Increased efficiency in liquid and gaseous planar device cooling technology

• US 7,134,484 B2
• Filed: 12/07/2000
• Issued: 11/14/2006
• Est. Priority Date: 12/07/2000
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Yuan, Tsorng-Dih, Mok, Lawrence Shungwei
• Primary Examiner(s): Leo, Leonard R.
• Application Number:
  US09/732,117
• Publication Number:
  US 20020070006A1
• Time in Patent Office: 2,168 Days
• Field of Search: 165/80.4, 165/168, 165/170, 361/699, 361/698, 361/697, 257/714
• US Class Current: 165/80.4
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A two loop heat conversion system for high heat density planar devices in which high density heat in an area adjacent to a surface is transferred into a liquid cooling medium closed loop in a radiated heat to liquid heat transfer component positioned in contact with the surface that is connected, to a liquid to gas medium, heat exchanger in a first loop and a gas medium second loop is arranged to carry away all radiated heat from the assembly and all heat extracted from the liquid in the liquid to gas heat exchanger and exhaust it to the ambient. The radiated heat transfer component of the invention provides a transition in manufacturing that is practiced employing the planar type tools in fabrication which usually can neither be practiced manually or observed without substantial magnification.

Claims

1. A structure for the dissipation of heat radiating through a surface area of a component of said structure, the improvement comprising:

a planar shaped radiation to liquid heat transfer member positioned in contact with said surface area of said component;

said member being in contact with said surface area and having at least one serpentine shaped passageway, said serpentine passageway being a plurality of said passageways resulting from top and bottom plates each with protruding interdigitating pathway configurations; and

wherein said member includes an embedded pump joining four serpentine passageways at a pump site;

said planar shaped transfer member having a heat receiving liquid, and, a second heat transfer capability operable to transfer heat in said first heat transfer member to a gaseous medium.