Please download the dossier by clicking on the dossier button x
×

Increased efficiency in liquid and gaseous planar device cooling technology

  • US 7,134,484 B2
  • Filed: 12/07/2000
  • Issued: 11/14/2006
  • Est. Priority Date: 12/07/2000
  • Status: Expired due to Fees
First Claim
Patent Images

1. A structure for the dissipation of heat radiating through a surface area of a component of said structure, the improvement comprising:

  • a planar shaped radiation to liquid heat transfer member positioned in contact with said surface area of said component;

    said member being in contact with said surface area and having at least one serpentine shaped passageway, said serpentine passageway being a plurality of said passageways resulting from top and bottom plates each with protruding interdigitating pathway configurations; and

    wherein said member includes an embedded pump joining four serpentine passageways at a pump site;

    said planar shaped transfer member having a heat receiving liquid, and, a second heat transfer capability operable to transfer heat in said first heat transfer member to a gaseous medium.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×