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Method of producing solid state pickup device

  • US 7,127,793 B2
  • Filed: 04/24/2003
  • Issued: 10/31/2006
  • Est. Priority Date: 04/24/2002
  • Status: Expired due to Fees
First Claim
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1. A method of producing a solid state pickup device, comprising steps of:

  • forming imaging elements on a wafer in a matrix form, each of said imaging elements having a light receiving surface and a plurality of contact points;

    forming receiving surface border portions on a glass plate to protrude therefrom in a matrix form by etching said glass plate;

    attaching said receiving surface border portions of said glass plate to said wafer to surround said light receiving surface in each of said receiving surface border portions, said light receiving surface being spaced from said glass plate;

    dicing said glass plate outside respectively said receiving surface border portions, to form shield glass for covering said light receiving surface; and

    dicing said wafer for each of said imaging elements, to obtain said solid state pickup device having said shield glass and one of said imaging elements.

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