planning, material flow
• CPC Class Codes: G05B 2219/31186 TCP-IP internet protocol
• CPC Class Codes: G05B 2219/32126 Hyperlink, access to program modules and to hardware modules in www, web server, browser
• CPC Class Codes: G05B 2219/32128 Gui graphical user interface
• CPC Class Codes: G05B 2219/33148 CLS client server architecture, client consumes, server provides services
• CPC Class Codes: G05B 2219/33225 Interface nc machine to data server
• CPC Class Codes: G05B 2219/45031 Manufacturing semiconductor wafers
• CPC Class Codes: G05B 23/0259 characterized by the response to fault detection
• CPC Class Codes: G05B 23/0264 Control of logging system, e.g. decision on which data to store; time-stamping measurements
• CPC Class Codes: G05B 23/0267 Fault communication, e.g. human machine interface [HMI]
• CPC Class Codes: H01L 21/67276 Production flow monitoring, e.g. for increasing throughput program-control systems per se G05B19/00, e.g. total factory control G05B19/418
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
• CPC Class Codes: Y02P 90/80 Management or planning

Abstract

An Advanced Process Control (APC) system including Graphical User Interfaces (GUIs) is presented for monitoring and controlling a semiconductor manufacturing process that is performed by a semiconductor processing system. The semiconductor processing system includes a number of processing tools, a number of processing modules (chambers), and a number of sensors, and the APC system comprises an APC server, database, interface server, client workstation, and GUI component. The GUI is web-based and is viewable by a user using a web browser.

Claims

1. An Advanced Process Control (APC) system for controlling a processing tool in a semiconductor processing environment, the APC system comprising:

an APC server providing a plurality of APC related applications;

an Interface Server (IS) coupled to the APC server;

a database coupled to the IS and APC server; and

a graphical user interface (GUD component coupled to the APC server,

wherein the IS comprises means for coupling to a plurality of process modules, means for coupling to a plurality of sensors, and means for coupling to the processing tool that comprises a tool agent in the processing tool and an agent client in the APC system, the agent client including an agent client communication class and a driver.

2. The APC system as claimed in claim 1, wherein the means for coupling to a plurality of sensors comprises means for coupling to an Optical Emissions Spectrum (OES) sensor.

3. The APC system as claimed in claim 2, wherein the means for coupling to the OES sensor comprises a TCP/IP connection.

4. The APC system as claimed in claim 1, wherein the means for coupling to a plurality of process modules comprises means for coupling to an Optical Data Profile (ODP) module.

5. The APC system as claimed in claim 4, wherein the means for coupling to an ODP module comprises means for coupling to an ODP library.

6. The APC system as claimed in claim 1, wherein the means for coupling to a plurality of sensors comprises means for coupling to a voltage/current (V/I) probe.

7. The APC system as claimed in claim 6, wherein the means for coupling to the V/I probe comprises a TCP/IP connection.

9. The APC system as claimed in claim 1, further comprising means for coupling to a factory system.

10. The APC system as claimed in claim 1, wherein the APC system further comprises means for coupling to an analog probe.

11. The APC system as claimed in claim 10, wherein the means for coupling to the analog probe comprises a TCP/IP connection.

12. The APC system as claimed in claim 1, wherein the means for coupling to a plurality of process modules comprises means for coupling to an etching module.

13. The APC system as claimed in claim 11, wherein the means for coupling to a plurality of process modules comprises means for coupling to a deposition module.

14. The APC system as claimed in claim 1, wherein the means for coupling to a plurality of sensors comprises means for coupling to a sensor recorder base class that creates a Distributed Message Hub (DMH) client.

15. The APC system as claimed in claim 1, wherein the agent client communication class communicates with the tool agent via Berkeley sockets application programming interface (BSD sockets) and comprises at least one of a start agent method, an event receive thread, a get next message method, and a stop agent method.

