Physical quantity sensor

• US 7,132,722 B2
• Filed: 02/04/2005
• Issued: 11/07/2006
• Est. Priority Date: 02/09/2004
• Status: Expired due to Fees

• Current Assignee: Yamaha Corporation
• Original Assignee: Yamaha Corporation
• Inventors: Ohashi, Toshio
• Primary Examiner(s): Munson, Gene M.
• Application Number:
  US11/049,665
• Publication Number:
  US 20050194651A1
• Time in Patent Office: 641 Days
• Field of Search: 257/414, 257/415, 735/143.2, 735/143.4
• US Class Current: 257/415
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 15/18 in two or more dimensions

Abstract

A physical quantity sensor is constituted using a plurality of piezoelectric sensors each having first and second semiconductor layers realizing resistances and terminals, and a conductive weight portion in relation to an opening of an insulating film that partially exposes the main surface of a substrate. Both the semiconductor layers are elongated from the periphery of the opening on the insulating film inwardly into the opening so as to three-dimensionally support the conductive weight portion in a floating manner, thus realizing three-dimensional displacement. A capacitance electrode layer is arranged in the bottom of the opening on the main surface of the substrate so as to establish capacitance with the conductive weight portion. The displacement of the conductive weight portion is detected based on resistance variations and capacitance variations. Thus, it is possible to detect physical quantity such as acceleration, vibration, and inclination with a reduced chip size.

Claims

1. A physical quantity sensor comprising:

a substrate;

an insulating film having an opening, which is formed to partially expose a main surface of the substrate;

a plurality of piezoelectric sensors each having two terminals, wherein each piezoelectric sensor is constituted such that a sensing portion thereof is arranged in the opening while being supported by the two terminals attached onto the insulating film at different positions in a periphery of the opening, and wherein each piezoelectric sensor comprises a first semiconductor layer having a coil-like winding pattern that is elongated from the periphery of the opening of the insulating film inwardly into the opening, a second semiconductor layer having a coil-like winding pattern that is elongated from the periphery of the opening of the insulating film inwardly into the opening, and a conductive weight portion that mutually connects internal ends of the first and second semiconductor layers in the opening, whereby external ends of the first and second semiconductor layers attached onto the insulating film are used to form the two terminals, and the conductive weight portion is supported by the first and second semiconductor layers in a floating manner in the opening so as to realize three-dimensional displacement therewith; and

a capacitance electrode layer, which is arranged in a bottom of the opening on the main surface of the substrate so as to establish capacitance between the capacitance electrode layer and the conductive weight portion,

whereby the displacement of the conductive weight portion is detected based on variations of resistances of the first and second semiconductor layers and variations of the capacitance.

2. A physical quantity sensor according to claim 1 further comprising a second capacitance electrode layer, one end of which is fixed to the insulating film and which establishes second capacitance with respect to the first and second semiconductor layers, wherein the displacement of the conductive weight portion is detected with reference to variations of the second capacitance.

3. A physical quantity sensor according to claim 1, wherein the external ends of the first and second semiconductor layers are attached at opposite positions of the opening of the insulating film.

4. A physical quantity sensor comprising:

a substrate;

an insulating film having an opening, which is formed to partially expose a main surface of the substrate;

a plurality of piezoelectric sensors each having two terminals and a sensing portion, wherein the sensing portion is supported in a floating manner in the opening by the two terminals attached at different positions in periphery of the opening of the insulating film, and wherein each piezoelectric sensor comprises first and second semiconductor layers that are elongated from the periphery of the opening of the insulating film inwardly into the opening in parallel with each other, and a conductive weight portion that mutually connects internal ends of the first and second semiconductor layers in the opening, whereby external ends of the first and second semiconductor layers are attached onto the insulating film so as to form the two terminals, and the conductive weight portion is supported by the first and second semiconductor layers so as to realize three-dimensional displacement therewith; and

a capacitance electrode layer, which is arranged in a bottom of the opening on the main surface of the substrate so as to form capacitance between the conductive weight portion and the capacitance electrode layer,

whereby the displacement of the conductive weight portion is detected based on variations of resistances of the first and second semiconductor layers and variations of the capacitance.

5. A physical quantity sensor comprising:

a substrate;

an insulating film having an opening, which is formed to partially expose a main surface of the substrate;

a plurality of piezoelectric sensors each having a sensing portion and two terminals, wherein the sensing portion is supported in a cantilever manner in relation to the opening, and wherein each piezoelectric sensor comprises first and second semiconductor layers that are elongated from a periphery of the opening of the insulating film inwardly into the opening in parallel with each other, and a conductive weight portion that mutually connects internal ends of the first and second semiconductor layers in the opening, whereby external ends of the first and second semiconductor layers are attached onto the insulating film so as to form the two terminals, and the conductive weight portion is supported by the first and second semiconductor layers so as to realize three-dimensional displacement therewith; and

a plurality of capacitance electrode layers, which are arranged in a bottom of the opening on the main surface of the substrate so as to form capacitances between the conductive weight portion and the capacitance electrode layers respectively,

whereby the displacement of the conductive weight portion is detected based on variations of resistances of the first and second semiconductor layers and variations of the capacitances.