Semiconductor light-emitting device and method for manufacturing the same
First Claim
1. A semiconductor light emitting device comprising:
- a substrate; and
a light emitting layer forming portion disposed on said substrate so that an active layer that emits light by electric current injection is sandwiched between n-type and p-type cladding layers made of materials having a larger band gap than said active layer, wherein said active layer is made of a ZnO-based oxide compound semiconductor containing at least Cd.
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Accused Products
Abstract
It has a structure in which an active layer (5) that emits light by electric current injection is sandwiched between an n-type cladding layer (4) and a p-type cladding layer (6) made of materials having a larger band gap than the active layer (5), wherein the active layer (5) is made, for example, of CdxZn1−xO (0≦x<1). It is further more preferable if the cladding layers (4), (6) are made, for example, of MgyZn1−yO (0≦y<1). This narrows the band gap of the ZnO materials, and an oxide semiconductor capable of being wet-etched, easy to handle with, and excellent in crystallinity can be used as a material for an active layer or a cladding layer of a semiconductor light emitting device such as a blue light emitting diode or a blue laser diode in which an active layer is sandwiched between cladding layers, so that a blue semiconductor light emitting device being excellent in light emission characteristics can be obtained.
184 Citations
45 Claims
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1. A semiconductor light emitting device comprising:
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a substrate; and
a light emitting layer forming portion disposed on said substrate so that an active layer that emits light by electric current injection is sandwiched between n-type and p-type cladding layers made of materials having a larger band gap than said active layer, wherein said active layer is made of a ZnO-based oxide compound semiconductor containing at least Cd. - View Dependent Claims (2, 3, 4, 7, 8, 10, 11, 14, 15, 24)
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5. A semiconductor light emitting device comprising:
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a single crystalline substrate; and
a light emitting layer forming portion disposed on said substrate so that an active layer that emits light by electric current injection is sandwiched between n-type and p-type cladding layers made of materials having a larger band gap than said active layer wherein said cladding layers are made of an ZnO-based oxide compound semiconductor containing Zn or Mg and Zn. - View Dependent Claims (6)
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9. A semiconductor laser comprising:
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an active layer that emits light by electric current injection, and n-type and p-type cladding layers made of materials having a larger band gap than said active layer and sandwiching said active layer from both sides thereof, wherein said active layer is made of CdxZn1−
xO (0≦
x<
1), said cladding layers are made of MgyZn1−
yO (0≦
y<
1), and an internal electric current constriction layer is built therein.
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12. A semiconductor laser comprising:
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an active layer that emits light by electric current injection, and n-type and p-type cladding layers made of materials having a larger band gap than said active layer and sandwiching said active layer from both sides thereof, wherein said active layer is made of a quantum well structure constructed with a composition modification of CdxZn1−
xO (0≦
x<
1), and a stress-alleviating layer is disposed on at least one side of said n-type cladding layer side and said p-type cladding layer side of said active layer so as to be in contact with said active layer, said stress-alleviating layer being made of MgwZn1−
xO (0≦
w<
1) having a composition with approximately the same lattice constant as the composition located on the outermost side of said active layer on said at least one side. - View Dependent Claims (13)
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16. A semiconductor light emitting device comprising:
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a sapphire substrate, a buffer layer made of an Al2O3 film disposed on said sapphire substrate, and a light emitting layer forming portion made of ZnO-based compound semiconductor disposed on said buffer layer, said light emitting layer forming portion including at least n-type and p-type layers to form a light emitting layer. - View Dependent Claims (17)
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18. A semiconductor light emitting device comprising:
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a substrate, and a semiconductor laminate section disposed on said substrate and made of oxide compound semiconductor layers and including a light emitting layer forming portion, wherein an oxide thin film containing Zn is disposed as a buffer layer on a front surface of said substrate at a lower temperature than a temperature of growing semiconductor layers of said semiconductor laminate section and is interposed between said substrate and said semiconductor laminate section. - View Dependent Claims (19)
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20. A method of manufacturing a semiconductor light emitting device comprising the steps of:
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forming a non-crystalline or polycrystalline oxide thin film containing Zn on a substrate by a sputtering method, a vacuum vapor deposition method, or a laser ablation method, putting said substrate into an apparatus for epitaxial growth of semiconductor layers and raising a substrate temperature to a growth temperature, and laminating an oxide compound semiconductor layer to form a light emitting layer forming portion.
