Current sensor and current sensor manufacturing method
First Claim
1. A current sensor comprising:
- a housing of molded plastics;
a metallic current conductor through which a current to be measured flows;
a magnetic field sensor chip containing at least one magnetic field detection element, the magnetic field sensor chip being placed on a side of the current conductor;
a flux concentrator placed on the magnetic field sensor chip for urging a flux generated by the current flowing through the current conductor to pass through the at least one magnetic field detection element;
a plurality of input and output terminals, each of the input and output terminals having an end that is electrically connected to a corresponding terminal of the magnetic field sensor chip, wherein a portion of the current conductor carrying the magnetic field sensor chip lies in a first plane and said ends of the input and output terminals lie in a second plane oriented substantially parallel to the first plane, and wherein a distance between the first and second plane substantially disappears or is substantially the same as a thickness of the magnetic field sensor chip;
a first magnetic material located on a backside of the current conductor, said backside located opposite to the side that the magnetic field sensor chip is placed on; and
a second magnetic material located above the magnetic field sensor chip.
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Accused Products
Abstract
A low-cost, current sensor suitable for mass production and a manufacturing method thereof are provided. The current sensor is small with high sensitivity and can be packaged in a standard assembly line which is normally used when an integrated circuit is manufactured. Further, it is possible to obtain a sufficient shielding effect against a disturbance flux without degrading the detecting sensitivity of a flux. A first magnetic material 50 is bonded to the lower part of a current conductor 22C. The first magnetic material 50 has the function of converging and amplifying a flux 3 generated by the current to be measured. A second magnetic material 51 is bonded above a magnetic sensor chip 20. The second magnetic material 51 has a shielding function against a disturbance flux entering from the outside.
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Citations
8 Claims
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1. A current sensor comprising:
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a housing of molded plastics; a metallic current conductor through which a current to be measured flows; a magnetic field sensor chip containing at least one magnetic field detection element, the magnetic field sensor chip being placed on a side of the current conductor; a flux concentrator placed on the magnetic field sensor chip for urging a flux generated by the current flowing through the current conductor to pass through the at least one magnetic field detection element; a plurality of input and output terminals, each of the input and output terminals having an end that is electrically connected to a corresponding terminal of the magnetic field sensor chip, wherein a portion of the current conductor carrying the magnetic field sensor chip lies in a first plane and said ends of the input and output terminals lie in a second plane oriented substantially parallel to the first plane, and wherein a distance between the first and second plane substantially disappears or is substantially the same as a thickness of the magnetic field sensor chip; a first magnetic material located on a backside of the current conductor, said backside located opposite to the side that the magnetic field sensor chip is placed on; and a second magnetic material located above the magnetic field sensor chip. - View Dependent Claims (2, 3, 4)
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5. A method of manufacturing a current sensor, comprising the steps of:
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forming a thin plate-like metal into a leadframe containing a current conductor and input and output terminals; placing a magnetic field sensor chip containing at least one magnetic field detection element on a side of the current conductor; connecting electrical terminals of the magnetic field sensor chip to the input and output terminals; forming a plastic housing by molding the current conductor, the magnetic field sensor chip and the input and output terminals; separating the current conductor and the input and output terminals from each other; providing a first magnetic material on a backside of the current conductor, said backside being located opposite to the side that the magnetic field sensor chip is placed on; and providing a second magnetic material located above the magnetic field sensor chip. - View Dependent Claims (6, 7, 8)
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Specification