Method of manufacturing electronic device including aligning first substrate, second substrate and mask, and transferring object from first substrate to second substrate, including irradiating object on first substrate with light through mask

• US 7,127,810 B2
• Filed: 04/23/2003
• Issued: 10/31/2006
• Est. Priority Date: 04/25/2002
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Kamakura, Tomoyuki, Tsuchihashi, Fukumi, Miyazawa, Wakao, Kasuga, Masashi
• Primary Examiner(s): CHANG, RICK KILTAE
• Application Number:
  US10/420,882
• Publication Number:
  US 20040000368A1
• Time in Patent Office: 1,287 Days
• Field of Search: 298/32, 298/30, 298/33, 298/40, 297/39, 297/40, 297/12, 430/5, 430/126, 430/311, 356/401, 356/399, 356/400, 250/548
• US Class Current: 29/833
• CPC Class Codes: B23K 26/0608 in the same heat affected zone [HAZ] B23K26/0613, B23K26/0619 take precedence
• CPC Class Codes: B23K 26/066 by using masks
• CPC Class Codes: B23K 26/067 Dividing the beam into multiple beams, e.g. multifocusing
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H10K 71/162 using laser ablation
• CPC Class Codes: H10K 71/18 using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49131 by utilizing optical sighting device
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/53052 including position sensor
• CPC Class Codes: Y10T 29/53087 with signal, scale, illuminator, or optical viewer
• CPC Class Codes: Y10T 29/53091 for work-holder for assembly or disassembly
• CPC Class Codes: Y10T 29/5313 Means to assemble electrical device
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53187 Multiple station assembly apparatus
• CPC Class Codes: Y10T 29/53196 Means to apply magnetic force directly to position or hold work part

Abstract

A method of manufacturing an electronic device includes providing a mask substrate, a first substrate on which an object to be transferred is formed, and a second substrate to which the object is to be transferred, adjusting positions of the mask substrate, the first substrate and the second substrate so that an alignment mark formed on one of the substrates (a reference substrate) and alignment marks formed on other two of the substrates are aligned with each other, and transferring the object to be transferred from the first substrate to the second substrate, the transferring step including irradiating the object to be transferred from the first substrate with light transmitted through the mask substrate.

Claims

1. A method of manufacturing an electronic device, the method comprising:

selecting one of a mask substrate, a first substrate on which a physical object to be transferred is formed, and a second substrate to which the physical object is to be transferred, as a reference substrate for alignment;

adjusting positions of the mask substrate, the first substrate and the second substrate so that an alignment mark formed on the reference substrate and alignment marks formed on other two of the mask substrate, the first substrate and the second substrate are aligned with each other; and

transferring the physical object from the first substrate to the second substrate, the transferring of the physical object including irradiating the physical object to be transferred with light transmitted through the mask substrate.

2. The method according to claim 1, the mask substrate having a plurality of windows that transmit light to the physical object to be transferred.

3. The method according to claim 2, the irradiating of the physical object to be transferred including branching a beam of light with a branching unit including at least one of a diffraction grating and a plurality of optical fibers.

4. The method according to claim 1, further comprising:

adhering the first substrate and the second substrate, the adhering of the first substrate and the second substrate being carried out before the transferring of the physical object from the first substrate to the second substrate.

5. The method according to claim 4, the transferring of the physical object from the first substrate to the second substrate further including separating the first substrate and the second substrate.

6. The method according to claim 1, further comprising:

transporting the second substrate to a bed using a substrate transporting unit; and

fixing the second substrate on the bed.

7. A method of manufacturing an electronic device, the method comprising:

providing a first substrate on which a physical object to be transferred and a first alignment mark are formed, a second substrate on which a second alignment mark is formed, and a mask substrate on which a third alignment mark is formed;

aligning the second alignment mark formed on the second substrate and the third alignment mark formed on the mask substrate;

aligning the first alignment mark formed on the first substrate with the second alignment mark formed on the second substrate; and

transferring the physical object from the first substrate to the second substrate, the transferring of the physical object including irradiating the physical object to be transferred with light transmitted through the mask substrate.

8. The method according to claim 7, further comprising:

adhering the first substrate and the second substrate, the adhering of the first substrate and the second substrate being carried out before the transferring of the physical object from the first substrate to the second substrate.

9. The method according to claim 8, the transferring of the physical object from the first substrate to the second substrate further including separating the first substrate and the second substrate.

10. The method according to claim 7, further comprising:

transporting the second substrate to a bed using a substrate transporting unit; and

fixing the second substrate on the bed.

11. A method of manufacturing an electronic device, the method comprising:

providing a first substrate on which a physical object to be transferred and a first alignment mark are formed, a second substrate on which a second alignment mark is formed, and a mask substrate on which a third alignment mark is formed;

aligning the first alignment mark formed on the first substrate with the third alignment mark formed on the mask substrate;

aligning the second alignment mark formed on the second substrate with the first alignment mark formed on the first substrate; and

transferring the physical object from the first substrate to the second substrate, the transferring of the physical object including irradiating the physical object to be transferred with light transmitted through the mask substrate.

12. The method according to claim 11, further comprising:

adhering the first substrate and the second substrate, the adhering of the first substrate and the second substrate being carried out before the transferring of the physical object from the first substrate to the second substrate.

13. The method according to claim 12, the transferring of the physical object from the first substrate to the second substrate further including separating the first substrate and the second substrate.

14. The method according to claim 11, further comprising:

transporting the second substrate to a bed using a substrate transporting unit; and

fixing the second substrate on the bed.

15. A method of manufacturing an electronic device, the method comprising:

providing a first substrate on which a physical object to be transferred and a first alignment mark are formed, a second substrate on which a second alignment mark is formed, and a mask substrate on which a third alignment mark is formed;

aligning the first alignment mark formed on the first substrate with the third alignment mark formed on the mask substrate;

aligning the second alignment mark formed on the second substrate with the third alignment mark formed on the mask substrate; and

transferring the physical object from the first substrate to the second substrate, the transferring of the physical object including irradiating the physical object to be transferred with light transmitted through the mask substrate.

16. The method according to claim 15, further comprising:

adhering the first substrate and the second substrate, the adhering of the first substrate and the second substrate being carried out before the transferring of the physical object from the first substrate to the second substrate.

17. The method according to claim 16, the transferring of the physical object from the first substrate to the second substrate further including separating the first substrate and the second substrate.

18. The method according to claim 15, further comprising:

transporting the second substrate to a bed using a substrate transporting unit; and

fixing the second substrate on the bed.