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Mounting spring elements on semiconductor devices, and wafer-level testing methodology

  • US 7,142,000 B2
  • Filed: 09/29/2003
  • Issued: 11/28/2006
  • Est. Priority Date: 11/16/1993
  • Status: Expired due to Fees
First Claim
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1. A burn-in apparatus for burning in semiconductor devices, comprising:

  • a semiconductor wafer comprising a plurality of unsingulated semiconductor devices on the wafer, each said semiconductor device comprising a plurality of resilient contact structures attached to terminals of said semiconductor device;

    a test board disposed in proximity to said semiconductor wafer, said test board comprising a plurality of contact elements for forming pressure connections with ones of said resilient contact structures without bonding to the resilient contact structures; and

    means for elevating a temperature of said semiconductor devices for a period of time.

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