Portable power amplifier

• US 7,133,705 B2
• Filed: 05/23/2002
• Issued: 11/07/2006
• Est. Priority Date: 05/24/2001
• Status: Expired due to Fees

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Akatsuka, Terumoto, Utsunomiya, Keisuke, Owaki, Haruki, Kitagawa, Motoyoshi
• Primary Examiner(s): Vuong, Quochien B.
• Assistant Examiner(s): Wendell, Andrew
• Application Number:
  US10/343,966
• Publication Number:
  US 20050099228A1
• Time in Patent Office: 1,629 Days
• Field of Search: 455/572, 455/575.1, 455/575.5, 455/575.8, 455/128, 455/217, 455/346, 455/347, 361/687, 361/688, 361/709, 361/714, 361/718, 361/719, 361/720, 361/724, 361/818, 361/816, 361/753, 361/752, 361/757, 330/66, 330/68, 257/704
• US Class Current: 455/575.1
• CPC Class Codes: H01P 1/15 by semiconductor devices
• CPC Class Codes: H03F 1/30 Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters in differential amplifiers H03F3/45479
• CPC Class Codes: H03F 2200/294 the amplifier being a low noise amplifier [LNA]
• CPC Class Codes: H03F 2200/372 Noise reduction and elimination in amplifier
• CPC Class Codes: H03F 2200/429 Two or more amplifiers or one amplifier with filters for different frequency bands are coupled in parallel at the input or output
• CPC Class Codes: H05K 5/06 Hermetically-sealed casings specially adapted for small components H05K5/0095
• CPC Class Codes: H05K 7/1417 having securing means for mounting boards, plates or wiring boards H05K7/1461 takes precedence
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff
• CPC Class Codes: H05K 7/205 Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] details of PCBs relating to heat transfer H05K1/0201

Abstract

A portable power amplifier includes portable encapsulating cases, a printed board incorporated in those encapsulating cases, and a power amplifying device mounted on this printed board. An antenna switch and an antenna are provided near the power amplifying device, which is connected to those components in a pattern. This structure improves heat dissipation efficiency of the portable power amplifier.

Claims

1. A portable power amplifier comprising:

a printed board disposed in a shielding case, said shielding case including a side plate and a top plate for covering a component side of said printed board, said printed board having an end including a soldering section, and existing between said side plate and said soldering section is a space for being filled with solder via capillary action;

a power amplifying device mounted to said printed board; and

a heat resisting component disposed in a vicinity of said power amplifying device and coupled to said power amplifying device via heat conductive material.

2. The portable power amplifier according to claim 1, further comprising:

a burr extending from said side plate toward said soldering section for being connected with said soldering section.

3. The portable power amplifier according to claim 2, wherein

said top plate includes a part that is cut and bent, with said part being in contact with a top of said power amplifying device.

4. The portable power amplifier according to claim 3, further comprising:

a high frequency circuit in a vicinity of said power amplifying device,

wherein said top plate further includes

(i) another part that is cut and bent, with said another part defining a partition between said power amplifying device and said high frequency circuit, and

(ii) a hole, produced by the cutting and bending of said another part, that is on a power amplifying device side of said partition.

5. The portable power amplifier according to claim 4, further comprising:

an air intake hole in a vicinity of said soldering section, said air intake hole being in said side plate on a high frequency circuit side of said partition; and

an air outlet hole in a vicinity of said power amplifying device, said air outlet hole being in said top plate.

6. The portable power amplifier according to claim 5, wherein

said side plate is rougher than said top plate.

7. The portable power amplifier according to claim 6, wherein

said shielding case comprises a metallic outer case.

8. The portable power amplifier according to claim 2, further comprising:

a high frequency circuit in a vicinity of said power amplifying device;

a partition between said power amplifying device and said high frequency circuit;

a hole, in said top plate, on a power amplifying device side of said partition;

an air intake hole in a vicinity of said soldering section, said air intake hole being in said side plate on a high frequency circuit side of said partition; and

an air outlet hole in a vicinity of said power amplifying device, said air outlet hole being in said top plate.

9. The portable power amplifier according to claim 8, wherein

said high frequency circuit comprises a voltage controlling oscillator.

10. The portable power amplifier according to claim 2, further comprising:

a voltage controlling oscillator in a vicinity of said power amplifying device.

11. The portable power amplifier according to claim 2, wherein

said shielding case is metallic.

12. The portable power amplifier according to claim 1, wherein

said top plate includes a part that is cut and bent, with said part being in contact with a top of said power amplifying device.

13. The portable power amplifier according to claim 1, further comprising:

a high frequency circuit in a vicinity of said power amplifying device,

wherein said top plate includes

(i) a part that is cut and bent, with said part defining a partition between said power amplifying device and said high frequency circuit, and

(ii) a hole, produced by the cutting and bending of said part, that is on a power amplifying device side of said partition.

14. The portable power amplifier according to claim 13, further comprising:

an air intake hole in a vicinity of said soldering section, said air intake hole being in said side plate on a high frequency circuit side of said partition; and

an air outlet hole in a vicinity of said power amplifying device, said air outlet hole being in said top plate.

15. The portable power amplifier according to claim 13, wherein

said high frequency circuit comprises a voltage controlling oscillator.

16. The portable power amplifier according to claim 1, wherein said shielding case is metallic, and further comprising:

a filter coupled to an output terminal of said power amplifying device, said filter including chip components, with at least one of said chip components being between said output terminal and grounding, and with said grounding being near said shielding case.

17. The portable power amplifier according to claim 16, wherein

said filter includes a chip inductor coupled to said output terminal of said power amplifying device, with said chip inductor being reflow-soldered to said printed board.

18. The portable power amplifier according to claim 16, further comprising:

a pattern inductor coupled to said output terminal of said power amplifying device.

19. The portable power amplifier according to claim 1, wherein

said side plate is rougher than said top plate.

20. The portable power amplifier according to claim 2, wherein

said top plate includes a part that is in contact with a top of said power amplifying device.

21. The portable power amplifier according to claim 1, wherein

said shielding case includes a first hole and a second hole, with said power amplifying device being positioned between said first hole and said second hole so as to be cooled by air entering said first hole and exiting said second hole.

22. The portable power amplifier according to claim 1, further comprising:

an audio input device; and

an audio output device disposed above said audio input device,

wherein said power amplifying device is between said audio input device and said audio output device.

23. The portable power amplifier according to claim 1, further comprising:

a chip capacitor between a power control terminal of said power amplifying device and grounding.

24. The portable power amplifier according to claim 1, further comprising:

a chip capacitor between a power supply terminal of said power amplifying device and grounding.

25. The portable power amplifier according to claim 1, further comprising:

an impedance matching circuit coupled to an input terminal of said power amplifying device, said impedance matching circuit including a pattern inductance.

26. The portable power amplifier according to claim 1, further comprising:

an impedance matching circuit coupled to an input terminal of said power amplifying device, said impedance matching circuit including chip components that are reflow-soldered.

27. The portable power amplifier according to claim 1, further comprising:

a dc cut-off chip capacitor coupled in series to an input terminal of said power amplifying device.

28. The portable power amplifier according to claim 1, wherein said shielding case is metallic, and further comprising:

a grounded chip component, with grounding for said chip component being near said shielding case.

29. The portable power amplifier according to claim 1, wherein

said shielding case comprises an outer case.