Biocompatible bonding method and electronics package suitable for implantation
First Claim
1. An implantable device comprising:
- a substrate containing at least one electrically conductive feedtbrough attached to an electrically conductive routing on at least one side of said substrate;
a flexible assembly comprised of a first flexible electrically insulating substrate, a second flexible electrically insulating substrate, and at least one bond pad between said first and said second flexible electrically insulating substrates;
said first flexible electrically insulating substrate defining at least one hole that passes through said first flexible electrically insulating substrate, wherein said hole is aligned with said routing;
said second flexible electrically insulating substrate defining at least one hole that passes through said first flexible electrically insulating substrate, wherein said hole is aligned with said routing;
said at least one bond pad defining a hole therethrough, wherein said hole is aligned with said routing; and
wherein said substrate and said flexible assembly are bonded together with a deposited rivet.
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Accused Products
Abstract
The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
88 Citations
31 Claims
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1. An implantable device comprising:
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a substrate containing at least one electrically conductive feedtbrough attached to an electrically conductive routing on at least one side of said substrate; a flexible assembly comprised of a first flexible electrically insulating substrate, a second flexible electrically insulating substrate, and at least one bond pad between said first and said second flexible electrically insulating substrates; said first flexible electrically insulating substrate defining at least one hole that passes through said first flexible electrically insulating substrate, wherein said hole is aligned with said routing; said second flexible electrically insulating substrate defining at least one hole that passes through said first flexible electrically insulating substrate, wherein said hole is aligned with said routing; said at least one bond pad defining a hole therethrough, wherein said hole is aligned with said routing; and wherein said substrate and said flexible assembly are bonded together with a deposited rivet. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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Specification