Liquid manufacturing processes for panel layer fabrication

• US 7,140,941 B2
• Filed: 02/03/2006
• Issued: 11/28/2006
• Est. Priority Date: 10/27/2000
• Status: Expired due to Term

• Current Assignee: Leidos, Inc. (Leidos Holdings, Inc.)
• Original Assignee: Science Applications International Corporation
• Inventors: Green, Albert M., Wyeth, N. Convers, George, E. Victor
• Primary Examiner(s): WILLIAMS, JOSEPH L
• Application Number:
  US11/346,219
• Publication Number:
  US 20060205311A1
• Time in Patent Office: 298 Days
• Field of Search: 445/24, 445/58, 345/211, 349/187, 438/158, 313504-506
• US Class Current: 445/24
• CPC Class Codes: A61L 2/10 Ultraviolet radiation
• CPC Class Codes: A61L 9/20 Ultraviolet radiation
• CPC Class Codes: G02B 6/0033 Means for improving the coupling-out of light from the light guide
• CPC Class Codes: G02B 6/0036 2-D arrangement of prisms, protrusions, indentations or roughened surfaces
• CPC Class Codes: G02B 6/0065 Manufacturing aspects; Material aspects
• CPC Class Codes: H01J 11/18 containing a plurality of independent closed structures for containing the gas, e.g. plasma tube array [PTA] display panels
• CPC Class Codes: H01J 65/046 the field being produced by using capacitive means around the vessel
• CPC Class Codes: H01J 9/02 Manufacture of electrodes or electrode systems
• CPC Class Codes: H01J 9/022 of cold cathodes
• CPC Class Codes: H01J 9/185 of flat panel display devices, e.g. by using spacers
• CPC Class Codes: H01J 9/241 the vessel being for a flat panel display H01J9/261 takes precedence; flat discharge lamps H01J9/248

Abstract

A method for manufacturing a light-emitting panel sandwiches a plurality of micro-components between two flexible substrates in a web configuration. Each micro-component contains a gas or gas-mixture capable of ionization when a sufficiently large voltage is supplied across the micro-component via at least two electrodes. The micro-components are disposed in sockets formed at pre-determined locations in a first dielectric substrate so that they are adjacent to electrodes imprinted in the first substrate. Dielectric layers and the conductors for acting as electrodes are formed using liquid processes or combined liquid and sheet processes, where liquid materials are applied to the surface of the underlying layer, then cured to complete the formation of layers. The assembled layers are coated with a protective coating and may include an RF shield. In one embodiment, patterning of the conductors is achieved by applying conductive ink using an ink jet process. In another embodiment, the conductors may be patterned photolithographically using a leaky optical waveguide as a contact mask.

Claims

1. A method for manufacturing a light-emitting panel comprising:

providing a first substrate, the first substrate having a plurality of first conductors formed thereon;

disposing at least one micro-component of a plurality of micro-components at each of a plurality of first locations on the first substrate corresponding to the plurality of conductors, each micro-component adapted to emit radiation in response to electrical excitation;

electrically isolating the plurality of micro-components from each other; and

depositing a conductive film at a plurality of second locations adapted to interact with the first conductors to excite one or more selected micro-components.

2. The method of claim 1, wherein each of the micro-components are coated with a phosphor material.

3. The method of claim 2, wherein the phosphor material is applied to the micro-components by immersing the micro-components in a slurry of phosphor particles, then curing a phosphor coating formed on the micro-components.

4. The method of claim 1, further comprising depositing an RF screen over the conductive film.

5. The method of claim 1, further comprising:

photolithographically patterning the conductive film to form the second conductors.

6. The method of claim 5, wherein the step of photolithographically patterning comprises selectively exposing a photosensitive material by contacting the photosensitive material with a leaky optical waveguide.

7. The method of claim 1, wherein the first substrate has a plurality of dimples formed therein, wherein one dimple is formed at each of the plurality of first locations.

8. The method of claim 7, wherein an adhesive material is applied within each of the plurality of dimples for securing the micro-component in the dimple.

9. The method of claim 1, wherein depositing a conductive film at a plurality of second locations includes deposition of a conductive liquid and curing of the conductive liquid.

10. The method of claim 9, wherein deposition of a conductive liquid includes inkjet printing.

11. The method of claim 1, wherein electrically isolating the plurality of micro-components from each other comprises deposition and curing of a liquid dielectric material.

12. The method of claim 11, wherein the liquid dielectric material includes a surfactant.

13. The method of claim 1, wherein disposing at least one micro-component of a plurality of micro-components at each of a plurality of first locations comprises applying an electrostatic charge to the first substrate to draw the micro-components to the first locations.

14. The method of claim 1, wherein disposing at least one micro-component of a plurality of micro-components at each of a plurality of first locations comprises running the first substrate through a shaker bath filled with an excess of micro-components.

15. A method for forming a flexible light emitting panel comprising:

feeding a first substrate material from a payout reel into a web coating machine;

printing a first plurality of electrodes on the first substrate material;

forming a plurality of sockets at a plurality of locations in the first substrate material;

disposing at least one micro-component in each socket of the plurality of sockets;

applying a first dielectric material over the first substrate material, the first plurality of electrodes, and at least a portion of each micro-component of the plurality of micro-components; and

printing a second plurality of electrodes over the first dielectric material.

16. The method of claim 15, further comprising applying an adhesive material within each of the plurality of sockets for securing the at least one micro-component in the socket.

17. The method of claim 15, wherein disposing at least one micro-component in each socket of the plurality of sockets comprises using electrostatic sheet transfer to place each micro-component into an appropriate socket.

18. The method of claim 15, wherein printing a second plurality of electrodes comprises inkjet printing.

19. The method of claim 15, wherein the dielectric material is a liquid and has a surface tension adapted to provide a uniform thickness across the first substrate.

20. The method of claim 19, wherein the liquid dielectric material includes a surfactant.

21. The method of claim 15, further comprising applying a second dielectric material over the over the second plurality of electrodes.

22. The method of claim 21, further comprising, applying a third plurality of electrodes over the second dielectric material.

23. The method of claim 15, wherein the micro-components are coated with a phosphor material.

24. The method of claim 23, wherein the phosphor material is applied to the micro-components by immersing the micro-components in a slurry of phosphor particles, then curing a phosphor coating formed on the micro-components.

25. The method of claim 15, wherein disposing at least one micro-component of a plurality of micro-components at each of a plurality of first locations comprises running the first substrate material through a shaker bath filled with an excess of micro-components.

26. A method for forming a flexible light emitting panel comprising:

feeding a first dielectric substrate material from a payout reel in a web coating machine;

printing a first plurality of electrodes on the first dielectric material;

forming a plurality of sockets at a plurality of locations in the first dielectric material;

disposing at least one micro-component in each socket of the plurality of sockets;

aligning a second sheet of material over the first dielectric substrate material and the first plurality of electrodes, wherein the second dielectric sheet material has a plurality of openings therein corresponding to the plurality of locations, the plurality of openings having diameters sized to allow the at least one micro-component to pass therethrough;

applying a dielectric material over at least a portion of the second sheet material; and

printing a second plurality of electrodes over the second sheet material.