Passive millimeter wave sensor using high temperature superconducting leads

• US 7,132,655 B2
• Filed: 12/02/2003
• Issued: 11/07/2006
• Est. Priority Date: 12/02/2002
• Status: Active Grant

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Gordon, Eli E., Jack, Michael D.
• Primary Examiner(s): Porta, David
• Assistant Examiner(s): BOOSALIS, FANI POLYZOS
• Application Number:
  US10/727,187
• Publication Number:
  US 20040140429A1
• Time in Patent Office: 1,071 Days
• Field of Search: 250/338.4, 250/338.1, 250/338.14, 250/338.18, 250/336.1, 250/370.01, 250/336.2, 338/14, 338/18, 505/161
• US Class Current: 250/338.1
• CPC Class Codes: G01J 5/08 Optical arrangements
• CPC Class Codes: G01J 5/0837 Microantennas, e.g. bow-tie
• CPC Class Codes: G01J 5/20 using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
• CPC Class Codes: H01Q 1/002 Protection against seismic waves, thermal radiation or other disturbances, e.g. nuclear explosion; Arrangements for improving the power handling capability of an antenna
• CPC Class Codes: H01Q 1/364 using a particular conducting material, e.g. superconductor
• CPC Class Codes: H01Q 21/26 Turnstile or like antennas comprising arrangements of three or more elongated elements disposed radially and symmetrically in a horizontal plane about a common centre

Abstract

A radiation sensor (20) has a substrate (34); an antenna (24) coupled to the substrate (34), a thermal detector unit TDU (22) spaced from the antenna (24) and the substrate (34); and a multi-layered conductive lead (30). The conductive lead (30) physically contacts the antenna (24) and the TDU (22). The conductive lead (30) defines a support layer (44) adjacent to the substrate (34) for structurally supporting the TDU (22) over a cavity defined by the substrate (34), a buffer layer (46) disposed on the support layer (44), and a superconductive layer (48) disposed on the buffer layer (46). The buffer layer has a crystalline structure to facilitate bonding with other layers. A method for making the sensor (20) is disclosed wherein the superconductive layer (48) and the buffer layer (46) are deposited using laser deposit, the buffer layer (46) with ion beam assist for alignment.

Claims

1. A radiation sensor comprising:

a substrate defining a cavity;

an antenna coupled to the substrate;

a thermal detector unit spaced from the antenna and from the substrate;

a plurality of multi-layered conductive leads in contact with the antenna and the thermal detector unit, wherein each of the conductive leads comprises a superconductive layer in electrical contact with the thermal detector unit and the antenna, a support layer between the superconductive layer and the substrate, and a buffer layer disposed between the support layer and the superconductive layer, said buffer layer defining a thermal conductivity that is less than one order of magnitude greater than a thermal conductivity defined by the superconductive layer, each of said support layers cooperating to suspend the thermal detector unit over the cavity.

2. The radiation sensor of claim 1 wherein the buffer layer is characterized by a thermal conductivity K<

0.1 W/cm-K.

3. The radiation sensor of claim 1 wherein the buffer layer comprises Yttria stabilized Zirconia.

4. The radiation sensor of claim 1 wherein the buffer layer defines a thermal conductivity that is less than a thermal conductivity defined by the superconductive layer.

5. The radiation sensor of claim 1 wherein the superconductive layer is selected from the group consisting of perovskite superconductors.

6. In a radiation sensor for measuring incident radiation comprising a substrate defining a cavity, a thermal detector unit disposed above the cavity, an antenna coupled to the substrate, and a plurality of conductors in contact with the antenna and the thermal detector unit, the improvement comprising:

each of the plurality of conductors defining a plurality of layers and comprising;

a superconductive layer;

a support layer between the superconductive layer and the substrate; and

a buffer layer between the support layer and the superconductive layer, said buffer layer defining a thermal conductivity that is less than one order of magnitude greater than a thermal conductivity defined by the superconductive layer;

wherein each of said support layers cooperate to suspend the thermal detector unit over the cavity.

7. In a radiation sensor for measuring incident radiation comprising a substrate defining a cavity, a thermal detector unit disposed above the cavity, an antenna coupled to the substrate, and a plurality of conductors in contact with the antenna and the thermal detector unit, the improvement comprising:

each of the plurality of conductors defining a multi-layer structure and comprising;

a support layer adjacent to the substrate;

a superconductive layer opposite the substrate; and

a buffer layer between the support layer and the superconductive layer, said buffer layer defining a thermal conductivity K<

0.1 W/cm-K;

wherein each of said support layers cooperate to suspend the thermal detector unit over the cavity.

8. A method for making a radiation sensor comprising:

defining a cavity within a substrate;

depositing a filler material within the cavity;

depositing a thermal detector unit onto the filler material;

depositing an antenna onto the substrate;

depositing a plurality of multi-layer conductive leads to contact the thermal detector unit and the antenna, wherein each of the plurality of multi-layer conductive leads defines a layer of superconductive material, a support layer, and a buffer layer therebetween;

conductively bonding a first segment of the conductive lead to the antenna to form an electrically conductive pathway between the superconductive material and the antenna, and a second segment of the conductive lead to the thermal detector unit so as to form an electrically conductive pathway between the superconductive layer and the thermal detector unit; and

removing the filler material such that the support layers suspend the thermal detector unit over the cavity.

9. The method of claim 8 wherein depositing a thermal detector unit comprises depositing a thermally reactive material over at least a portion of the filler material and delineating edges thereof to define the thermal detector unit.

10. The method of claim 8 wherein depositing an antenna onto the substrate comprises depositing a conductive material onto the substrate and delineating edges thereof to define the antenna.

11. The method of claim 8 wherein depositing a plurality of multi-layer conductive leads comprises;

depositing a layer of support material to contact the thermal detector unit and the antenna;

depositing a layer of buffer material over at least a portion of the support material;

depositing a layer of superconductive material over at least a portion of the buffer material; and

delineating the plurality of conductive leads by removing at least one of excess support material, excess buffer material, and excess superconductive material.

12. The method of claim 11 wherein depositing a layer of buffer material includes laser depositing with ion beam assist.

13. The method of claim 8 for making an array of radiation sensors, wherein

defining a cavity within a substrate comprises defining a plurality of cavities within a substrate;

depositing a filler material within the cavity comprises depositing filler material within the plurality of cavities;

depositing a thermal detector unit onto the filler material comprises depositing at least one thermal detector unit onto the filler material within each cavity;

depositing an antenna onto the substrate comprises depositing at least one antenna onto the substrate for each said cavity;

depositing a plurality of multi-layer conductive leads to contact the thermal detector unit and the antenna comprises, for each thermal detector unit, suspending said thermal detector unit over one cavity with a plurality of the conductive leads that couple the said thermal detector unit to one antenna; and

conductively bonding comprises bonding a first and second segment of each conductive lead to one of an antenna and a thermal detector unit.