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Photonic-electronic circuit boards

  • US 7,139,448 B2
  • Filed: 11/20/2003
  • Issued: 11/21/2006
  • Est. Priority Date: 11/20/2003
  • Status: Active Grant
First Claim
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1. A photonic-electronic multiple-layer circuit package family having electrical intra-layer and electrical inter-layer interconnection means, optical intra-layer and optical inter-layer interconnection means, plus electrical and optical escape means, and including electronic and optical transducer means both intra-layer and inter-layercharacterized by:

  • an electrical interconnected pattern layer having a selected pattern for connectivity to operational elements, and having physical gaps appropriately positioned for optical vias; and

    optical inter-layer interconnection via means positioned for unobstructed optical passage through intervening layers at said gaps in the electrical interconnect pattern.

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