Integrated process condition sensing wafer and data analysis system
First Claim
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1. An instrument for measuring a parameter, comprising:
- a substrate,a plurality of sensors carried by and distributed at positions across a surface of the substrate that individually measure the parameter at those positions,at least one electronic processing component carried by the substrate surface,electrical conductors extending across the substrate surface and connected to the plurality of sensors and said at least one electronic processing component,wherein the sensors and said at least one electronic component are positioned in cavities formed into the substrate surface, anda material filling the cavities around the sensors and said at least one electronic component.
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Abstract
A process condition measuring device and a handling system may be highly integrated with a production environment where the dimensions of the process condition measuring device are close to those of a production substrate and the handling system is similar to a substrate carrier used for production substrates. Process conditions may be measured with little disturbance to the production environment. Data may be transferred from a process condition-measuring device to a user with little or no human intervention.
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Citations
31 Claims
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1. An instrument for measuring a parameter, comprising:
- a substrate,
a plurality of sensors carried by and distributed at positions across a surface of the substrate that individually measure the parameter at those positions, at least one electronic processing component carried by the substrate surface, electrical conductors extending across the substrate surface and connected to the plurality of sensors and said at least one electronic processing component, wherein the sensors and said at least one electronic component are positioned in cavities formed into the substrate surface, and a material filling the cavities around the sensors and said at least one electronic component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
- a substrate,
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19. A measuring instrument, comprising:
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first and second substrate portions held together at a common interface, a plurality of cavities positioned between the first and second substrate portions, a plurality of grooves positioned between the first and second substrate portions and extending between the plurality of cavities, strips of electrically insulative film with electrical conductors therein positioned within the grooves, a plurality of sensors of a parameter and electronic components positioned within the cavities and electrically connected with the electrical conductors in the film strips, and wherein the first and second substrate portions are directly attached together in regions of their common interface between the grooves and cavities. - View Dependent Claims (20, 21, 22, 23)
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24. An instrument for measuring a parameter, comprising:
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a silicon wafer substrate having opposing planar surfaces, a plurality of recesses formed in said one substrate surface at positions distributed thereacross and having bottom surfaces, a plurality of sensors in the form of silicon integrated circuit die attached to the bottom surfaces of at least some of the recesses, thereby providing measurements of the parameter at positions distributed across said one substrate surface, at least one silicon electronic processing integrated circuit die attached to the bottom surface of at least one of the recesses, electrical conductors extending across said one substrate surface between at least the recesses containing the integrated circuit die, lead wires extending between and bonded to pads of the integrated circuit die and electrical conductors adjacent the recesses in which the die are attached, and a protective material filling the recesses around the integrated circuit die and extending around the lead wires. - View Dependent Claims (25, 26, 27, 28)
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29. A parameter measuring system, comprising:
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a portable measuring instrument comprising a substrate with a plurality of sensors of the parameter spatially distributed there across, a first electronics system including a processor connected with the sensors and data storage, a power storage system connected to operate the sensors and electronics system, and a coil connected to at least receive electromagnetic energy for recharging the power storage system, a docking station comprising a surface that supports the measuring instrument when inserted therein from a side, a module positioned above the supporting surface that contains a second electronics system including a processor, a flexible film carried by an underside of the module, a coil physically attached to the film and electrically driven by the second electronics system to provide electromagnetic energy to recharge the power storage system of the measuring instrument, and a mechanism carried by the underside of the module that lowers the film to rest its coil on the coil of the measuring instrument when carried by the surface in order to recharge the power storage system under control of the first and second electronics systems. - View Dependent Claims (30, 31)
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Specification