Window pane and a method of bonding a connector to the window pane

• US 7,134,201 B2
• Filed: 11/12/2004
• Issued: 11/14/2006
• Est. Priority Date: 11/12/2004
• Status: Expired due to Fees

• Current Assignee: AGC Automotive Americas R&D, Inc (AGC, Inc.)
• Original Assignee: AGC Automotive Americas R&D, Inc (AGC, Inc.)
• Inventors: Hoepfner, Timothy P., Ackerman, Mark S.
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US10/987,469
• Publication Number:
  US 20060105589A1
• Time in Patent Office: 732 Days
• Field of Search: 298/25, 298/42, 298/46, 298/57, 298/47, 219/203
• US Class Current: 29/857
• CPC Class Codes: H01R 13/03 characterised by the material, e.g. plating, or coating materials
• CPC Class Codes: H01R 2201/26 for vehicles
• CPC Class Codes: H01R 43/0207 Ultrasonic-, H.F.-, cold- or impact welding
• CPC Class Codes: H01R 43/0242 comprising means for controlling the temperature, e.g. making use of the curie point
• CPC Class Codes: H01R 43/0263 for positioning or holding parts during soldering or welding process
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49174 Assembling terminal to elongated conductor

Abstract

A method of bonding a connector to an electrical conductor. The conductor is applied to a glass substrate and the connector is placed over the conductor. An ultrasonic welding apparatus is used to oscillate the connector relative to the conductor to bond the connector to the conductor while maintaining the temperatures of the connector and conductor below the predefined melting points and without damaging the glass substrate. In addition, an electrically conductive foil can be disposed between the connector and the conductor for ensuring electrical communication between the connector and the conductor.

Claims

1. A method of bonding an electrical connector to an electrical conductor with the connector and conductor each having predefined melting points, said method comprising the steps of:

providing a glass substrate;

depositing the electrical conductor over a portion of the glass substrate;

placing the connector over the conductor;

oscillating the connector relative to the conductor to bond the connector to the conductor while maintaining the temperatures of the connector and conductor below the predefined melting points and without damaging the glass substrate; and

heating the glass substrate to an elevated temperature before the step of oscillating the connector and oscillating the connector while the glass substrate is at the elevated temperature.

2. A method as set forth in claim 1 wherein the step of heating the glass substrate is further defined as heating the glass substrate to an elevated temperature of 100 degrees to 250 degrees Celsius.

3. A method as set forth in claim 1 further including the step of applying an electrically conductive foil layer in-between the connector and conductor before the step of oscillating the connector.

4. A method as set forth in claim 1 further including the step of applying a ceramic layer to the glass substrate.

5. A method as set forth in claim 4 wherein the step of depositing the conductor over a portion of the glass substrate is further defined as depositing the conductor onto the ceramic layer.

6. A method as set forth in claim 1 further including the step of mounting the glass substrate before the step of oscillating the connector such that the glass substrate and conductor remain stationary during the step of oscillating the connector relative to the conductor.

7. A method as set forth in claim 6 wherein the step of oscillating the connector is further defined as oscillating the connector in a direction parallel to the glass substrate.

8. A method as set forth in claim 7 wherein the step of oscillating the connector is further defined as oscillating the connector at a frequency from 20 kHz to 40 kHz.

9. A method as set forth in claim 8 wherein the step of oscillating the connector is further defined as oscillating the connector at a frequency of 20 kHz.

10. A method as set forth in claim 1 further including the step of applying pressure on the connector against the conductor during the step of oscillating the connector relative to the conductor.

11. A method as set forth in claim 10 wherein the step of applying pressure on the connector is further defined as applying a force ranging from 85 to 2,300 Newtons to the connector.

12. A method as set forth in claim 11 wherein the step of applying pressure on the connector is further defined as applying a pressure of 3 to 90 MPa depending upon a size of the connector and the force applied to the connector.

13. A method as set forth in claim 12 wherein the steps of oscillating the connector and applying pressure on the connector are preformed simultaneously for less than 1 second.

14. A method as set forth in claim 13 further including the step of applying a total energy input at an interface of the connector and the conductor ranging from 0.25 to 5 J/mm².

15. A method as set forth in claim 1 wherein each of the connector and conductor include a contact surface and wherein the step of oscillating the connector to bond the connector to the conductor is further defined as dispersing a portion of the contact surfaces of the connector and conductor to create a metallurgical bond between the connector and conductor.

16. A method as set forth in claim 15 wherein the contact surfaces of the connector and conductor are further defined as oxide layers and wherein the step of oscillating the connector to bond the connector to the conductor is further defined as dispersing a portion of the oxide layers to create a metallurgical bond between the connector and conductor.

17. A method as set forth in claim 1 further including the step of forming the glass substrate.

18. A method as set forth in claim 1 wherein the step of depositing the electrical conductor over a portion of the glass substrate is further defined as depositing a continuous uninterrupted grid of electrically conductive material over a portion of the glass substrate.

19. A method as set forth in claim 18 wherein the material is a silver paste and wherein the step of depositing the electrical conductor is further defined as depositing a continuous uninterrupted grid of silver paste onto the glass substrate.

20. A method as set forth in claim 1 wherein the step of depositing the electrical conductor over a portion of the glass substrate is further defined as depositing a continuous uninterrupted path of electrically conductive material over a portion of the glass substrate.

21. A method as set forth in claim 20 wherein the material is a silver paste and wherein the step of depositing the electrical conductor is further defined as depositing a continuous uninterrupted path of silver paste onto the glass substrate.

22. A method of bonding an electrical connector to an electrical conductor with the connector and conductor each having predefined melting points, said method comprising the steps of:

providing a glass substrate;

depositing the electrical conductor over a portion of the glass substrate;

placing the connector over the conductor;

oscillating the connector relative to the conductor to bond the connector to the conductor while maintaining the temperatures of the connector and conductor below the predefined melting points and without damaging the glass substrate; and

applying an electrically conductive foil layer in-between the connector and conductor before the step of oscillating the connector.

23. A method as set forth in claim 22 further including the steps of heating the glass substrate to an elevated temperature before the step of oscillating the connector and oscillating the connector while the glass substrate is at the elevated temperature.

24. A method as set forth in claim 23 wherein the step of heating the glass substrate is further defined as heating the glass substrate to an elevated temperature of 100 degrees to 250 degrees Celsius.

25. A method as set forth in claim 22 further including the step of applying a ceramic layer to the glass substrate.

26. A method as set forth in claim 25 wherein the step of depositing the conductor over a portion of the glass substrate is further defined as depositing the conductor onto the ceramic layer.

27. A method as set forth in claim 22 further including the step of applying pressure on the connector against the conductor during the step of oscillating the connector relative to the conductor and wherein the steps of oscillating the connector and applying pressure on the connector are preformed simultaneously for less than 1 second.

28. A method as set forth in claim 27 further including the step of applying a total energy input at an interface of the connector and the conductor ranging from 0.25 to 5 J/mm^2.