Method for identifying a defective die site

• US 7,127,365 B2
• Filed: 08/06/2003
• Issued: 10/24/2006
• Est. Priority Date: 08/30/2000
• Status: Expired due to Fees

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Rumsey, Brad D.
• Primary Examiner(s): Nghiem, Michael
• Assistant Examiner(s): Sun, Xiuqin
• Application Number:
  US10/636,329
• Publication Number:
  US 20040030517A1
• Time in Patent Office: 1,175 Days
• Field of Search: 702/82, 702/36, 257/678, 438/17, 430/5, 283/87, 382/149, 439/73, 256/678, 235/454
• US Class Current: 702/82
• CPC Class Codes: H01L 21/67282 Marking devices
• CPC Class Codes: H01L 21/67288 Monitoring of warpage, curvature, damage, defects or the like
• CPC Class Codes: H01L 2223/5442 comprising non digital, non alphanumeric information, e.g. symbols
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits

Abstract

The present invention relates to the marking and identification of defective die sites on a mounting substrate. A mounting substrate is provided which is inspected and tested for visual and electrical defects. Information relating to the functionality and/or various defects of one or more die sites is then encoded in the form of a designator placed on the substrate. The information encoded on the designator may then be read or scanned by, for example, computer-driven video equipment and used in a die-attach process to discriminately place semiconductor dice only on known good die sites. Embodiments of the designator include information encoded in the form of a bar code, a series of identifying marks, a strip of magnetic tape or a computerized map of a mounting substrate. Correlated data regarding die site functionality can then be electronically transferred to a die-bonding apparatus.

Claims

1. A method for identifying at least one defective semiconductor die site on a substrate, comprising:

providing a substrate having at least one semiconductor die site for at least one semiconductor die;

inspecting the at least one semiconductor die site for defects; and

forming a descriptor on a surface of the substrate by adhering a magnetic strip to the surface of the substrate, the descriptor including encoded information in the form of a computerized map of the substrate and relating to the presence or absence of defects associated with the at least one semiconductor die site.

2. The method according to claim 1, wherein forming a descriptor comprises forming the descriptor as a plurality of marks selected from the group consisting of alphanumeric characters, symbols, colors, binary sequences and combinations thereof.

3. The method according to claim 1, wherein forming a descriptor comprises forming a bar code.

4. A method for identifying at least one defective semiconductor die site on a substrate, comprising:

providing a substrate having at least one semiconductor die site for at least one semiconductor die;

inspecting the at least one semiconductor die site for defects; and

forming a descriptor on a surface of the substrate, the descriptor including encoded information in the form of a computerized map of the substrate, the encoded information relating to the presence or absence of defects associated with the at least one semiconductor die site.

5. The method according to claim 4, further comprising:

reading at least one of the descriptor on the surface of the substrate and the computerized map to determine known good die sites.

6. A method for identifying at least one defective semiconductor die site on a substrate, comprising:

providing a substrate having at least one semiconductor die site for at least one semiconductor die;

inspecting the at least one semiconductor die site for defects; and

forming a descriptor on a surface of the substrate, the descriptor including encoded information relating to the presence or absence of defects associated with the at least one semiconductor die site, the descriptor formed by one of the group consisting of photolithography or chemical vapor deposition.

7. A method for identifying at least one defective semiconductor die site on a substrate, comprising:

providing a substrate having at least one semiconductor die site for at least one semiconductor die;

inspecting the at least one semiconductor die site for defects; and

forming a descriptor on a surface of the substrate by forming marks in the surface of the substrate with optical energy, the descriptor including encoded information relating to the presence or absence of defects associated with the at least one semiconductor die site.

8. The method according to claim 7, further comprising:

forcing air over the substrate while forming marks in the surface of the substrate with optical energy.

9. The method according to claim 7, further comprising:

coating at least part of the surface of the substrate with a material resistant to releasing volatile materials prior to forming marks in the surface of the substrate with optical energy.

10. The method according to claim 7, wherein forming marks in the surface of the substrate with optical energy comprises forming marks to a microscopic depth in the surface of the substrate with a low-powered laser.

11. A method for identifying at least one defective semiconductor die site on a substrate, comprising:

providing a substrate having a plurality of semiconductor die sites for at least one semiconductor die;

inspecting the plurality of semiconductor die sites for defects;

forming a descriptor on a surface of the substrate including information relating to the presence or absence of defects associated with the plurality of semiconductor die sites;

reading the descriptor to obtain a semiconductor die site defect percentage; and

discarding the substrate if the defect percentage exceeds a threshold percentage.