Apparatus and measurement procedure for the fast, quantitative, non-contact topographic investigation of semiconductor wafers and other mirror like surfaces

• US 7,133,140 B2
• Filed: 04/01/2004
• Issued: 11/07/2006
• Est. Priority Date: 10/02/2001
• Status: Expired due to Fees

• Current Assignee: Fraunhofer Gesellschaft Zur Foerderung Der Angewandten Forsching E.V., Hungarian Academy of Sciences Research Institute For Technical Physics and Materials Science
• Original Assignee: Fraunhofer Gesellschaft Zur Foerderung Der Angewandten Forsching E.V., Hungarian Academy of Sciences Research Institute For Technical Physics and Materials Science
• Inventors: Szentpali, Béla, Lukács, István Endre, Makai, János, Riesz, Ferenc, Pfitzner, Lothar
• Primary Examiner(s): Toatley, Jr., Gregory J.
• Assistant Examiner(s): Nguyen, Sang H.
• Application Number:
  US10/814,252
• Publication Number:
  US 20040263864A1
• Time in Patent Office: 950 Days
• Field of Search: 356601-622, 356/310, 250/492.1, 250/492.2, 359/212, 359/196, 359/742, 359/868
• US Class Current: 356/612
• CPC Class Codes: G01B 11/303 using photoelectric detection means
• CPC Class Codes: G01N 21/9501 Semiconductor wafers manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10

Abstract

Apparatus and process for fast, quantitative, non-contact topographic investigation of samples. Apparatus includes a light source, and a collimating concave mirror structured and arranged to produce a parallel beam and to direct the parallel beam to a sample to be investigated. A structured mask is located between the light source and the concave mirror, and an image sensor structured and arranged to receive a beam reflected from the sample and the concave mirror. Relative positions of the mask and the sensor to other elements of the apparatus are chosen to provide an essentially sharp image of the mask on the sensor. The instant abstract is neither intended to define the invention disclosed in this specification nor intended to limit the scope of the invention in any way.

Claims

1. An apparatus for fast, quantitative, non-contact topographic investigation of samples, comprising:

a light source;

a collimating concave mirror structured and arranged to produce a parallel beam and to direct the parallel beam to a sample to be investigated;

a structured mask located between said light source and said concave mirror; and

an image sensor structured and arranged to receive a beam reflected from the sample and said concave mirror, wherein relative positions of said mask and said sensor to other elements of the apparatus are chosen to provide an essentially sharp image of the mask on the sensor.

2. The apparatus in accordance with claim 1, wherein the samples comprise semiconductor wafers and other mirror-like surfaces.

3. The apparatus in accordance with claim 1, wherein said light source comprises substantially a point source.

4. The apparatus in accordance with claim 1, wherein said concave mirror comprises an off-axis parabolic mirror.

5. The apparatus in accordance with claim 1, wherein said structured mask comprises a quadratic grid.

6. The apparatus in accordance with claim 1, wherein said image sensor comprises a CCD image sensor.

7. The apparatus in accordance with claim 1, further comprising a converging lens positioned in front of said light source to be in a beam path.

8. The apparatus in accordance with claim 1, wherein said light source comprises a laser and a converging lens structured and arranged to provide a, diverging beam.

9. The apparatus in accordance with claim 1, wherein said light source comprises a laser with a built-in converging lens that is structured to provide a diverging beam.

10. The apparatus in accordance with claim 1, further comprising one of a converging and a diverging lens positioned in front of said sensor to be in a beam path.

11. The apparatus in accordance with claim 1, wherein at least one flat mirror is positioned between said light source and said concave mirror to fold an optical path.

12. The apparatus in accordance with claim 11, wherein at least one of said at least one mirror comprises a partially transmitting mirror.

13. The apparatus in accordance with claim 11, wherein at least one of the at least one mirror is a semi-transparent mirror.

14. The apparatus in accordance with claim 1, wherein at least one flat mirror is positioned between the sample and said concave mirror to fold an optical path.

15. The apparatus in accordance with claim 14, wherein at least one of said at least one mirror comprises a partially transmitting mirror.

16. The apparatus in accordance with claim 14, wherein at least one of said at least one mirror comprises a semi-transparent mirror.

17. The apparatus in accordance with claim 1, wherein at least one flat mirror is positioned between said sensor and said concave mirror to fold an optical path.

18. The apparatus in accordance with claim 17, wherein at least one of said at least one mirror comprises a partially transmitting mirror.

19. The apparatus in accordance with claim 17, wherein at least one of said at least one mirror comprises a semi-transparent mirror.

20. The apparatus in accordance with claim 1, further comprising a computer coupled to said sensor, said computer comprising an algorithm to calculate a height of a given point of the sample from a position of an image point on said sensor.

21. A process for fast, quantitative, non-contact topographic, investigation of a sample in the apparatus in accordance with claim 1.

22. The process in accordance with claim 21, further comprising calculating the height of a given point of the sample from a position of an image point on the sensor.

23. A process for fast, quantitative, non-contact topographic investigation of samples, comprising:

directing light through a structured mask onto a concave mirror;

directing collimated light to a sample to be investigated; and

receiving a beam reflected from the sample and the concave mirror; and

positioning the mask and the sensor in relation to the mirror and the sample to provide an essentially sharp image of the mask on the sensor.

24. The process in accordance with claim 23, wherein the samples comprise semiconductor wafers and other mirror-like surfaces.

25. The process in accordance with claim 23, wherein a light source is arranged to produce light.

26. The process in accordance with claim 23, wherein the concave mirror comprises an off-axis parabolic mirror.

27. The process in accordance with claim 23, wherein the structured mask comprises a quadratic grid.

28. The process in accordance with claim 23, wherein the image sensor comprises a CCD image sensor.

29. The process in accordance with claim 23, further comprising converging the beam before the mask.

30. The process in accordance with claim 23, further comprising folding an optical path between the sample and the mirror.