Heterojunction diode with reduced leakage current
First Claim
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1. A semiconductor device comprising:
- a first semiconductor region of a first conductivity type; and
a second semiconductor region of a second conductivity type, having a different band gap from the first semiconductor region and forming a heterojunction with the first semiconductor region,wherein the second semiconductor region includes a non-depletion area that is not depleted when a reverse bias is applied to the heterodiode,wherein the thickness of the non-depletion area that is not depleted when a reverse bias is applied to the heterodiode is greater than a diffusion length in the non-depletion area of carriers that act as majority carriers in the first semiconductor region.
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Abstract
An aspect of the present invention provides a semiconductor device that includes a first semiconductor region of a first conductivity type and a second semiconductor region of a second conductivity type, having a different band gap from the first semiconductor region and forming a heterojunction with the first semiconductor region.
21 Citations
22 Claims
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1. A semiconductor device comprising:
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a first semiconductor region of a first conductivity type; and a second semiconductor region of a second conductivity type, having a different band gap from the first semiconductor region and forming a heterojunction with the first semiconductor region, wherein the second semiconductor region includes a non-depletion area that is not depleted when a reverse bias is applied to the heterodiode, wherein the thickness of the non-depletion area that is not depleted when a reverse bias is applied to the heterodiode is greater than a diffusion length in the non-depletion area of carriers that act as majority carriers in the first semiconductor region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A semiconductor device comprising:
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a first semiconductor region of a first conductivity type; and a second semiconductor region of a second conductivity type, having a different band gap from the first semiconductor region and forming a heterojunction with the first semiconductor region, wherein the second semiconductor region includes a non-depletion area that is not depleted when a reverse bias is applied to the heterodiode, wherein the non-depletion area has an impurity concentration that is higher than an impurity concentration of the first semiconductor region by a critical-field-strength ratio of the first semiconductor region to the second semiconductor region.
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12. A semiconductor device comprising:
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a first semiconductor region of a first conductivity type; a second semiconductor region of a second conductivity type, having a different band gap from the first semiconductor region and forming a heterojunction with the first semiconductor region; a semiconductor base including the first semiconductor region; a hetero-semiconductor region that is in contact with a principal face of the semiconductor base and has a different band gap from the semiconductor base, at least part of the hetero-semiconductor region being the second semiconductor region; a gate insulating film formed in contact with a part of a junction between the hetero-semiconductor region and the semiconductor base; and a gate electrode insulated by the gate insulating film from the hetero-semiconductor region and the semiconductor base. - View Dependent Claims (13)
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14. A semiconductor device comprising:
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a first semiconductor region of a first conductivity type; a second semiconductor region of a second conductivity type, having a different band gap from the first semiconductor region and forming a heterojunction with the first semiconductor region; an electric field relaxation region of the second conductivity type with impurities introduced therein, formed in the first semiconductor region in contact with the heterojunction; and a punch-through preventive region of the second conductivity type formed in the first semiconductor region in contact with a junction face between the first semiconductor region and the second semiconductor region, an impurity concentration of the punch-through preventive region being equal to or greater than an impurity concentration of the electric field relaxation region. - View Dependent Claims (15, 16, 17, 18, 19)
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20. A method of manufacturing a semiconductor device, comprising:
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forming a first semiconductor region from a first semiconductor material; forming a second semiconductor region on a surface of the first semiconductor region from a second semiconductor material whose band gap is different from that of the first semiconductor material, thereby forming a heterojunction between the first semiconductor region and the second semiconductor region; and introducing impurities into a surface of the first semiconductor region over the second semiconductor region, to form an electric field relaxation region in the first semiconductor region that forms the heterojunction with the second semiconductor region. - View Dependent Claims (21, 22)
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Specification