Micro-electromechanical fluid ejection device having actuator mechanisms located in chamber roof structure

• US 7,140,720 B2
• Filed: 12/20/2004
• Issued: 11/28/2006
• Est. Priority Date: 06/09/1998
• Status: Expired due to Fees

• Current Assignee: Zamtec Limited (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia, McAvoy, Gregory John
• Primary Examiner(s): Do, An H.
• Application Number:
  US11/015,018
• Publication Number:
  US 20050099461A1
• Time in Patent Office: 708 Days
• Field of Search: 347/54, 347/56, 347/65, 347/20
• US Class Current: 347/54
• CPC Class Codes: B41J 2/14 Structure thereof only for on-demand ink jet heads
• CPC Class Codes: B41J 2/1433 Structure of nozzle plates
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/16 Production of nozzles
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1635 dividing the wafer into individual chips
• CPC Class Codes: B41J 2/1637 molding
• CPC Class Codes: B41J 2/1639 sacrificial molding
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1648 Production of print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/17596 Ink pumps, ink valves
• CPC Class Codes: B41J 2002/041 Electromagnetic transducer
• CPC Class Codes: B41J 2002/14346 Ejection by pressure produced by thermal deformation of ink chamber, e.g. buckling
• CPC Class Codes: B41J 2002/14435 Moving nozzle made of thermal bend detached actuator
• CPC Class Codes: B41J 2002/14475 characterised by nozzle shapes or number of orifices per chamber
• CPC Class Codes: B41J 2202/15 Moving nozzle or nozzle plate
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49156 : with selective destruction of conductive paths
• CPC Class Codes: Y10T 29/49401 : Fluid pattern dispersing device making, e.g., ink jet

Abstract

A micro-electromechanical fluid ejection device includes a substrate that defines a plurality of fluid supply channels and a plurality of chambers in fluid communication with respective fluid supply channels. A drive circuitry layer is positioned on the substrate. A plurality of roof structures is connected to the drive circuitry layer to cover respective fluid chambers. Each roof structure defines a fluid ejection port. At least one actuator is positioned in each roof structure. Each actuator is electrically connected to the drive circuitry layer to be displaceable into and out of its respective chamber to eject a drop of fluid from the fluid ejection port. At least some of the roof structures have a fixed portion that remains stationary during fluid ejection.

Claims

1. A micro-electromechanical fluid ejection device that comprises

a substrate that defines a plurality of fluid supply channels and a plurality of chambers in fluid communication with respective fluid supply channels;

a drive circuitry layer that is positioned on the substrate;

a plurality of roof structures that are connected to the drive circuitry layer to cover respective fluid chambers, each roof structure defining a fluid ejection port; and

at least one actuator that is positioned in each roof structure, each actuator being electrically connected to the drive circuitry layer to be displaceable into and out of its respective chamber to eject a drop of fluid from the fluid ejection port,

wherein at least some of the roof structures comprise a fixed portion in contact with the fluid that remains stationary during fluid ejection, each fixed portion comprising a rim that defines the fluid ejection port and support arms that extend from the drive circuitry layer to support the rim above the respective fluid inlet channel, the actuator arms being interposed between consecutive support arms.

2. A micro-electromechanical fluid ejection device as claimed in claim 1, in which a number of actuators are positioned in each roof structure about the ink ejection port.

3. A micro-electromechanical fluid ejection device as claimed in claim 2, in which each actuator includes an actuator arm that is connected to the drive circuitry layer and extends towards the fluid ejection port, a heating circuit being embedded in the actuator arm to receive the electrical signal from the drive circuitry layer, the actuator arm being of a material that has a coefficient of thermal expansion sufficient to permit the material to perform work as a result of thermal expansion and contraction, the heating circuit being positioned so that the actuator arm is subjected to differential thermal expansion and contraction to displace the actuator arm towards and away from the respective fluid supply channel.

4. A micro-electromechanical fluid ejection device as claimed in claim 3, in which each actuator arm is of polytetrafluoroethylene while each heating circuit is one of the materials in a group including gold and copper.

5. A micro-electromechanical fluid ejection device as claimed in claim 3, in which each actuator arm includes an actuating portion that is connected to the drive circuitry layer and a fluid displacement member that is positioned on the actuating portion to extend towards the fluid ejection port.

6. A micro-electromechanical fluid ejection device as claimed in claim 3, wherein the fixed portion comprises a rim that defines the fluid ejection port.

7. A micro-electromechanical fluid ejection device as claimed in claim 6, wherein the fixed portion further comprises support arms that extend from the drive circuitry layer to support the rim above the respective fluid inlet channel, the actuator arms being interposed between consecutive support arms.

8. A micro-electromechanical fluid ejection device as claimed in claim 7, wherein the actuators, the rim and the support arms are arranged so that the fluid is self sealed within the nozzle chamber.

9. A micro-electromechanical fluid ejection device as claimed in claim 1, in which the drive circuitry layer is a CMOS layer.

10. A micro-electromechanical fluid ejection device as claimed in claim 1, wherein the actuators, the rim and the support arms are arranged so that the fluid is self sealed within the nozzle chamber.