Magnetic attachment method for LED light engines

• US 7,145,179 B2
• Filed: 10/12/2004
• Issued: 12/05/2006
• Est. Priority Date: 10/12/2004
• Status: Expired due to Fees

• Current Assignee: Gelcore (General Electric Company)
• Original Assignee: Gelcore (General Electric Company)
• Inventors: Petroski, James
• Primary Examiner(s): POTTER, ROY KARL
• Application Number:
  US10/962,947
• Publication Number:
  US 20060076672A1
• Time in Patent Office: 784 Days
• Field of Search: 257/81, 257/82, 257/88, 257/98, 257/706, 257/707, 438/122, 438/125
• US Class Current: 257/81
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21V 19/001 the light sources being semiconductors devices, e.g. LEDs
• CPC Class Codes: F21V 19/04 with provision for changing light source, e.g. turret auxiliary devices for cleaning, placing, or removing incandescent lamps H01K3/32, fluorescent lamps H01J9/006
• CPC Class Codes: F21V 21/096 Magnetic devices
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/75 with fins or blades having different shapes, thicknesses or spacing
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/95144 Magnetic alignment, i.e. using permanent magnetic parts in the semiconductor or solid-state body
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer
• CPC Class Codes: H05K 2201/083 Magnetic materials
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10416 Metallic blocks or heatsinks completely inserted in a PCB
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

A light engine (16) includes at least one LED (12) for generating light of one of a plurality of wavelengths. The LED (12) is disposed on the magnetic core printed circuit board (14). A heatsink (26) is disposed in thermal communication with a base (24) and the LED (12) for conducting thermal energy away from the LED (12). The light engine (16) is magnetically attached to the heatsink (26) via a magnet (50) which is attached to the heatsink (26) to create that a magnetic force between the magnetic core board (14) and the heatsink (26).

Claims

1. A light assembly comprising:

a platform having at least one LED disposed on the platform; and

a heatsink for conducting thermal energy away from platform which is joined to the heatsink via at least one magnet.

2. The light assembly according to claim 1, wherein the magnet is embedded in the heatsink.

3. The light assembly according to claim 2, wherein the platform comprises a magnetic core printed circuit board (MCPCB).

4. The light assembly according to claim 2, wherein the platform comprises a nonmagnetic material and further including a magnetic material disposed on or within the platform.

5. The light assembly according to claim 1, further including:

a thermal material disposed about a lower surface of the platform in thermal communication with a substantial portion of an upper surface of the heatsink to reduce a thermal resistance between the platform and the heatsink.

6. The light assembly according to claim 1, wherein the magnetic attachment between the platform and the heatsink is adapted for a quick detachment.

7. A method of attaching two parts in a light assembly, the method comprising:

providing a light engine which includes a platform, and at least one LED disposed on the platform; and

magnetically attaching the light engine to a thermally conductive member to conduct thermal energy away from the at least one LED.

8. The method according to claim 7, wherein the thermally conductive member comprises a heatsink.

9. The method according to claim 8, further including:

attaching a magnet to the heatsink.

10. The method according to claim 9, further including:

embedding the magnet in the heatsink.

11. The method according to claim 9, wherein the platform comprises a magnetic core printed circuit board (MCPCB).

12. The method according to claim 9, wherein the platform comprises a nonmagnetic material.

13. The method according to claim 12, further including:

attaching a magnetic material to the platform.

14. The method according to claim 8, further including:

reducing a thermal resistance between the platform and the heatsink including attaching a thermal material about a lower surface of the platform in thermal communication with a light engine and a substantial portion of an upper surface of the heatsink.

15. A light comprising:

a light engine including a platform on which LEDs are positioned;

a heatsink for conducting thermal energy away from the light engine; and

a magnetic interface disposed between the light engine and the heatsink which magnetic interface creates a magnetic force which keeps the light engine and the heatsink detachably attached to one another.