RF connectors having ground springs

• US 7,131,867 B1
• Filed: 05/06/2005
• Issued: 11/07/2006
• Est. Priority Date: 05/06/2005
• Status: Active Grant

• Current Assignee: Pacific Aerospace & Electronics Incorporated (Qnnect LLC)
• Original Assignee: Pacific Aerospace & Electronics Incorporated (Qnnect LLC)
• Inventors: Foster, Nathan, Meade, Anthony
• Primary Examiner(s): NGUYEN, TRUC T
• Application Number:
  US11/123,370
• Publication Number:
  US 20060252289A1
• Time in Patent Office: 550 Days
• Field of Search: 439/578, 439/95
• US Class Current: 439/578
• CPC Class Codes: H01R 2103/00 Two poles
• CPC Class Codes: H01R 24/42 comprising impedance matching means or electrical components, e.g. filters or switches

Abstract

Radio frequency (RF) connectors and electronics housings and packages employing one or more inventive RF connector(s) provided herein utilize a ground spring to achieve improved conductivity of the ground signal by making a plurality of contacts with a ferrule member of the RF connector'"'"'s hermetic feedthru and a plurality of contacts with the electronics housing or package at points adjacent to an air dielectric. Ground springs used in connection with the present RF connectors maintain predetermined spring properties under compression and/or extreme environmental conditions, including thermal fluctuations, and therefore may be suitably employed in aircraft and spacecraft.

Claims

1. An RF connector suitable for use in combination with a hermetically sealed lightweight electronics housing package, said RF connector comprising:

(a) a first metal layer bonded to a second metal layer;

(b) a hermetic feedthru comprising a ferrule member, a dielectric member, and a pin member, wherein said dielectric member comprises a channel to receive a first end of said pin member and wherein said ferrule member is fabricated to receive said dielectric member; and

(c) a ground spring,

wherein said ground spring forms a plurality of first circumferential contacts with said ferrule member and a plurality of second circumferential contacts with said electronics housing or package, thereby forming a conductive ground path between said hermetic feedthru of said RF connector and said electronics housing or package, said electronics housing or package comprising a dielectric to receive a second end of said pin member.

2. The RF connector of claim 1 wherein said first metal layer bonded to said second metal layer is bonded to a third metal layer.

3. The RF connector of claim 1 wherein said first metal layer comprises an iron-based metal.

4. The RF connector of claim 3 wherein said iron-based metal is KOVAR™

.

5. The RF connector of claim 1 wherein said second metal layer comprises a metal selected from the group consisting of aluminum and titanium.

6. The RF connector of claim 1 wherein said bond between said first metal layer and said second metal layer is formed by explosion welding or roller bonding.

7. The RF connector of claim 1 wherein said ferrule member is fabricated out of a material comprising iron.

8. The RF connector of claim 1 wherein said dielectric member is fabricated out of a glass wherein said glass is selected from the group consisting of Corning Glass No. 7070 and a class having similar properties as Corning Glass No. 7070.

9. The RF connector of claim 1 wherein said pin member is fabricated out of a material comprising iron.

10. The RF connector of claim 1 wherein said electronics housing package comprises an air dielectric that receives said pin member of said RF connector.

11. The RF connector of claim 1 wherein said plurality of first circumferential contacts with said ferrule member is at points adjacent to said dielectric material.

12. The RF connector of claim 1 wherein said plurality of second circumferential contacts with said electronics housing package are at points adjacent to said dielectric of said electronics housing or package.

13. The RF connector of claim 12 wherein said dielectric of said electronics housing or package is an air dielectric.

14. The RF connector of claim 1 wherein said ground spring is fabricated from a material selected from the group consisting of stainless steel, gold-plated stainless steel, silver-plated stainless steel, and a copper alloy.

15. The RF connector of claim 14 wherein said copper alloy is a beryllium-copper alloy comprising approximately 1% beryllium and 99% copper.

16. The RF connector of claim 1 wherein said ground spring is a formed spring.

17. The RF connector of claim 16 wherein said formed ground spring interfaces directly with said electronics housing or package dielectric.

18. The RF connector of claim 1 wherein said ground spring is a coil spring.

19. An RF connector for use in combination with an electronics housing, comprising:

(a) a feedthru comprising a ferrule member, a dielectric member, and a pin member, wherein the dielectric member comprises a channel to receive a first end of the pin member, and wherein the ferrule member receives the dielectric member; and

(b) a ground spring forming a plurality of first circumferential contacts with the ferrule member and a plurality of second circumferential contacts with the electronics housing.

20. The RF connector of claim 19, additionally comprising a first metal layer and a second metal layer, wherein the first metal layer comprises an iron-based metal and is laser welded to the ferrule member.

21. The RF connector of claim 20, wherein the second metal layer is laser weldable to the electronics housing.

22. The RF connector of claim 19, wherein the ground spring has:

(a) an outside diameter (OD) of between about 0.080 inches and 0.200 inches; and

(b) a hole having an inside diameter (ID) of between about 0.020 inches and 0.100 inches.

23. The RF connector of claim 19, wherein the ground spring has a plurality of petals disposed at an acute angle of between about 30°

and about 60°

from the plane of the ground spring.

24. The RF connector of claim 19, wherein the ground spring has between about 4 petals and about 20 petals.

25. The RF connector of claim 19, wherein the ground spring comprises a conductive material selected from the group consisting of:

stainless steel, gold-plated stainless steel, silver-plated stainless steel, and copper alloy.

26. The RF connector of claim 19, wherein the ground spring comprises a beryllium copper alloy.

27. The RF connector of claim 19, wherein the feedthru is a hermetic feedthru.

28. An electronics package incorporating an RF connector, wherein the RF connector has a feedthru comprising a ferrule member, a dielectric member, a pin member, and a ground spring, the dielectric member comprises a channel receiving a first end of the pin member, the ferrule member receives the dielectric member, and the ground spring forms a plurality of first circumferential contacts with the ferrule member and a plurality of second circumferential contacts with the electronics package.

29. The electronics package of claim 28, wherein the RF connector additionally comprises a first metal layer and a second metal layer, and wherein the first metal layer comprises an iron-based metal and is laser welded to the ferrule member.

30. The electronics package of claim 29, wherein the second metal layer is laser welded to the electronics package.

31. The electronics package of claim 28, wherein the ground spring comprises a plurality of petals disposed at an acute angle of between about 30°

and about 60°

from the plane of the ground spring.

32. The electronics package of claim 28, wherein the ground spring comprises between about 4 petals and about 20 petals.

33. The electronics package of claim 28, wherein the ground spring comprises a conductive material selected from the group consisting of:

stainless steel, gold-plated stainless steel, silver-plated stainless steel, and copper alloy.

34. The electronics package of claim 28, wherein the ground spring comprises a beryllium copper alloy.

35. The electronics package of claim 28, wherein the electronics package is constructed from an aluminum alloy.

36. The electronics package of claim 28, wherein the electronics package is constructed from a material selected from the group consisting of:

titanium and a titanium alloy.

37. The electronics package of claim 28, wherein the feedthru is a hermetic feedthru.