Manufacturing method of organic flat light-emitting devices

• US 7,131,882 B2
• Filed: 05/13/2005
• Issued: 11/07/2006
• Est. Priority Date: 12/31/2001
• Status: Expired due to Fees

• Current Assignee: III Holdings 1, LLC (Intellectual Ventures LLC)
• Original Assignee: RITDISPLAY CORPORATION
• Inventors: Wei, Mao-Kuo, Wang, Jih-Yi
• Primary Examiner(s): Williams, Joseph
• Application Number:
  US11/128,170
• Publication Number:
  US 20050208864A1
• Time in Patent Office: 543 Days
• Field of Search: 445 23- 25, 438 29- 35, 313501-506
• US Class Current: 445/24
• CPC Class Codes: H10K 50/858 comprising refractive means, e.g. lenses
• CPC Class Codes: H10K 59/879 comprising refractive means, e.g. lenses
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

A manufacturing method of organic flat light-emitting devices includes the following steps. First, a transparent substrate is provided, which has several microstructures on its first surface and the microstructures have a maximum height of 100 μm from the first surface. Second, a transparent anode is formed on the second surface of the transparent substrate that is opposite to the first surface. Thirdly, at least one organic electro-luminescent layer is formed on the transparent anode. Finally, a metal cathode is formed on the organic electro-luminescent layer. Another manufacturing method of organic flat light-emitting devices includes the steps of: forming a transparent thin film on a first surface of a transparent substrate, the transparent thin film having a plurality of microstructures with a maximum height of 100 μm; forming a transparent anode on a second surface of the transparent substrate opposite to the first surface; forming at least one organic electro-luminescent layer; and forming a metal cathode on the organic electro-luminescent layer.

Claims

1. A manufacturing method of organic flat light-emitting devices, comprising the steps of:

providing a transparent thin film on a first surface of a transparent substrate, the transparent thin film having a plurality of microstructures and the microstructures having a maximum height of 100 μ

m;

forming a transparent anode on a second surface of the transparent substrate opposite to the first surface;

forming at least an organic electro-luminescent layer; and

forming a metal cathode on the organic electro-luminescent layer.

2. The manufacturing method of claim 1, wherein the transparent substrate is a plastic substrate.

3. The manufacturing method of claim 1, wherein the transparent substrate is a flexible substrate.

4. The manufacturing method of claim 1, wherein the transparent substrate is a glass substrate.

5. The manufacturing method of claim 1, wherein the thickness of the transparent substrate is between 0.2 mm and 5 mm.

6. The manufacturing method of claim 1, wherein the transparent thin film is formed on the first surface by an adhesive method.

7. The manufacturing method of claim 1, wherein the microstructures have a curved surface.

8. The manufacturing method of claim 7, wherein the curved surface has a spherical shape with a diameter between 10 μ

m and 500 μ

m.

9. The manufacturing method of claim 7, wherein the curved surface has a cylindrical shape with a diameter between 10 μ

m and 500 μ

m and a length between 10 μ

m and 500 μ

m.

10. The manufacturing method of claim 7, wherein the curved surface is a protruding surface having a square border with a side length between 10 μ

m and 500 μ

m.

11. The manufacturing method of claim 1, wherein the transparent thin film is formed by an adhering method.