Enhanced process and profile simulator algorithms
First Claim
Patent Images
1. A plasma chamber comprising:
- a chamber;
a first power supply;
a second power supply;
a gas supply and exhaust;
an inductor on top of said chamber, said inductor coupled to said first power supply;
an electrode inside said chamber, said electrode coupled to said second power supply;
a first power controller coupled to said first power supply;
a second power controller coupled to said second power supply;
a pressure controller coupled to said gas supply and exhaust; and
a computer coupled to said first power controller, said second power controller, said pressure controller,wherein said computer predictively calculates a surface profile to be created on a substrate by a plasma process sequence,wherein said computer tracks an energetic particle,wherein said computer records a plurality of ion fluxes from said energetic particle,wherein said computer solves simultaneously for a plurality of neutral fluxes, a surface chemical coverage, a surface material type, andwherein said computer computes a local etch rate and a local deposition rate from said plurality of ion fluxes, said plurality of neutral fluxes, said surface chemical coverage, said surface material type.
1 Assignment
0 Petitions
Accused Products
Abstract
A method for enhancing a process and profile simulator algorithm predicts the surface profile that a given plasma process will create. An energetic particle is first tracked. The ion fluxes produced by the energetic particle are then recorded. A local etch rate and a local deposition rate are computed from neutral fluxes, surface chemical coverage, and surface material type that are solved simultaneously.
-
Citations
11 Claims
-
1. A plasma chamber comprising:
-
a chamber; a first power supply; a second power supply; a gas supply and exhaust; an inductor on top of said chamber, said inductor coupled to said first power supply; an electrode inside said chamber, said electrode coupled to said second power supply; a first power controller coupled to said first power supply; a second power controller coupled to said second power supply; a pressure controller coupled to said gas supply and exhaust; and a computer coupled to said first power controller, said second power controller, said pressure controller, wherein said computer predictively calculates a surface profile to be created on a substrate by a plasma process sequence, wherein said computer tracks an energetic particle, wherein said computer records a plurality of ion fluxes from said energetic particle, wherein said computer solves simultaneously for a plurality of neutral fluxes, a surface chemical coverage, a surface material type, and wherein said computer computes a local etch rate and a local deposition rate from said plurality of ion fluxes, said plurality of neutral fluxes, said surface chemical coverage, said surface material type. - View Dependent Claims (2, 3, 4, 5)
-
-
6. A method for operating a plasma chamber comprising:
-
calculating a process surface profile to be created on a substrate by a plasma process sequence; and processing said substrate according to said plasma process sequence, wherein said calculating comprises; tracking an energetic particle; recording a plurality of ion fluxes from said energetic particle; solving simultaneously for a plurality of neutral fluxes, a surface chemical coverage, a surface material type; and computing a local etch rate and a local deposition rate from said plurality of ion fluxes, said plurality of neutral fluxes, said surface chemical coverage, said surface material type. - View Dependent Claims (7, 8, 9, 10)
-
-
11. A plasma chamber comprising:
-
means for calculating a process surface profile to be created on a substrate by a plasma process sequence, said means for calculating further comprising; means for tracking an energetic particle; means for recording a plurality of ion fluxes from said energetic particle; means for solving simultaneously for a plurality of neutral fluxes, a surface chemical coverage, a surface material type; and means for computing a local etch rate and a local deposition rate from said plurality of ion fluxes, said plurality of neutral fluxes, said surface chemical coverage, said surface material type; and means for processing said substrate according to said plasma process sequence.
-
Specification