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Method of manufacturing an IC coil mounted in an information carrier

  • US 7,129,145 B2
  • Filed: 10/22/2004
  • Issued: 10/31/2006
  • Est. Priority Date: 02/24/1999
  • Status: Expired due to Fees
First Claim
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1. A method of manufacturing an IC element, characterized in that said method comprises a step of forming uniformly a metal-sputtered layer or alternatively a metal-evaporated layer on a surface passivation film of a finished wafer manufactured through a predetermined process, a step of forming uniformly a photoresist layer on said metal-sputtered layer or alternatively on said metal-evaporated layer, a step of forming in said photoresist layer a predetermined pattern inclusive of a coil for contactless data communication with external equipment through light exposure and development to thereby expose said metal-sputtered layer or alternatively said metal-evaporated layer through said predetermined pattern, a step of laminating a metal-plated layer on exposed portions of said metal-sputtered layer or alternatively said metal-evaporated layer through an electroless plating method or alternatively an electroplating method or alternatively a precision electroforming method, a step of eliminating the photoresist layer deposited on said finished wafer, a step of forming a predetermined conductor pattern corresponding to said predetermined pattern by etching said metal-sputtered layer or alternatively said metal-evaporated layer exposed through said metal-plated layer, and a step of obtaining concerned IC elements each formed integrally with a coil by scribing said finished wafer.

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