Field effect transistors including vertically oriented gate electrodes extending inside vertically protruding portions of a substrate
First Claim
1. A field effect transistor, comprising:
- a vertically protruding thin-body portion of a semiconductor substrate having a first cavity defined by opposing sidewalls thereof;
an insulating layer on the vertically protruding thin-body portion of the semiconductor substrate, the insulating layer having a second cavity defined by opposing sidewalls thereof, wherein the second cavity has a width that is substantially equal to a width of the first cavity;
a vertically oriented gate electrode inside the first cavity and the second cavity, wherein the vertically oriented gate electrode is in direct contact with the opposing sidewalls of the insulating layer; and
a gate insulating layer between the gate electrode and the opposing sidewalls of the vertically protruding thin-body portion of the semiconductor substrate.
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Accused Products
Abstract
A field effect transistor on an active region of a semiconductor substrate includes a vertically protruding thin-body portion of the semiconductor substrate and a vertically oriented gate electrode at least partially inside a cavity defined by opposing sidewalls of the vertically protruding portion of the substrate. The transistor further includes an insulating layer surrounding an upper portion of the vertically oriented gate electrode and a laterally oriented gate electrode on the insulating layer and connected to a top portion of the vertically oriented gate electrode. Accordingly, a T-shaped gate electrode is defined having a lateral portion on a top surface of a semiconductor substrate and having a vertical portion at least partially inside a cavity defined by opposing sidewalls of a vertically protruding portion of the substrate.
18 Citations
18 Claims
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1. A field effect transistor, comprising:
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a vertically protruding thin-body portion of a semiconductor substrate having a first cavity defined by opposing sidewalls thereof; an insulating layer on the vertically protruding thin-body portion of the semiconductor substrate, the insulating layer having a second cavity defined by opposing sidewalls thereof, wherein the second cavity has a width that is substantially equal to a width of the first cavity; a vertically oriented gate electrode inside the first cavity and the second cavity, wherein the vertically oriented gate electrode is in direct contact with the opposing sidewalls of the insulating layer; and a gate insulating layer between the gate electrode and the opposing sidewalls of the vertically protruding thin-body portion of the semiconductor substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A field effect transistor in a non-volatile EPROM, comprising:
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a first T-shaped gate electrode having a lateral portion on a top surface of a semiconductor substrate and having a vertical portion at least partially inside a first cavity defined by opposing sidewalls of a vertically protruding portion of the substrate; and a second T-shaped gate electrode having a lateral portion on a top surface of the substrate and having a vertical portion at least partially inside a second cavity defined by opposing sidewalls of the vertically protruding portion of the substrate, wherein the lateral portion of the second T-shaped gate electrode is substantially parallel to the lateral portion of the first T-shaped gate electrode, and wherein the vertical portion of the second T-shaped gate electrode is substantially parallel to the vertical portion of the first T-shaped gate electrode.
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14. A field effect transistor, comprising:
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a vertically protruding thin-body portion of a semiconductor substrate having a first cavity defined by opposing sidewalls thereof; an insulating layer on the vertically protruding thin-body portion of the semiconductor substrate, the insulating layer having a second cavity defined by opposing sidewalls thereof, wherein the second cavity has a width that is substantially equal to a width of the first cavity; a vertically oriented gate electrode inside the first cavity and the second cavity, wherein the vertically oriented gate electrode is in direct contact with the opposing sidewalls of the insulating layer; a gate insulating layer between the gate electrode and the opposing sidewalls of the vertically protruding thin-body portion of the semiconductor substrate; and a laterally oriented gate electrode on the insulating layer and connected to a top portion of the vertically oriented gate electrode, wherein the first cavity comprises a contact hole type cavity.
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15. A field effect transistor on an active region of a semiconductor substrate, comprising:
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a vertically protruding thin-body portion of the semiconductor substrate; a first vertically oriented gate electrode at least partially inside a first cavity defined by opposing sidewalls of the vertically protruding portion of the substrate; and a second vertically oriented gate electrode at least partially inside a second cavity defined by opposing sidewalls of the vertically protruding portion of the substrate. - View Dependent Claims (16, 17, 18)
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Specification