Method of producing solid state pickup device
First Claim
1. A method of producing a solid state pickup device, comprising steps of:
- forming imaging elements on a wafer in a matrix form, each of said imaging elements having a light receiving surface and a plurality of contact points;
forming receiving surface border portions on a glass plate to protrude therefrom in a matrix form by etching said glass plate;
attaching said receiving surface border portions of said glass plate to said wafer to surround said light receiving surface in each of said receiving surface border portions, said light receiving surface being spaced from said glass plate;
dicing said glass plate outside respectively said receiving surface border portions, to form shield glass for covering said light receiving surface; and
dicing said wafer for each of said imaging elements, to obtain said solid state pickup device having said shield glass and one of said imaging elements.
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Accused Products
Abstract
A producing method of producing a solid state pickup device is provided. Imaging elements are formed on a wafer in a matrix form. Each of the imaging elements has a light receiving surface and plural contact points. Receiving surface border portions are formed on a glass plate to protrude therefrom in a matrix form by etching. The receiving surface border portions are attached to the wafer to surround the light receiving surface in each of the receiving surface border portions. The light receiving surface is spaced from the glass plate. The glass plate is diced outside respectively the receiving surface border portions, to form shield glass for covering the light receiving surface. The wafer is diced for each of the imaging elements, to obtain the solid state pickup device having the shield glass and one of the imaging elements.
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Citations
7 Claims
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1. A method of producing a solid state pickup device, comprising steps of:
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forming imaging elements on a wafer in a matrix form, each of said imaging elements having a light receiving surface and a plurality of contact points; forming receiving surface border portions on a glass plate to protrude therefrom in a matrix form by etching said glass plate; attaching said receiving surface border portions of said glass plate to said wafer to surround said light receiving surface in each of said receiving surface border portions, said light receiving surface being spaced from said glass plate; dicing said glass plate outside respectively said receiving surface border portions, to form shield glass for covering said light receiving surface; and dicing said wafer for each of said imaging elements, to obtain said solid state pickup device having said shield glass and one of said imaging elements. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification