Encapsulated surface acoustic wave sensor

• US 7,129,828 B2
• Filed: 07/20/2004
• Issued: 10/31/2006
• Est. Priority Date: 07/20/2004
• Status: Expired due to Fees

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Cook, James D.
• Primary Examiner(s): Swarthout, Brent A.
• Application Number:
  US10/895,786
• Publication Number:
  US 20060017553A1
• Time in Patent Office: 833 Days
• Field of Search: 340/442, 340/443, 340/447, 340/505, 340/445, 737/02, 731/462, 731/464, 731/465
• US Class Current: 340/447
• CPC Class Codes: B60C 23/0493 for attachment on the tyre
• CPC Class Codes: G01K 11/265 using surface acoustic wave [SAW]
• CPC Class Codes: G01K 7/32 using change of resonant frequency of a crystal
• CPC Class Codes: G01L 9/0025 with acoustic surface waves

Abstract

Sensor package systems and methods are disclosed, which include a quartz sensor package encapsulated by an overmold material. A surface acoustic wave sensing element and one or more bonding pads can be integrated with the quartz sensor package. Additionally, one or more antennas can be respectively bonded to the quartz sensor package at the bonding pads, such that the antennas communicates electrically with the surface acoustic wave sensing element and permits wireless interrogation of the quartz sensor package including the surface acoustic wave sensing element from an external wireless source.

Claims

1. A sensor package system, comprising:

a quartz sensor package including a surface acoustic wave sensing element and at least one bonding pad both of which are integrated with said quartz sensor package, wherein said quartz sensor package comprises a sensor diaphragm comprising said surface acoustic wave sensing element;

a pressure access cavity formed from said sensor diaphragm and filled with a non-compressible gel in order to transfer air pressure from an external pressure source to said sensor diaphragm;

at least one antenna respectively bonded to said quartz sensor package at said at least one bonding pad to thereby form at least one bonding pad-to-antenna connection such that said at least one antenna communicates electrically with said surface acoustic wave sensing element and permits wireless interrogation of said quartz sensor package including said surface acoustic wave sensing element from an external wireless source; and

an overmold material encapsulating said quartz sensor package including said at least one bonding pad-to-antenna connection.

2. The system of claim 1 wherein said at least one bonding pad comprises at least one of the following types of bonds:

a thermo-compression bond, a solder bond, or an adhesive bond.

3. The system of claim 1 wherein said at least one antenna comprises an antenna ribbon or wire.

4. The system of claim 1 wherein said quartz sensor package is configured as an all-quartz package (ACP).

5. The system of claim 4 further comprising a ribbon bond stress-relief gel located between said antenna ribbon and said all-quartz package.

7. The system of claim 1 wherein said quartz sensor package comprises an integrated circuit (IC) package.

8. The system of claim 7 wherein said IC package is integrated into a tire, such that said sensor package measures air pressure and air temperature within said tire.

6. The system of claim wherein 1 said at least one antenna comprises a flexible printed circuit antenna.

9. A tire sensor package system, comprising:

a tire in which a quartz sensor integrated circuit (IC) package is located, said quartz sensor IC package including a surface acoustic wave sensing element and at least one bonding pad integrated with said quartz sensor IC package; and

wherein said quartz sensor IC package comprises a sensor diaphragm comprising said surface acoustic wave sensing element and wherein a pressure access cavity is formed from said sensor diaphragm and filled with a non-compressible gel in order to transfer air pressure within said tire to said sensor diaphragm;

at least one antenna respectively bonded to said quartz sensor IC package at said at least one bonding pad to thereby form at least one bonding pad-to-antenna connection such that said at least one antenna communicates electrically with said surface acoustic wave sensing element and permits wireless interrogation of said quartz sensor IC package including said surface acoustic wave sensing element from an external wireless source; and

an overmold material encapsulating said quartz sensor IC package including said a at least one bonding pad-to-antenna connection, wherein said quartz sensor IC package is integrated into said tire such that said quartz sensor package measures air pressure and air temperature within said tire.

10. A sensor packaging method, comprising the steps of:

providing a quartz sensor package;

integrating a surface acoustic wave sensing element and at least one bonding pad with said quartz sensor package;

configuring said quartz sensor package to comprise a sensor diaphragm that incorporates said surface acoustic wave sensing element;

forming a pressure access cavity from said sensor diaphragm;

filling said pressure access cavity with a non-compressible gel in order to transfer air pressure from an external pressure source to said sensor diaphragm;

respectively bonding at least one antenna to said quartz sensor package at said at least one bonding pad to thereby form at least one bonding pad-to-antenna connection, such that said at least one antenna communicates electrically with said surface acoustic wave sensing element and permits wireless interrogation of said quartz sensor package including said surface acoustic wave sensing element from an external wireless source; and

encapsulating a quartz sensor package including said at least one bonding pad-to-antenna connection with an overmold material.

11. The method of claim 10 further comprising the step of configuring said quartz sensor as an all-quartz package (AQP).

12. The method of claim 10 further comprising the step of configuring said at least one antenna to comprise an antenna ribbon.

13. The method of claim 12 further comprising the step of locating a ribbon bond stress-relief gel between said antenna ribbon and said quartz sensor package.

14. The method of claim 10 further comprising the step of configuring said at least one antenna to comprise a flexible printed circuit antenna.

15. The method of claim 10 wherein said quartz sensor package comprises an integrated circuit (IC) package and further comprising the steps of:

placing said IC package into a tire prior to molding of said tire; and

integrating said IC package into said tire, such that said quartz sensor package is capable of measuring air pressure and air temperature within said tire.