Method and apparatus for assembling an array of micro-devices

• US 7,141,080 B2
• Filed: 11/15/2005
• Issued: 11/28/2006
• Est. Priority Date: 01/17/2001
• Status: Expired due to Term

• Current Assignee: Atomica Corporation (Answers.com Corporation)
• Original Assignee: Innovative Micro Technology Incorporated
• Inventors: Foster, John S., Summers, Jeffery F., Rubel, Paul J., Wallis, Andrew D., Martin, Richard T., Feierabend, Patrick E., Stocker, John W.
• Primary Examiner(s): Estrada, Michelle
• Assistant Examiner(s): Tobergte, Nicholas J.
• Application Number:
  US11/272,689
• Publication Number:
  US 20060063307A1
• Time in Patent Office: 378 Days
• Field of Search: 438/7, 438/5, 438/464, 356/508, 29/250.1, 414/935
• US Class Current: 29/25.01
• CPC Class Codes: B81C 3/008 Aspects related to assembling from individually processed components, not covered by groups B81C3/001 - B81C3/002
• CPC Class Codes: G02B 6/3512 the optical element being reflective, e.g. mirror
• CPC Class Codes: G02B 6/3518 the reflective optical element being an intrinsic part of a MEMS device, i.e. fabricated together with the MEMS device MEMS devices in general B81B; manufacture of MEM devices in general B81C; micromechanical devices controlling the direction of light G02B26/0833
• CPC Class Codes: G02B 6/353 the optical element being a shutter, baffle, beam dump or opaque element absorbers on light guide termination G02B6/243
• CPC Class Codes: G02B 6/3546 NxM switch, i.e. a regular array of switches elements of matrix type constellation
• CPC Class Codes: G02B 6/3572 Magnetic force magnetic forces controlling reflecting elements in general G02B26/085; magneto-optic devices G02F1/09
• CPC Class Codes: G02B 6/3578 Piezoelectric force piezoelectric forces controlling reflecting elements in general G02B26/0858; piezo-optic devices G02F1/0131
• CPC Class Codes: G02B 6/3584 constructional details of an associated actuator having a MEMS construction, i.e. constructed using semiconductor technology such as etching MEMS per se B81B, B81C
• CPC Class Codes: G02B 6/3586 Control or adjustment details, e.g. calibrating testing optical equipment G01M11/00

Abstract

The invention describes a method and apparatus for deploying micromachined actuators in a plane which is orthogonal to the original fabrication plane of the devices. Using batch-processing, photolithographic procedures known in the micromachined electro-mechanical system (MEMS) art, a plurality of devices is constructed on a suitable substrate. The devices are then separated one from another by sawing and dicing the original fabrication wafer. The devices are rotated into an orthogonal orientation and affixed to a second wafer. The second wafer also contains circuitry for addressing and manipulating each of the devices independently of the others. With this method and apparatus, arrays of actuators are constructed whose plane of actuation is perpendicular to the plane of the array. This invention is useful for constructing N×M fiber optic switches, which direct light from N input fibers into M output fibers.

Claims

1. An apparatus for bringing an individual die contained in a die holder adjacent to a second wafer, said apparatus comprising:

an elevation actuator to adjust the elevation of said die in said holder relative to the second wafer; and

an azimuthal actuator to adjust the azimuthal orientation of said die in said die holder relative to the second wafer, wherein the die comprises at least one MEMS device, and the elevation and azimuthal actuators orient a feature of the MEMS device with respect to a feature on the second wafer.

2. The apparatus of claim 1, further comprising:

a slab of piezoelectric material affixed to said elevation actuator and said azimuthal actuator, to impart motion to the actuators to effect the adjustment of the orientation of said die in said die holder, with respect to the second wafer.

3. The apparatus of claim 1, further comprising:

a light source for heating a contact point of said die and said second wafer.

4. The apparatus of claim 1, further comprising:

a light source impinging on a surface of said die and scattered by the die;

an optical detector which produces a signal in response to the light scattered by said die; and

logic circuitiy to control said apparatus based on the signal from the optical detector.

5. The apparatus of claim 1, further comprising a heat source for heating a contact point of said die and said second wafer.

6. The apparatus of claim 1, wherein the elevation actuator and the azimuthal actuator operate under feedback control.

7. The apparatus of claim 6, wherein the feedback control is optical feedback control.

8. The apparatus of claim 1, wherein the second wafer comprises a circuit wafer, and wherein the elevation and azimuthal actuators locate the die with respect to circuit features formed on the circuit wafer.

9. The apparatus of claim 1, wherein the second wafer comprises solder bumps for making electrical and mechanical connections with the die.

10. The apparatus of claim 1, wherein the MEMS device is a moveable micromirror, and the elevation and azimuthal actuators orient an axis of the moveable micromirrror with respect to the second wafer.

11. The apparatus of claim 10, further comprising:

an input fiber;

an input lens;

an output fiber; and

an output lens, wherein the input fiber and input lens direct a beam of light to be directed off the moveable micromirror to the output lens and the output fiber.

12. The apparatus of claim 1, further comprising:

a bonder which makes electrical connections between the die and the second wafer.

13. The apparatus of claim 1, further comprising a surface on which the second wafer is mounted, which can be articulated in at least one dimension.

14. The apparatus of claim 13, wherein the surface is an XYZ stage which can be articulated in three dimensions.

15. The apparatus of claim 1, further comprising a bonder which makes a mechanical connection between the die and the second wafer.

16. The apparatus of claim 15, wherein the mechanical connection is made using pressure between the die and the second wafer, while applying heat.

17. The apparatus of claim 16, wherein mechanical connections are made on at least two sides of the die.

18. The apparatus of claim 1, further comprising feedback electronics which control the elevation actuator and the azimuthal actuator.

19. The apparatus of claim 1, wherein the die is a portion of a row of contiguous devices.