Camera module having a threaded lens barrel and a ball grid array connecting device

• US 7,126,111 B2
• Filed: 04/28/2005
• Issued: 10/24/2006
• Est. Priority Date: 12/08/1999
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Webster, Steven
• Primary Examiner(s): LE, QUE TAN
• Application Number:
  US11/119,234
• Publication Number:
  US 20050242274A1
• Time in Patent Office: 544 Days
• Field of Search: 250/239, 250/208.1
• US Class Current: 250/239
• CPC Class Codes: G02B 7/02 for lenses supports for magnifying lenses G02B25/002
• CPC Class Codes: G02B 7/022 lens and mount having complementary engagement means, e.g. screw/thread
• CPC Class Codes: H01L 2224/32013 the layer connector being larger than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0232 : Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H01L 31/02325 : the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/54 : Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 : Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 : Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: Y10T 29/49002 : Electrical device making

Abstract

An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.

Claims

1. A camera module, comprising:

a substrate;

an image sensor comprising an active area for receiving light, said image sensor being coupled to a first surface of said substrate;

a lens mount coupled to said substrate, said lens mount comprising a threaded aperture;

a lens barrel comprising a threaded cylindrical surface, said lens barrel inserted into said threaded aperture of said lens mount; and

a means for electrically connecting said camera module to a larger substrate, said means for electrically connecting comprising a ball grid array.

2. The camera module of claim 1 wherein said camera module is mounted on a larger substrate.

3. The camera module of claim 1 wherein said camera module is electrically connected to a larger substrate.

4. The camera module of claim 1 further comprising an adhesive layer coupling said lens mount to said substrate.

5. The camera module of claim 4 wherein said lens mount is attached to a periphery of said first surface of said substrate by said adhesive layer.

6. The camera module of claim 1 wherein said lens barrel comprises an optical element.

7. The camera module of claim 6 wherein said optical element comprises at least one lens.

8. The camera module of claim 6 wherein said optical element focuses said light on said active area.

9. The camera module of claim 6 wherein rotation of said lens barrel moves said optical element relative to said active area.

10. The camera module of claim 1 wherein said means for electrically connecting is coupled to a second surface of said substrate.

11. The camera module of claim 1 wherein a longitudinal axis of said threaded aperture of said lens mount is perpendicular to a plane parallel to said active area of said image sensor.

12. The camera module of claim 1 wherein bond pads of said image sensor are coupled to traces of said substrate.

13. The cameral module of claim 1 further comprising bond wires coupling bond pads of said image sensor to traces of said substrate.

14. A camera module, comprising:

a substrate;

an image sensor comprising an active area for receiving light, said image sensor being coupled to a first surface of said substrate;

a lens mount coupled to said substrate, said lens mount comprising a threaded interior cylindrical surface defining an aperture;

a lens barrel inserted into said aperture of said lens mount; and

a means for electrically connecting said camera module to a larger substrate, said means for electrically connecting comprising a land grid array.

15. The camera module of claim 14 wherein said lens barrel comprises a threaded exterior cylindrical surface.

16. The camera module of claim 15 wherein said threaded exterior cylindrical surface of said lens barrel is threadedly attached to said threaded interior cylindrical surface of said lens mount.

17. The camera module of claim 16 wherein rotation of said lens barrel in a first direction moves said lens barrel towards said image sensor.

18. The camera module of claim 17 wherein rotation of said lens barrel in a second direction moves said lens barrel away from said image sensor.

19. A camera module comprising:

a substrate;

an image sensor comprising an active area for receiving light, said image sensor being coupled to said substrate;

bond wires coupling bond pads of said image sensor to traces of said substrate;

a lens mount comprising a threaded aperture;

an adhesive layer coupling said lens mount to said substrate;

a lens barrel inserted into said threaded aperture of said lens mount, said lens barrel comprising an optical element for focusing said light on said active area of said image sensor; and

a means for electrically connecting said camera module to a larger substrate, said means for electrically connecting selected from the group consisting of a ball grid array, a land grid array and a leadless chip carrier.