Method of fabricating a semiconductor device comprising a gate dielectric made of high dielectric permittivity material
First Claim
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1. A semiconductor device comprising:
- a substrate;
a gate dielectric deposited on the substrate, wherein the gate dielectric is made of high dielectric permittivity material; and
a gate formed on top of a Si1−
xGex first layer comprising;
a Si1−
xGex first layer formed directly on the gate dielectric, where 0.5<
x≦
1; and
,a Si1−
yGey second layer, formed on top of the Si1−
xGex first layer where 0≦
y≦
1.
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Abstract
A process and a device for fabricating a semiconductor device having a gate dielectric made of high-k material, includes a step of depositing, directly on the gate dielectric, a first layer of Si1−xGex, where 0.5<x≦1, at a temperature substantially below the temperature at which a poly-Si is deposited by thermal chemical vapor deposition (CVD).
18 Citations
7 Claims
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1. A semiconductor device comprising:
-
a substrate; a gate dielectric deposited on the substrate, wherein the gate dielectric is made of high dielectric permittivity material; and a gate formed on top of a Si1−
xGex first layer comprising;a Si1−
xGex first layer formed directly on the gate dielectric, where 0.5<
x≦
1; and
,a Si1−
yGey second layer, formed on top of the Si1−
xGex first layer where 0≦
y≦
1. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification