Integrated circuit package configuration incorporating shielded circuit element structure
First Claim
1. An apparatus comprising:
- a multi-layer package substrate;
an integrated circuit die attached to the multi-layer package substrate;
an LC oscillator circuit formed largely within the integrated circuit die, having an LC tank circuit including at least one inductor formed within the multi-layer package substrate; and
an electromagnetic shielding structure formed around the at least one inductor.
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Accused Products
Abstract
An electromagnetically-shielded high-Q inductor may be fabricated within a multi-layer package substrate (MLS). The inductor is preferably constructed as a loop structure on a layer of the MLS, and a shielding structure is formed around the inductor to substantially enclose the inductor in a Faraday cage-like enclosure. The shielding structure includes a top plate formed above the inductor on another layer of the MLS, and a bottom plate formed on yet another layer of the MLS or on a layer of an integrated circuit die which is below and attached to the MLS, preferably using solder bumps. Shielding structure sidewalls may be formed by a ring of stacked vias or via channels. The inductor is preferably connected to stacked vias which provide a connection to the underlying integrated circuit die by way of additional solder bumps and cut-outs through the bottom plate of the shielding structure.
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Citations
43 Claims
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1. An apparatus comprising:
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a multi-layer package substrate; an integrated circuit die attached to the multi-layer package substrate; an LC oscillator circuit formed largely within the integrated circuit die, having an LC tank circuit including at least one inductor formed within the multi-layer package substrate; and an electromagnetic shielding structure formed around the at least one inductor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. An apparatus comprising:
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a multi-layer package substrate; at least one inductor formed on at least one layer of the multi-layer package substrate; an electromagnetic shielding structure formed at least partially around the at least one inductor; and a plurality of conductive pads for attaching an integrated circuit die to the multi-layer package substrate and for connecting the at least one inductor to the integrated circuit die; and wherein the electromagnetic shielding structure comprises an electrically conductive enclosure having at least a top plate and sidewalls formed by various layers of the multi-layer package substrate. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. An apparatus comprising:
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a multi-layer package substrate; an integrated circuit die attached to the multi-layer package substrate; at least one circuit element formed on one or more layers of the multi-layer package substrate and coupled to remaining circuitry within the integrated circuit die; and an electromagnetic shielding structure formed at least partially around the at least one circuit element; and wherein the electromagnetic shielding structure comprises an electrically conductive enclosure having a top plate, a bottom plate, and sidewalls, formed at least in part by various layers of the multi-layer package substrate. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
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37. A computer-readable medium encoding an apparatus, the encoded apparatus comprising:
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a multi-layer package substrate; at least one inductor formed on one or more layers of the multi-layer package substrate; an electromagnetic shielding structure formed at least partially around the at least one inductor; a plurality of conductive pads for attaching an integrated circuit die to the multi-layer package substrate and for connecting the at least one inductor to the integrated circuit die; and wherein the encoded electromagnetic shielding structure comprises an electrically conductive enclosure having at least a top plate and sidewalls formed by various layers of the multi-layer package substrate. - View Dependent Claims (38, 39, 40, 41, 42, 43)
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Specification