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21. A semiconductor light emitting device comprising:
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a substrate, and a semiconductor laminate section including a light emitting layer forming portion made of compound semiconductor layers disposed on said substrate and having n-type and p-type layers to form a light emitting layer, wherein a buffer layer is disposed between said substrate and said semiconductor laminate section, said buffer layer being made of a material having a thermal expansion coefficient larger than the thermal expansion coefficient of an epitaxial growth layer at the lowermost layer of said semiconductor laminate section and smaller than the thermal expansion coefficient of said substrate. - View Dependent Claims (22, 23)
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25. A semiconductor light emitting device comprising:
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a substrate;
a reflective film for reflecting light from a front surface side of said substrate;
a semiconductor laminate section; and
wherein said reflective film is laminated by an even number of dielectric films or semiconductor films having different refractive indices with a thickness of λ
/(4n) (n is a refractive index of the dielectric film or the semiconductor film, and λ
is a light emission wavelength) on said substrate so that a layer having a smaller refractive index and a layer having a larger refractive index are alternately laminated in this order, andwherein, in said semiconductor laminate section, semiconductor layers are laminated on said reflective film to form a the light emitting layer, and wherein a buffer layer made of oxide containing Zn and formed at a low temperature is disposed on said reflective film; and
wherein said semiconductor laminate section is formed by lamination of oxide compound semiconductor on said buffer layer. - View Dependent Claims (26)
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27. A ZnO-based compound semiconductor light emitting device comprising:
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a substrate; and
a light emitting layer forming portion disposed on said substrate and forming a light emitting layer by lamination of ZnO-based compound semiconductor having at least an n-type layer, wherein an n-side electrode disposed in contact with said n-type layer of said ZnO-based compound semiconductor is formed so that a portion of said n-side electrode which is in contact with said n-type layer is formed of Ti or Cr, said portion not containing Al. - View Dependent Claims (28, 29)
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30. A semiconductor light emitting device comprising:
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a substrate, and a light emitting layer forming portion made of ZnO-based compound semiconductor layers disposed on said substrate and forming a light emitting layer with an n-type layer and a p-type layer, wherein said p-type layer contains an element capable of becoming an n-type dopant as a buffering agent.
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31. A ZnO-based compound semiconductor light emitting device comprising:
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a substrate, and a light emitting layer forming portion that forms a light emitting layer by lamination of a ZnO-based compound semiconductor layer disposed on said substrate, wherein said ZnO-based compound semiconductor layer contains C element. - View Dependent Claims (32)
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33. A semiconductor laser comprising:
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a substrate, a first cladding layer disposed on said substrate and made of a first conductivity type semiconductor, an active layer disposed on said first cladding layer, a second cladding layer disposed on said active layer and made of a second conductivity type semiconductor, and an electric current constriction layer disposed in the inside of or in the vicinity of said second cladding layer, wherein said electric current constriction layer is made of a ZnO-based compound semiconductor doped with a Group IA or Group VB element. - View Dependent Claims (34, 35)
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36. A semiconductor laser comprising:
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a substrate, a first cladding layer disposed on said substrate and made of a first conductivity type semiconductor, an active layer disposed on said first cladding layer, a second cladding layer disposed on said active layer and made of a second conductivity type semiconductor, and an electric current constriction layer disposed in the inside of or in the vicinity of said second cladding layer and made of MgzZn1−
zO (0≦
z<
1),wherein an etching stopping layer made of CdsZn1−
sO (0<
s<
1) or BetZnHO (0<
t<
1) is disposed on said substrate side of said electric current constriction layer.
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37. An oxide compound semiconductor light emitting diode comprising:
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an n-type layer made of an n-type ZnO-based compound semiconductor, an i-layer made of a semi-insulating ZnO-based compound semiconductor, and an electrically conductive layer disposed on a front surface of said i-layer.
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38. An oxide compound semiconductor light emitting diode comprising:
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an n-type layer made of an n-type ZnO-based compound semiconductor, a doped layer in which a ZnO-based compound semiconductor layer is doped with at least one kind of element selected from the group consisting of Group IA, Group IB, and Group VB elements, and an electrically conductive layer disposed on a front surface of said doped layer. - View Dependent Claims (39)
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40. A semiconductor light emitting device comprising:
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a substrate, and a light emitting layer forming portion disposed on said substrate and forming a light emitting layer by lamination of compound semiconductor layers having at least an n-type layer and a p-type layer, wherein said n-type layer is made of a ZnO-based compound semiconductor; and
wherein said p-type layer is made of a GaN-based compound semiconductor. - View Dependent Claims (41, 42)
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43. A semiconductor light emitting device comprising:
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an insulating substrate, a light emitting layer forming portion formed of a p-type layer disposed on said insulating substrate and made of a GaN-based compound semiconductor and an n-type layer disposed on said p-type layer and made of a ZnO-based compound semiconductor, an n-side electrode disposed on said n-type layer, and a p-side electrode disposed on said p-type layer which is exposed by removal of a portion of said ZnO-based compound semiconductor layer through etching. - View Dependent Claims (44, 45)
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Specification