16. The APC system as claimed in claim 1, wherein the APC server comprises a storage device having at least 3 GB of available disk space;

a processor comprising at least two 600 MHz CPUs, and physical memory comprising at least 512 Mb of RAM.

17. The APC system as claimed in claim 1, wherein the APC server provides a plurality of applications, including at least one tool-related application, at least one module-related application, at least one sensor-related application, at least one IS-related application, at least one database-related application, and at least one GUI-related application.

18. The APC system as claimed in claim 1, wherein the APC server provides a plurality of applications, including at least one of a tool APC master application;

a tool ARC alarm application;

one or more sensor interface applications;

an APC database management support application;

an APC data collection support application;

an APC event management support application;

a probe interface application;

an APC process chamber support application;

an APC strategy selection application;

a tool interface application;

a wafer data application; and

an APC Plan Executor (PE) application.

19. The APC system as claimed in claim 18, wherein the tool APC master application performs a plurality of functions, including at least one of a shut down all method, an initialization method, a logic manager boost method, a load configuration method, a load state method, a save configuration method, and an update GUI time method.

20. The APC system as claimed in claim 18, wherein the APC event management support application is configured to dispatch methods based on events.

21. The APC system as claimed in claim 18, wherein the APC event management support application performs a plurality of methods, including at least one of an active event method, a file ready method, an alarm method, a lot end method, a lot, start method, a recipe end method, a recipe start method, a (radio frequency) RF off method, a RF on method, a wafer in method, and a wafer out method.

22. The APC system as claimed in claim 18, wherein the APC data collection support application performs a number of methods, including at least one of a get lot data function, a get wafer data function, a setup sensors function, a start sensors function, a stop sensors function, and a load default plans function.

23. The APC system as claimed in claim 18, wherein the tool interface application is configured to manage a tool interface, file transfer, and status.

24. The APC system as claimed in claim 18, wherein the tool interface application performs a plurality of methods, including at least one of a change event method, a device failed method, a device recovery method, an active event method, a check active method, an event dispatcher method, an event receiver method, a get trace data method, a start agent method, and a stop agent method.

25. The APC system as claimed in claim 18, wherein the APC PE application is configured to determine which strategy to run, the strategy specifying a set of plans that is active at any given time.

26. The APC system as claimed in claim 18, wherein the APC PE application is configured to use context information to determine which strategy to run.

27. The APC system as claimed in claim 1, wherein the database comprises a plurality of tables, including at least one of a component table, an attribute table, a run attributes table, an associations table, a process run table, a device run table, a raw run data table, a model data table, a run summary table, and an alarm table, wherein the component table is used to configure components of the APC system and each component in the components table can have multiple associated records in the attribute table.

28. The APC system as claimed in claim 27, wherein the process run table comprises context items, including start time, wafer, and material type.

29. The APC system as claimed in claim 27, wherein the device run table comprises setup and operating parameters for a sensor.

30. The APC system as claimed in claim 27, wherein the raw run data table comprises raw observation data.

31. The APC system as claimed in claim 27, wherein the model data table can be a dynamically created table to hold in put and output data for model analysis.

32. The APC system as claimed in claim 27, wherein the run summary table comprises run summary information, including a run ID, a run type, a value name, a start step, and end step, a value minimum, and a value maximum.

8. The APC system as claimed in claim l, further comprising means for coupling to an E-diagnostics system.

33. A method for using an Advanced Process Control (APC) system for controlling a processing tool in a semiconductor processing environment, the method comprising:

providing an APC server providing a plurality of APC related applications;

providing an Interface Server (IS) coupled to the APC server;

providing a database coupled to the IS and APC server; and

providing a graphical user interface (GUI) component coupled to the APC server,

wherein the IS comprises means for coupling to plurality of process modules, means for coupling to a plurality of sensors, and means for coupling to the processing tool that comprises a tool agent in the processing tool and an agent client in the APC system, the agent client including an agent client communication class and a driver.