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Wire-bondable image sensor having integral contaminant shadowing reduction structure

  • US 7,129,459 B2
  • Filed: 12/23/2004
  • Issued: 10/31/2006
  • Est. Priority Date: 12/23/2004
  • Status: Active Grant
First Claim
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1. An image sensor, comprising:

  • a substrate having a side supporting at least one imaging area and at least one wirebonding area;

    light detectors constructed and arranged to receive light through the imaging area;

    bond pads exposed in the wirebonding area for connecting to respective bond wires; and

    a contaminant shadowing reduction structure on the imaging area having an exposed contaminant displacement surface over the imaging area and separated from the imaging area by a distance of at least 300 μ

    m, wherein the contaminant shadowing reduction structure comprises organic material that has a thickness of at least 200 μ

    m and is substantially transparent to radiation within an operative wavelength range specified for the image sensor, the organic material having dispersed therein at least one infrared light absorbing dye and being patterned so that the bond pads are free of any overlying portions of the organic material.

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