Pin fin ground plane for a patch antenna
First Claim
1. A patch antenna system comprising:
- a patch antenna that provides radio communications;
a heat dissipation member mechanically coupled to the patch antenna and including a plurality of pins that dissipate heat from a patch antenna area, the heat dissipation member providing an aggregate surface that provides a ground plane for the patch antenna, the aggregate surface including at least surfaces of the pins; and
an antenna feed line coupled to the patch antenna and providing an electrical connection between the patch antenna and further electronic circuitries,wherein the pins each include a top surface that is joined to a substrate upon which the patch antenna is disposed.
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Accused Products
Abstract
A system and method improves linearly-polarized microstrip patch antenna performance and fabrication through the incorporation of a pin fin ground plane and an integral antenna feed assembly. In one embodiment, a patch antenna system includes an antenna area with a patch antenna that provides radio communications. A heat dissipation member is coupled to the antenna area and includes a plurality of pins that provide for both the dissipation of heat from the antenna area and a ground plane for the antenna area. An antenna feed line is further coupled with the antenna patch for providing an electrical connection from the antenna patch to other electronic circuitries, such as a wireless device that may be mechanically coupled to the heat dissipation member. Heat generated during the operation of the wireless device is directed to ambient air by way of the heat dissipation member.
12 Citations
21 Claims
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1. A patch antenna system comprising:
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a patch antenna that provides radio communications; a heat dissipation member mechanically coupled to the patch antenna and including a plurality of pins that dissipate heat from a patch antenna area, the heat dissipation member providing an aggregate surface that provides a ground plane for the patch antenna, the aggregate surface including at least surfaces of the pins; and an antenna feed line coupled to the patch antenna and providing an electrical connection between the patch antenna and further electronic circuitries, wherein the pins each include a top surface that is joined to a substrate upon which the patch antenna is disposed. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. An electronic component comprising:
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a duality of patch antenna systems, each including; a patch antenna that provides radio communications; a heat dissipation member mechanically coupled to the patch antenna and including a plurality of pins that dissipate heat from an antenna area, the heat dissipation member providing an aggregate surface that provides a ground plane for the patch antenna; and an antenna feed line coupled to the patch antenna and providing an electrical connection from the patch antenna to other electronic circuitries, and a wireless device mechanically coupled to each heat dissipation member and mechanically and electrically coupled to each antenna feed line, the heat dissipation member directing heat from the device to ambient air and the antenna feed line electrically coupling the patch antenna and the wireless device. - View Dependent Claims (15, 16, 17)
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18. A method for forming a patch antenna assembly, the method comprising:
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mechanically coupling a patch antenna to a heat dissipation member having a plurality of heatsink pins and an aggregate surface that serves as a ground plane for the patch antenna; electrically coupling the patch antenna to a wireless device using an antenna feed line; and mechanically coupling the heat dissipation member to the wireless device to provide a path of heat transfer from the wireless device to ambient air. - View Dependent Claims (19, 20, 21)
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Specification