High reliability multilayer circuit substrates and methods for their formation
First Claim
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1. A method for forming a multilayer circuit substrate, comprising:
- providing a dielectric base substrate;
forming conductors on the base substrate;
forming sacrificial structures on the base substrate and conductors to define areas to be protected from deposition of a dielectric layer;
vacuum depositing a dielectric thin film on the base substrate, the conductors and the sacrificial structures; and
removing the sacrificial structures to leave a patterned deposited dielectric thin film on the conductors and the base substrate;
wherein the sacrificial structures are formed by a shadow mask deposition process; and
wherein the shadow mask deposition process utilizes a shadow mask having laser drilled via holes.
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Abstract
A multilayer circuit substrate for multi-chip modules or hybrid circuits includes a dielectric base substrate, conductors formed on the base substrate and a vacuum deposited dielectric thin film formed over the conductors and the base substrate. The vacuum deposited dielectric thin film is patterned using sacrificial structures formed by shadow mask techniques. Substrates formed in this manner enable significant increases in interconnect density and significant reduction of over-all substrate thickness.
22 Citations
24 Claims
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1. A method for forming a multilayer circuit substrate, comprising:
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providing a dielectric base substrate; forming conductors on the base substrate; forming sacrificial structures on the base substrate and conductors to define areas to be protected from deposition of a dielectric layer; vacuum depositing a dielectric thin film on the base substrate, the conductors and the sacrificial structures; and removing the sacrificial structures to leave a patterned deposited dielectric thin film on the conductors and the base substrate; wherein the sacrificial structures are formed by a shadow mask deposition process; and wherein the shadow mask deposition process utilizes a shadow mask having laser drilled via holes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for forming a multilaver circuit substrate, comprising:
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providing a dielectric base substrate; forming conductors on the base substrate; forming sacrificial structures on the base substrate and conductors to define areas to be protected from deposition of a dielectric layer; vacuum depositing a dielectric thin film on the base substrate, the conductors and the sacrificial structures; and removing the sacrificial structures to leave a patterned deposited dielectric thin film on the conductors and the base substrate; wherein the base substrate comprises a hermetic via, and wherein one of the conductors is formed in contact the hermetic via.
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13. A method for forming a multilayer circuit substrate, comprising:
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providing a dielectric base substrate; forming conductors on the base substrate; forming sacrificial structures on the base substrate and conductors to define areas to be protected from deposition of a dielectric layer; vacuum depositing a dielectric thin film on the base substrate, the conductors and the sacrificial structures; and removing the sacrificial structures to leave a patterned deposited dielectric thin film on the conductors and the base substrate; wherein the base substrate comprises a hermetic via, and wherein providing the base substrate comprises; forming a via hole in the base substrate; respectively forming multiple layers of conductive ink on sidewalls of the via hole; filling a space between said sidewalls with conductive ink; and sintering the conductive material in the via hole. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A method for forming a multilayer circuit substrate, comprising:
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providing a dielectric base substrate that has a hermetic via; forming conductors on the base substrate; forming sacrificial structures on the base substrate and conductors to define areas to be protected from deposition of a dielectric layer; vacuum depositing a dielectric thin film on the base substrate, the conductors and the sacrificial structures; removing the sacrificial structures to leave a patterned deposited dielectric thin film on the conductors and the base substrate; forming a conductor on the base substrate in contact with the hermetic via; and forming a cap over the conductor and the hermetic via. - View Dependent Claims (24)
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Specification